WIN PAC, The Republic of Korea - Komachine Supplier Profile and Product List

- Winpac is a specialized semiconductor back-end (OSAT) total solution provider, offering semiconductor packaging and testing services. The company operates in both memory and system semiconductor sectors, with strengths in high-density packaging technologies and turn-key solutions. Established in 2002, it has accumulated technological capabilities and know-how, focusing on securing future growth engines through market expansion. Winpac is a dedicated semiconductor post-processing expert contributing to enhancing customer product competitiveness.Winpac is a specialized semiconductor back-end (OSAT) total solution provider, offering semiconductor packaging and testing services. The company operates in both memory and system semiconductor sectors, with strengths in high-density packaging technologies and turn-key solutions. Established in 2002, it has accumulated technological capabilities and know-how, focusing on securing future growth engines through market expansion. Winpac is a dedicated semiconductor post-processing expert contributing to enhancing customer product competitiveness.
- Key product groups include semiconductor packaging products such as FBGA (Fine Pitch Ball Grid Array), LGA (Land Grid Array), POP (Package on Package), Flip Chip, QFP (Quad Flat Package), and QFN (Quad Flat No Lead Package).Key product groups include semiconductor packaging products such as FBGA (Fine Pitch Ball Grid Array), LGA (Land Grid Array), POP (Package on Package), Flip Chip, QFP (Quad Flat Package), and QFN (Quad Flat No Lead Package).
- The company also provides packaging services for application products like Humidity Sensor Packages, Proximity / Ambient Light Sensor Packages, UFD (USB Flash Drive), and SSD (Solid State Drive).The company also provides packaging services for application products like Humidity Sensor Packages, Proximity / Ambient Light Sensor Packages, UFD (USB Flash Drive), and SSD (Solid State Drive).
- Semiconductor packaging technology is a critical back-end process that protects the semiconductor chip and connects it electrically to the mainboard.Semiconductor packaging technology is a critical back-end process that protects the semiconductor chip and connects it electrically to the mainboard.
- Winpac possesses advanced high-density packaging technologies like MCP (Multi Chip Package) and PoP (Package on Package), involving vertical stacking of multiple chips.Winpac possesses advanced high-density packaging technologies like MCP (Multi Chip Package) and PoP (Package on Package), involving vertical stacking of multiple chips.
- The application of MUF (Molded Underfill) method during the development of F78 DDR4 Flip Chip packages ensures stability for high-performance DRAM and DDR series packaging.The application of MUF (Molded Underfill) method during the development of F78 DDR4 Flip Chip packages ensures stability for high-performance DRAM and DDR series packaging.
- Focused on developing high-end semiconductor packaging technologies, including 18 Stack stacking technology, wafer thin grinding technology, design technology, and various MCP bonding technologies.Focused on developing high-end semiconductor packaging technologies, including 18 Stack stacking technology, wafer thin grinding technology, design technology, and various MCP bonding technologies.
- Semiconductor testing services encompass both wafer testing conducted at the wafer stage and final testing performed on the packaged product.Semiconductor testing services encompass both wafer testing conducted at the wafer stage and final testing performed on the packaged product.
- The company holds technological capabilities to enhance product yield and reliability through the utilization of high-performance testing equipment.The company holds technological capabilities to enhance product yield and reliability through the utilization of high-performance testing equipment.
- Winpac's ability to provide total semiconductor back-end solutions is a core competitive advantage, offering turn-key services that integrate packaging and testing processes, thereby improving customer supply chain efficiency and reducing lead times.Winpac's ability to provide total semiconductor back-end solutions is a core competitive advantage, offering turn-key services that integrate packaging and testing processes, thereby improving customer supply chain efficiency and reducing lead times.
- Successful expansion of business areas from memory semiconductors (DRAM, NAND Flash) to system semiconductor packaging and testing, demonstrating flexible market responsiveness and diversification of its business portfolio.Successful expansion of business areas from memory semiconductors (DRAM, NAND Flash) to system semiconductor packaging and testing, demonstrating flexible market responsiveness and diversification of its business portfolio.
- Securing high-density and next-generation packaging technologies such as MCP, PoP, Flip Chip, and MUF methods, enabling responsiveness to high-performance, miniaturized products like smartphones, tablets, AI, and cloud server HBM.Securing high-density and next-generation packaging technologies such as MCP, PoP, Flip Chip, and MUF methods, enabling responsiveness to high-performance, miniaturized products like smartphones, tablets, AI, and cloud server HBM.
- Maintaining a long-term cooperative relationship with SK Hynix, a major client, and securing Samsung Electronics as a new customer, thereby strengthening business stability through diversification of key clients.Maintaining a long-term cooperative relationship with SK Hynix, a major client, and securing Samsung Electronics as a new customer, thereby strengthening business stability through diversification of key clients.
- Continuous focus on developing process technologies to ensure yield and compatibility of packaging and testing products, leading to enhanced customer trust through the supply of high-quality products.Continuous focus on developing process technologies to ensure yield and compatibility of packaging and testing products, leading to enhanced customer trust through the supply of high-quality products.
- Possession of ISO 14001 environmental management system certification and engagement in ESG management activities, including optimizing energy use and managing wastewater treatment facilities, establishing an image as a responsible and sustainable company.Possession of ISO 14001 environmental management system certification and engagement in ESG management activities, including optimizing energy use and managing wastewater treatment facilities, establishing an image as a responsible and sustainable company.
- IT device industry requiring miniaturization and high performance, such as smartphones and tablets.IT device industry requiring miniaturization and high performance, such as smartphones and tablets.
- Memory semiconductor industry (DRAM, NAND Flash).Memory semiconductor industry (DRAM, NAND Flash).
- System semiconductor industry (non-memory semiconductors).System semiconductor industry (non-memory semiconductors).
- Automotive electronics semiconductor sector.Automotive electronics semiconductor sector.
- High-Bandwidth Memory (HBM) sector for AI and cloud servers.High-Bandwidth Memory (HBM) sector for AI and cloud servers.
- South Korea (domestic market), Other Asian countries (high export proportion)South Korea (domestic market), Other Asian countries (high export proportion)
- Holds a total of 15 patents (as of November 2025).Holds a total of 15 patents (as of November 2025).
- Possesses patent technology related to ring frames for partial wafers, reducing work time and preventing defects.Possesses patent technology related to ring frames for partial wafers, reducing work time and preventing defects.
- Holds ISO 14001:2004 certification for Environmental Management System.Holds ISO 14001:2004 certification for Environmental Management System.
- AEC-Q100 certification (ongoing development of Automotive-grade 8x10.5 Body 162B NAND MCP package).AEC-Q100 certification (ongoing development of Automotive-grade 8x10.5 Body 162B NAND MCP package).
- Certified as an excellent job creation company in 2018.Certified as an excellent job creation company in 2018.
- Awarded the Yongin City Industrial Peace Award in September 2019.Awarded the Yongin City Industrial Peace Award in September 2019.
- Received the Presidential Commendation for Job Creation in December 2019.Received the Presidential Commendation for Job Creation in December 2019.
- Awarded the Minister of Trade, Industry and Energy Award in January 2020 (for contributions to nano-convergence technology workforce development).Awarded the Minister of Trade, Industry and Energy Award in January 2020 (for contributions to nano-convergence technology workforce development).
- Received the '$50 Million Export Tower' award in 2012.Received the '$50 Million Export Tower' award in 2012.