Information
30 Namdongdong-ro 153beon-gil, Namdong-gu, Incheon, South Korea
+82 32-821-8271
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Overview
- Summary
- YMT Co., Ltd. is a company that independently develops and sells chemical materials essential for PCB and semiconductor manufacturing processes. Its products are recognized for their value in various advanced industries, including mobile, electric vehicles, wearable devices, and biotechnology. The company has successfully entered the PCB final surface treatment and copper plating markets, previously dominated by foreign products, with its proprietary technologies, establishing itself as a global chemical material specialist.YMT Co., Ltd. is a company that independently develops and sells chemical materials essential for PCB and semiconductor manufacturing processes. Its products are recognized for their value in various advanced industries, including mobile, electric vehicles, wearable devices, and biotechnology. The company has successfully entered the PCB final surface treatment and copper plating markets, previously dominated by foreign products, with its proprietary technologies, establishing itself as a global chemical material specialist.
- Key Products/Technologies
- PCB Final Surface Treatment Technology: Possesses Soft ENIG and ENEPIG process technologies for gold plating used in Flexible PCBs. Notably, it commercialized electroless nickel-palladium-gold plating (ENEPIG) for HDI (High-Density Interconnect) substrates for the first time in Korea, securing a technological advantage.PCB Final Surface Treatment Technology: Possesses Soft ENIG and ENEPIG process technologies for gold plating used in Flexible PCBs. Notably, it commercialized electroless nickel-palladium-gold plating (ENEPIG) for HDI (High-Density Interconnect) substrates for the first time in Korea, securing a technological advantage.
- Copper Plating Chemicals: Develops and supplies chemical solutions for electroless copper plating and electronic copper plating. Demonstrates proprietary technology in the critical copper plating stage of PCB manufacturing.Copper Plating Chemicals: Develops and supplies chemical solutions for electroless copper plating and electronic copper plating. Demonstrates proprietary technology in the critical copper plating stage of PCB manufacturing.
- Circuit Process Chemicals: Offers a diverse range of chemical products for PCB circuit formation and cleaning processes, including DR Series, SE Series, Gold Recover, and Cleaner.Circuit Process Chemicals: Offers a diverse range of chemical products for PCB circuit formation and cleaning processes, including DR Series, SE Series, Gold Recover, and Cleaner.
- Semiconductor Process Chemicals/Packages: Provides specialized chemical solutions for semiconductor manufacturing and packaging processes, such as gold surface cleaning, Cu Etchant, Gold Etchant, and Post dry etch cleaner.Semiconductor Process Chemicals/Packages: Provides specialized chemical solutions for semiconductor manufacturing and packaging processes, such as gold surface cleaning, Cu Etchant, Gold Etchant, and Post dry etch cleaner.
- Electronic Materials: Holds ultra-thin copper foil (Nanotus) technology that combines with ABF, a core material for semiconductor substrates. Develops and supplies various electronic materials including EMI shielding, Coverlay Film, Edge coating, and Dry Film.Electronic Materials: Holds ultra-thin copper foil (Nanotus) technology that combines with ABF, a core material for semiconductor substrates. Develops and supplies various electronic materials including EMI shielding, Coverlay Film, Edge coating, and Dry Film.
- Glass Substrate (TGV) Plating Technology: Demonstrates mass production competitiveness in Through-Glass Via (TGV) plating and filling processes, a key component for next-generation semiconductor packaging. Independently developed essential electro copper plating chemicals for glass substrate manufacturing, actively entering this market.Glass Substrate (TGV) Plating Technology: Demonstrates mass production competitiveness in Through-Glass Via (TGV) plating and filling processes, a key component for next-generation semiconductor packaging. Independently developed essential electro copper plating chemicals for glass substrate manufacturing, actively entering this market.
- Auto Analyzer: Developed a system for automatic analysis and supply of chemical solutions used in PCB and electronic component manufacturing processes. Provides solutions that contribute to improved process efficiency and quality stability.Auto Analyzer: Developed a system for automatic analysis and supply of chemical solutions used in PCB and electronic component manufacturing processes. Provides solutions that contribute to improved process efficiency and quality stability.
- Core Advantages
- Proprietary Technology Development Capability: Possesses technology that successfully entered the Korean and Greater China electronic chemical material markets, previously monopolized by foreign companies from Germany, Japan, and the USA, with purely proprietary technologies [DB, 1, 6, 11].Proprietary Technology Development Capability: Possesses technology that successfully entered the Korean and Greater China electronic chemical material markets, previously monopolized by foreign companies from Germany, Japan, and the USA, with purely proprietary technologies [DB, 1, 6, 11].
- Continuous R&D Investment: Characterized as an R&D-driven company with consistent R&D investments accounting for approximately 10% of its sales and a high ratio of research personnel, around 30% of its total workforce.Continuous R&D Investment: Characterized as an R&D-driven company with consistent R&D investments accounting for approximately 10% of its sales and a high ratio of research personnel, around 30% of its total workforce.
- Global Market Expansion and Network: Supplies products to global PCB manufacturers in Korea, China, and Taiwan, and operates overseas subsidiaries in China, Vietnam, and Taiwan, establishing a robust global network [DB, 1, 6, 9, 11, 15].Global Market Expansion and Network: Supplies products to global PCB manufacturers in Korea, China, and Taiwan, and operates overseas subsidiaries in China, Vietnam, and Taiwan, establishing a robust global network [DB, 1, 6, 9, 11, 15].
