TKC, The Republic of Korea - Komachine Supplier Profile and Product List

- TKC Co., Ltd. is a specialized company established in 1996, focusing on surface treatment equipment and factory engineering systems for the semiconductor and PCB industries. Its core role involves manufacturing and supplying world-class equipment incorporating cutting-edge Plating & WET Process technologies. The company consistently pursues unique and innovative technological development, alongside continuous efforts to enhance product quality and cost competitiveness. TKC operates with a customer-centric management philosophy, aiming for mutual growth and value creation through customer satisfaction.TKC Co., Ltd. is a specialized company established in 1996, focusing on surface treatment equipment and factory engineering systems for the semiconductor and PCB industries. Its core role involves manufacturing and supplying world-class equipment incorporating cutting-edge Plating & WET Process technologies. The company consistently pursues unique and innovative technological development, alongside continuous efforts to enhance product quality and cost competitiveness. TKC operates with a customer-centric management philosophy, aiming for mutual growth and value creation through customer satisfaction.
- Semiconductor ElectroPlating Equipment (Models: AEGIS-1044EP, AEGIS-1014EP): Advanced semiconductor electroplating equipment for advanced packaging products (Bump, RDL, Cu Pillar, TSV), supporting 12-inch wafers with excellent uniformity and high throughput. Features include various wafer handling capabilities (GWSS, WSS, Si) and a user-friendly interface.Semiconductor ElectroPlating Equipment (Models: AEGIS-1044EP, AEGIS-1014EP): Advanced semiconductor electroplating equipment for advanced packaging products (Bump, RDL, Cu Pillar, TSV), supporting 12-inch wafers with excellent uniformity and high throughput. Features include various wafer handling capabilities (GWSS, WSS, Si) and a user-friendly interface.
- Square Panel Electroplating Equipment (Model: AEGIS-3035SP): Equipment specialized in square panel plating, incorporating core technologies for PCB and IT-related WET Processes.Square Panel Electroplating Equipment (Model: AEGIS-3035SP): Equipment specialized in square panel plating, incorporating core technologies for PCB and IT-related WET Processes.
- Specialized Mold Via Plating for Cu Column (Model: AEGIS-3067SP): Dedicated equipment for mold via plating for copper columns applied in EMC products, featuring a Facedown Horizontal Plating System.Specialized Mold Via Plating for Cu Column (Model: AEGIS-3067SP): Dedicated equipment for mold via plating for copper columns applied in EMC products, featuring a Facedown Horizontal Plating System.
- VCP Type Cu-Plating Equipment (Models: AEGIS-MSAP VCP Series, AEGIS-Pulse VCP Series): Non-contact Full Automation Vertical Continuous Plating equipment for PCBs, optimized for uniform plating deviation and ultra-thin (36um) product compatibility. A pioneer in developing and localizing advanced vertical continuous plating equipment through international technical partnerships.VCP Type Cu-Plating Equipment (Models: AEGIS-MSAP VCP Series, AEGIS-Pulse VCP Series): Non-contact Full Automation Vertical Continuous Plating equipment for PCBs, optimized for uniform plating deviation and ultra-thin (36um) product compatibility. A pioneer in developing and localizing advanced vertical continuous plating equipment through international technical partnerships.
- Carrier Type Plating Equipment (Models: AEGIS-E'less Series, AEGIS-Desmear Series, AEGIS-Ni·Au Plating Series, AEGIS-Ni·Cr Plating Series, AEGIS-Barrell Plating Series, AEGIS-ENIG, ENEPIG Series): Various carrier-type plating process equipment for PCB production, including electroless gold plating, electrolytic Ni-Au plating, Ni-Cr plating, and barrel plating. Wide application areas such as HDI, PKG, FPC, MLCC, Diode, and automotive components.Carrier Type Plating Equipment (Models: AEGIS-E'less Series, AEGIS-Desmear Series, AEGIS-Ni·Au Plating Series, AEGIS-Ni·Cr Plating Series, AEGIS-Barrell Plating Series, AEGIS-ENIG, ENEPIG Series): Various carrier-type plating process equipment for PCB production, including electroless gold plating, electrolytic Ni-Au plating, Ni-Cr plating, and barrel plating. Wide application areas such as HDI, PKG, FPC, MLCC, Diode, and automotive components.
- Non Contact Vertical Developer for Dry Film & Solder Resist (Model: AEGIS-NC Developer Series): Non-contact vertical developing equipment for dry film and solder resist applications.Non Contact Vertical Developer for Dry Film & Solder Resist (Model: AEGIS-NC Developer Series): Non-contact vertical developing equipment for dry film and solder resist applications.
