Vision Semicon Co., Ltd. is a specialized company established in 1997, focusing on the development and manufacturing of plasma cleaners, oven equipment, and process automation systems for semiconductor manufacturing processes. The company holds a leading position in both domestic and international markets, driven by its unique technology in semiconductor post-processing equipment. Recently, it has expanded its business into new areas such as the 'Storant' unmanned robot cafe system, enhancing its global competitiveness. The company is dedicated to providing the best value and services to its customers through continuous R&D investment and field-oriented technological innovation.VisionSemiconCo.,Ltd.isaspecializedcompanyestablishedin1997,focusingonthedevelopmentandmanufacturingofplasmacleaners,ovenequipment,andprocessautomationsystemsforsemiconductormanufacturingprocesses.Thecompanyholdsaleadingpositioninbothdomesticandinternationalmarkets,drivenbyitsuniquetechnologyinsemiconductorpost-processingequipment.Recently,ithasexpandeditsbusinessintonewareassuchasthe'Storant'unmannedrobotcafesystem,enhancingitsglobalcompetitiveness.ThecompanyisdedicatedtoprovidingthebestvalueandservicestoitscustomersthroughcontinuousR&Dinvestmentandfield-orientedtechnologicalinnovation.
Key Products/TechnologiesKeyProducts/Technologies
**Plasma Cleaner**: A core equipment for removing microscopic contaminants from wafer and substrate surfaces in semiconductor packaging processes. It offers a diverse lineup of Direct Plasma models (VSP-88D, VSP-88D Pro, VSP-88D Pro1, VSP-88D Pro+, VSP-88D-T, VSP-88D Pro1 Hybrid, VSP-88D Neo1, VSP-88D Pro+L300, VSP-88D+, VSP-88D-HT, VSP-88D-01, VSP-88D PP2, VSP-88H, VSPI-88H). Development of specialized models such as the pick-and-place strip plasma for warpage materials (VSP-88D PP2), 2-tier strip plasma for 300MM PCBs (VSP-88D Pro+L300), and plasma exclusively for JEDEC-TRAY (VSP-88D-T). High cleaning efficiency and uniformity, with advanced automated handling technology for warped PCB substrates, maximizing process stability.**PlasmaCleaner**:Acoreequipmentforremovingmicroscopiccontaminantsfromwaferandsubstratesurfacesinsemiconductorpackagingprocesses.ItoffersadiverselineupofDirectPlasmamodels(VSP-88D,VSP-88DPro,VSP-88DPro1,VSP-88DPro+,VSP-88D-T,VSP-88DPro1Hybrid,VSP-88DNeo1,VSP-88DPro+L300,VSP-88D+,VSP-88D-HT,VSP-88D-01,VSP-88DPP2,VSP-88H,VSPI-88H).Developmentofspecializedmodelssuchasthepick-and-placestripplasmaforwarpagematerials(VSP-88DPP2),2-tierstripplasmafor300MMPCBs(VSP-88DPro+L300),andplasmaexclusivelyforJEDEC-TRAY(VSP-88D-T).Highcleaningefficiencyanduniformity,withadvancedautomatedhandlingtechnologyforwarpedPCBsubstrates,maximizingprocessstability.
**Oven Equipment**: Plays a crucial role in the stable curing and drying of films and epoxy during the die bonding process of semiconductor chips. Provides various types of industrial oven facilities, including general ovens, pressurized ovens, unmanned automated ovens, clean ovens, and vacuum ovens. Contributes to semiconductor quality improvement through excellent temperature control capabilities, optimal temperature uniformity, and individual chamber control functions.**OvenEquipment**:Playsacrucialroleinthestablecuringanddryingoffilmsandepoxyduringthediebondingprocessofsemiconductorchips.Providesvarioustypesofindustrialovenfacilities,includinggeneralovens,pressurizedovens,unmannedautomatedovens,cleanovens,andvacuumovens.Contributestosemiconductorqualityimprovementthroughexcellenttemperaturecontrolcapabilities,optimaltemperatureuniformity,andindividualchambercontrolfunctions.
**Cooperating Robots and Process Automation Equipment**: Design of robot systems for fast and efficient operations. Development and supply of magnetic-type and laser scanner-type unmanned electric vehicles (AGV & LGV) capable of interlocking with mounted robots. Securing process automation technology with the goal of implementing unmanned semiconductor packaging systems.**CooperatingRobotsandProcessAutomationEquipment**:Designofrobotsystemsforfastandefficientoperations.Developmentandsupplyofmagnetic-typeandlaserscanner-typeunmannedelectricvehicles(AGV&LGV)capableofinterlockingwithmountedrobots.Securingprocessautomationtechnologywiththegoalofimplementingunmannedsemiconductorpackagingsystems.
**Other Products**: Expansion into new business areas utilizing automation technology, such as the 'Storant' unmanned robot cafe system and anti-droplet tables.**OtherProducts**:Expansionintonewbusinessareasutilizingautomationtechnology,suchasthe'Storant'unmannedrobotcafesystemandanti-droplettables.
Core AdvantagesCoreAdvantages
**28 Years of Specialization in Semiconductor Equipment**: A singular focus on developing and manufacturing semiconductor equipment since its establishment in 1997. Securing a unique recognition in the field of semiconductor post-processing equipment solutions.**28YearsofSpecializationinSemiconductorEquipment**:Asingularfocusondevelopingandmanufacturingsemiconductorequipmentsinceitsestablishmentin1997.Securingauniquerecognitioninthefieldofsemiconductorpost-processingequipmentsolutions.