- Vertical Integration Structure: Maintains a vertically integrated structure through its subsidiary YPT, which possesses plating infrastructure and permits, directly performing plating processes.Vertical Integration Structure: Maintains a vertically integrated structure through its subsidiary YPT, which possesses plating infrastructure and permits, directly performing plating processes.
- New Market Preemption and Technological Leadership: Positioned to lead future markets by developing glass substrate (TGV) plating technology, a core for next-generation semiconductor packaging, and securing mass production competitiveness.New Market Preemption and Technological Leadership: Positioned to lead future markets by developing glass substrate (TGV) plating technology, a core for next-generation semiconductor packaging, and securing mass production competitiveness.
- Customer-Centric Trust Management: Pursues sustainable growth by maintaining high reliability from the market, customers, and employees under the slogan 'Your Most Trustworthy'.Customer-Centric Trust Management: Pursues sustainable growth by maintaining high reliability from the market, customers, and employees under the slogan 'Your Most Trustworthy'.
- First Commercialization in Korea: Achieved technological milestones such as the first commercialization of electroless nickel-palladium-gold plating (ENEPIG) for HDI substrates in Korea, securing a reference with VGT for Nvidia.First Commercialization in Korea: Achieved technological milestones such as the first commercialization of electroless nickel-palladium-gold plating (ENEPIG) for HDI substrates in Korea, securing a reference with VGT for Nvidia.
- Target Industrie
- PCB (Printed Circuit Board) Manufacturing Industry: Supplies essential chemical materials for overall manufacturing processes, including final surface treatment, copper plating, and circuit processes for PCBs [DB, 2, 11, 16].PCB (Printed Circuit Board) Manufacturing Industry: Supplies essential chemical materials for overall manufacturing processes, including final surface treatment, copper plating, and circuit processes for PCBs [DB, 2, 11, 16].
- Semiconductor Manufacturing Industry: Applied in critical stages of semiconductor production, such as plating materials for semiconductor packaging, glass substrate (TGV) plating, and process chemicals [DB, 2, 3, 9, 11, 14, 16, 20, 26].Semiconductor Manufacturing Industry: Applied in critical stages of semiconductor production, such as plating materials for semiconductor packaging, glass substrate (TGV) plating, and process chemicals [DB, 2, 3, 9, 11, 14, 16, 20, 26].
- Display Manufacturing Industry: Provides chemical materials used in the manufacturing of electronic components for displays.Display Manufacturing Industry: Provides chemical materials used in the manufacturing of electronic components for displays.
- Mobile Device Industry: Application of PCB and semiconductor materials in high-end electronic devices like smartphones, tablet PCs, camera modules, and wireless charging modules.Mobile Device Industry: Application of PCB and semiconductor materials in high-end electronic devices like smartphones, tablet PCs, camera modules, and wireless charging modules.
- Electric Vehicle and Automotive Electronics Industry: Contributes to future mobility sectors with components for automotive electronic boards and materials for EV batteries.Electric Vehicle and Automotive Electronics Industry: Contributes to future mobility sectors with components for automotive electronic boards and materials for EV batteries.
- Wearable Device Industry: Supplies necessary materials for manufacturing advanced wearable devices such as smartwatches and smart glasses.Wearable Device Industry: Supplies necessary materials for manufacturing advanced wearable devices such as smartwatches and smart glasses.
- Bio and Medical Industry: Provides materials utilized in biotechnology and medical products, including blood glucose monitoring device coupons and biosensors.Bio and Medical Industry: Provides materials utilized in biotechnology and medical products, including blood glucose monitoring device coupons and biosensors.
- High-Performance Computing (HPC) and AI Server Industry: Supplies chemical materials required for key processes of AI graphics substrates and high-density substrates for AI servers.High-Performance Computing (HPC) and AI Server Industry: Supplies chemical materials required for key processes of AI graphics substrates and high-density substrates for AI servers.
- Major Markets
- South Korea, China, Taiwan, VietnamSouth Korea, China, Taiwan, Vietnam
- Germany (competitive market)Germany (competitive market)
- United StatesUnited States
- Certifications/Patents
- Possession of patents related to palladium plating.Possession of patents related to palladium plating.
- Development of the world's first electroless ultra-thin copper foil technology.Development of the world's first electroless ultra-thin copper foil technology.
- Possession of core glass substrate technology.Possession of core glass substrate technology.
- First in Korea to develop and launch Soft ENIG, a gold plating technology for Flexible PCBs.First in Korea to develop and launch Soft ENIG, a gold plating technology for Flexible PCBs.
- First in Korea to commercialize electroless nickel-palladium-gold plating (ENEPIG) for HDI (High-Density Interconnect) substrates.First in Korea to commercialize electroless nickel-palladium-gold plating (ENEPIG) for HDI (High-Density Interconnect) substrates.
- Demonstrated mass production competitiveness in Through-Glass Via (TGV) plating and filling processes for glass substrates.Demonstrated mass production competitiveness in Through-Glass Via (TGV) plating and filling processes for glass substrates.
- Strategic alliance with DuPont for joint entry into FCBGA FCCS advanced packaging.Strategic alliance with DuPont for joint entry into FCBGA FCCS advanced packaging.
Introduction
Location
30 Namdongdong-ro 153beon-gil, Namdong-gu, Incheon, South Korea
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