Information
7 Majung-ro, Seo-gu, Incheon, South Korea
+82 32-563-5981
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Overview
- Summary
- TRUSS Co., Ltd. is a specialized company manufacturing electrical and electronic industrial tapes with EMI/EMC shielding and absorbing, and thermal management functions since 1995. It supplies E-Bonding Tape and absorbers for IT devices like mobile phones, tablet PCs, and TVs, focusing on developing products for future electric vehicles and secondary batteries.TRUSS Co., Ltd. is a specialized company manufacturing electrical and electronic industrial tapes with EMI/EMC shielding and absorbing, and thermal management functions since 1995. It supplies E-Bonding Tape and absorbers for IT devices like mobile phones, tablet PCs, and TVs, focusing on developing products for future electric vehicles and secondary batteries.
- Key Products/Technologies
- Conductive Tape for EMI Shielding features excellent electrical conductivity in XYZ directions, a thin and lightweight structure, and superior durability. It finds diverse applications in FPC/PCB bonding and grounding, display EMI shielding, and metal-to-metal grounding.Conductive Tape for EMI Shielding features excellent electrical conductivity in XYZ directions, a thin and lightweight structure, and superior durability. It finds diverse applications in FPC/PCB bonding and grounding, display EMI shielding, and metal-to-metal grounding.
- EMI Absorber products achieve powerful electromagnetic wave absorption and magnetic field shielding performance through optimal electromagnetic properties and ultra-high permeability tailored to specific uses. The company enhanced its production capabilities by establishing a high-performance roll-type EMI absorber production line in 2020.EMI Absorber products achieve powerful electromagnetic wave absorption and magnetic field shielding performance through optimal electromagnetic properties and ultra-high permeability tailored to specific uses. The company enhanced its production capabilities by establishing a high-performance roll-type EMI absorber production line in 2020.
- TIM (Thermal Interface Material) is a crucial component that effectively dissipates heat in specific areas of semiconductors and electronic devices, optimizing their operational efficiency.TIM (Thermal Interface Material) is a crucial component that effectively dissipates heat in specific areas of semiconductors and electronic devices, optimizing their operational efficiency.
- E-Bonding Tape offers superior initial tack and wettability, providing a high-quality adhesive solution free from contamination and residue. It delivers excellent adhesion to various materials such as metal, glass, and plastics, along with superior heat resistance, chemical resistance, and processability. The company possesses the capability to develop products with excellent electrical insulation, dimensional stability, and heat resistance using PI substrates.E-Bonding Tape offers superior initial tack and wettability, providing a high-quality adhesive solution free from contamination and residue. It delivers excellent adhesion to various materials such as metal, glass, and plastics, along with superior heat resistance, chemical resistance, and processability. The company possesses the capability to develop products with excellent electrical insulation, dimensional stability, and heat resistance using PI substrates.
- Release Tape includes thermal release tapes that maintain strong adhesion at room temperature but are easily removable with heat, and UV release tapes that peel off without contamination after UV irradiation. These functional tapes are utilized for temporary fixing in electronic component manufacturing processes, as well as cutting and dicing applications.Release Tape includes thermal release tapes that maintain strong adhesion at room temperature but are easily removable with heat, and UV release tapes that peel off without contamination after UV irradiation. These functional tapes are utilized for temporary fixing in electronic component manufacturing processes, as well as cutting and dicing applications.
- Core Advantages
- Deep expertise and technical know-how accumulated since 1995 in the manufacturing of electrical and electronic industrial tapes and functional tapes.Deep expertise and technical know-how accumulated since 1995 in the manufacturing of electrical and electronic industrial tapes and functional tapes.
- Establishment of a comprehensive product portfolio encompassing EMI/EMC shielding and absorbing, thermal management, and various bonding solutions.Establishment of a comprehensive product portfolio encompassing EMI/EMC shielding and absorbing, thermal management, and various bonding solutions.