**Global Leading Technology**: Possessing technology that secures global market share of 1st and 2nd place in the field of plasma cleaning equipment for semiconductor packaging. Verification of superior product performance from leading domestic and international customers.**GlobalLeadingTechnology**:Possessingtechnologythatsecuresglobalmarketshareof1stand2ndplaceinthefieldofplasmacleaningequipmentforsemiconductorpackaging.Verificationofsuperiorproductperformancefromleadingdomesticandinternationalcustomers.
**Proactive R&D Investment and Innovation**: Over 30-40% of its workforce dedicated to research and development, striving for continuous technological advancement and quality improvement. Strengthening technological competitiveness through a patent portfolio of 44 patents.**ProactiveR&DInvestmentandInnovation**:Over30-40%ofitsworkforcededicatedtoresearchanddevelopment,strivingforcontinuoustechnologicaladvancementandqualityimprovement.Strengtheningtechnologicalcompetitivenessthroughapatentportfolioof44patents.
**Field-Oriented Differentiated Product Development**: Equipment design prioritizing operator convenience and field applicability. Providing customized solutions optimized for customer production lines, including technology for handling warped PCB substrates, compact design, and easy maintenance.**Field-OrientedDifferentiatedProductDevelopment**:Equipmentdesignprioritizingoperatorconvenienceandfieldapplicability.Providingcustomizedsolutionsoptimizedforcustomerproductionlines,includingtechnologyforhandlingwarpedPCBsubstrates,compactdesign,andeasymaintenance.
**Diversified Business Expansion**: Successful pursuit of new businesses tailored for the untact era, such as the 'Storant' unmanned robot cafe and anti-droplet tables, based on semiconductor equipment technology. This strategy secures new growth engines and diversifies the business portfolio.**DiversifiedBusinessExpansion**:Successfulpursuitofnewbusinessestailoredfortheuntactera,suchasthe'Storant'unmannedrobotcafeandanti-droplettables,basedonsemiconductorequipmenttechnology.Thisstrategysecuresnewgrowthenginesanddiversifiesthebusinessportfolio.
**Robust Global Market Network**: Supplying equipment to over 15 countries worldwide, including the US, China, Japan, and Taiwan, securing dominant market share in Asia, Europe, and North/South American markets. Global competitiveness proven by receiving export awards of $10 million in 2012, $20 million in 2018, and $30 million in 2022.**RobustGlobalMarketNetwork**:Supplyingequipmenttoover15countriesworldwide,includingtheUS,China,Japan,andTaiwan,securingdominantmarketshareinAsia,Europe,andNorth/SouthAmericanmarkets.Globalcompetitivenessprovenbyreceivingexportawardsof$10millionin2012,$20millionin2018,and$30millionin2022.
Target IndustrieTargetIndustrie
Semiconductor Manufacturing Industry: Across all front-end and back-end processes including wafer fabrication, die bonding, wire bonding, and moldingSemiconductorManufacturingIndustry:Acrossallfront-endandback-endprocessesincludingwaferfabrication,diebonding,wirebonding,andmolding
Electronics Manufacturing Industry: PCB substrate cleaning and heat treatment processesElectronicsManufacturingIndustry:PCBsubstratecleaningandheattreatmentprocesses
Factory Automation Industry: Establishment of unmanned automation systems for semiconductor production linesFactoryAutomationIndustry:Establishmentofunmannedautomationsystemsforsemiconductorproductionlines
Service Robot Industry: Development and operation of unmanned robot cafe systemsServiceRobotIndustry:Developmentandoperationofunmannedrobotcafesystems
Healthcare and Quarantine Industry: Providing untact solutions such as anti-droplet tablesHealthcareandQuarantineIndustry:Providinguntactsolutionssuchasanti-droplettables
Major MarketsMajorMarkets
Arab region (planned export for unmanned robot cafes)Arabregion(plannedexportforunmannedrobotcafes)
South Korea, China, Japan, Taiwan, Hong Kong, Singapore, MalaysiaSouthKorea,China,Japan,Taiwan,HongKong,Singapore,Malaysia
Europe (included in over 15 export countries)Europe(includedinover15exportcountries)
United StatesUnitedStates
South America (included in over 15 export countries)SouthAmerica(includedinover15exportcountries)
Certifications/PatentsCertifications/Patents
Possession of 44 patents.Possessionof44patents.
Awarded the Korea Intellectual Property Office President's Award at the 2022 Korea Intellectual Property Exhibition (related to anti-droplet tables).AwardedtheKoreaIntellectualPropertyOfficePresident'sAwardatthe2022KoreaIntellectualPropertyExhibition(relatedtoanti-droplettables).
Securing proprietary technology for semiconductor plasma cleaning systems.Securingproprietarytechnologyforsemiconductorplasmacleaningsystems.
Advanced automated handling technology capable of processing even warped PCB substrates.AdvancedautomatedhandlingtechnologycapableofprocessingevenwarpedPCBsubstrates.
Precision temperature control and uniformity maintenance technology for semiconductor heat treatment ovens.Precisiontemperaturecontrolanduniformitymaintenancetechnologyforsemiconductorheattreatmentovens.
Awarded the Minister of Employment and Labor Award (Master Craftsman of the Month #67, CEO Yoon Tong-seop).AwardedtheMinisterofEmploymentandLaborAward(MasterCraftsmanoftheMonth#67,CEOYoonTong-seop).