- A flexible production system capable of customized specification changes and product development based on customer requests.A flexible production system capable of customized specification changes and product development based on customer requests.
- Securing technological innovation capabilities through continuous investment in research and development and the operation of a corporate R&D center.Securing technological innovation capabilities through continuous investment in research and development and the operation of a corporate R&D center.
- A leading position in the industry, supplying high-quality products through cooperation with various global leading companies.A leading position in the industry, supplying high-quality products through cooperation with various global leading companies.
- Reliability backed by international quality, environmental, and occupational health and safety management systems, including ISO 9001, ISO 14001, ISO 45001, and UL certifications.Reliability backed by international quality, environmental, and occupational health and safety management systems, including ISO 9001, ISO 14001, ISO 45001, and UL certifications.
- The company's vision, "THE WORLD BEST ADHESION TECHNOLOGY TRUSS!!", signifies its pursuit of global leadership in adhesion technology.The company's vision, "THE WORLD BEST ADHESION TECHNOLOGY TRUSS!!", signifies its pursuit of global leadership in adhesion technology.
- Target Industrie
- Manufacturing industries for the latest IT devices, including mobile phones, tablet PCs, and TVs.Manufacturing industries for the latest IT devices, including mobile phones, tablet PCs, and TVs.
- Semiconductor and electronic component manufacturing processes.Semiconductor and electronic component manufacturing processes.
- Supply of core materials for the electric vehicle and secondary battery industries.Supply of core materials for the electric vehicle and secondary battery industries.
- FPC (Flexible Printed Circuit) and PCB (Printed Circuit Board) bonding and grounding applications.FPC (Flexible Printed Circuit) and PCB (Printed Circuit Board) bonding and grounding applications.
- EMI shielding and attachment processes for display panels, including OLED modules.EMI shielding and attachment processes for display panels, including OLED modules.
- Precision bonding and mounting solutions for diverse materials such as metal, glass, and plastics.Precision bonding and mounting solutions for diverse materials such as metal, glass, and plastics.
- Temporary fixing and protection purposes in cutting and dicing processes.Temporary fixing and protection purposes in cutting and dicing processes.
- Major Markets
- United StatesUnited States
- Certifications/Patents
- Possession of international quality, environmental, and occupational health and safety management system certifications, including ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018.Possession of international quality, environmental, and occupational health and safety management system certifications, including ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018.
- Proof of technological capability and product safety through UL certification and recognition as a corporate R&D center.Proof of technological capability and product safety through UL certification and recognition as a corporate R&D center.
- Patent registration for "Direct contact type conductive adhesive tape using nano metal powder and method for manufacturing the same".Patent registration for "Direct contact type conductive adhesive tape using nano metal powder and method for manufacturing the same".
- Patent registration for "Conductive adhesive tape using conductive cushion balls and method for manufacturing the same".Patent registration for "Conductive adhesive tape using conductive cushion balls and method for manufacturing the same".
- Patent registration for "Waterproof tape including micro air layer and method for manufacturing the same".Patent registration for "Waterproof tape including micro air layer and method for manufacturing the same".
- Patent registration for "Osmotic pressure water injection peel-off type secondary battery fixing tape and method for manufacturing the same".Patent registration for "Osmotic pressure water injection peel-off type secondary battery fixing tape and method for manufacturing the same".
- US patent registration for "Conductive Adhesive Tape Using compressible conductive powder and manufacturing method thereof".US patent registration for "Conductive Adhesive Tape Using compressible conductive powder and manufacturing method thereof".
- Patent registration for "Photocuring adhesive and heat-foaming agent containing re-peelable adhesive and re-peelable adhesive tape including the same".Patent registration for "Photocuring adhesive and heat-foaming agent containing re-peelable adhesive and re-peelable adhesive tape including the same".
Introduction
Location
7 Majung-ro, Seo-gu, Incheon, South Korea
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