- Auto Analysis & Dosing Equipment (METIS): An automatic chemical controller for analyzing and replenishing active ingredients in PCB, PDP, LCD, and POP electrolytic and electroless plating processes. Key features include process cost reduction, improved product reliability, chemical dosing for uniform concentration, and a simple interface supporting multiple languages.Auto Analysis & Dosing Equipment (METIS): An automatic chemical controller for analyzing and replenishing active ingredients in PCB, PDP, LCD, and POP electrolytic and electroless plating processes. Key features include process cost reduction, improved product reliability, chemical dosing for uniform concentration, and a simple interface supporting multiple languages.
- Mefiag Filtration System: A filtration system for nickel, copper, and zinc electrolytes, with diverse applications in PCB, metal finishing, wastewater treatment, organic control, and parts cleaning. Notable for its large sludge holding capacity and high-quality polypropylene construction.Mefiag Filtration System: A filtration system for nickel, copper, and zinc electrolytes, with diverse applications in PCB, metal finishing, wastewater treatment, organic control, and parts cleaning. Notable for its large sludge holding capacity and high-quality polypropylene construction.
- Unique and innovative technological development capabilities in the Plating & WET Process sector. Expertise in manufacturing and supplying state-of-the-art equipment required by the semiconductor and PCB industries.Unique and innovative technological development capabilities in the Plating & WET Process sector. Expertise in manufacturing and supplying state-of-the-art equipment required by the semiconductor and PCB industries.
- Technological leadership achieved through the first domestic localization and supply of vertical continuous plating equipment. Securing a leading position through advanced technology introduction via international technical partnerships.Technological leadership achieved through the first domestic localization and supply of vertical continuous plating equipment. Securing a leading position through advanced technology introduction via international technical partnerships.
- VCP equipment technology optimized for achieving uniform plating deviation and supporting ultra-thin 36um products. Implementation of non-contact Full Automation for a convenient working environment and continuous efforts in defect rate management.VCP equipment technology optimized for achieving uniform plating deviation and supporting ultra-thin 36um products. Implementation of non-contact Full Automation for a convenient working environment and continuous efforts in defect rate management.
- Enhancement of technological competitiveness through the possession of over 40 proprietary patent technologies and recognition as a venture and Inno-Biz company. Securing growth drivers through continuous R&D investment and technological innovation.Enhancement of technological competitiveness through the possession of over 40 proprietary patent technologies and recognition as a venture and Inno-Biz company. Securing growth drivers through continuous R&D investment and technological innovation.
- Persistent efforts to improve quality and cost competitiveness in line with the global competitive era. Pursuit of mutual growth through customer satisfaction, based on a customer-centric management philosophy.Persistent efforts to improve quality and cost competitiveness in line with the global competitive era. Pursuit of mutual growth through customer satisfaction, based on a customer-centric management philosophy.
- Semiconductor Industry: Semiconductor electroplating equipment and production processes for advanced packaging products such as Cu Pillar and TSV.Semiconductor Industry: Semiconductor electroplating equipment and production processes for advanced packaging products such as Cu Pillar and TSV.
- PCB Industry: VCP (Vertical Continuous Plating) equipment for PCBs, carrier-type plating equipment, and dry film & solder resist developing equipment.PCB Industry: VCP (Vertical Continuous Plating) equipment for PCBs, carrier-type plating equipment, and dry film & solder resist developing equipment.
- IT-related Industries: Supply of equipment related to WET Process and Plating Process.IT-related Industries: Supply of equipment related to WET Process and Plating Process.
- Electronic Components Industry: Plating processes for various electronic components including HDI, PKG, FPC, MLCC, and Diodes.Electronic Components Industry: Plating processes for various electronic components including HDI, PKG, FPC, MLCC, and Diodes.
- Automotive Industry: Plating processes for automotive components and related to the production of automotive electronic modules.Automotive Industry: Plating processes for automotive components and related to the production of automotive electronic modules.
- PhilippinesPhilippines
- Establishment and recognition of a corporate research institute (2001).Establishment and recognition of a corporate research institute (2001).
- Inno-Biz certification for technological innovation (2004).Inno-Biz certification for technological innovation (2004).
- Acquisition of ISO14001 Environmental Management System certification (2005).Acquisition of ISO14001 Environmental Management System certification (2005).
- Acquisition of ISO9001 Quality Management System certification (2007).Acquisition of ISO9001 Quality Management System certification (2007).
- Participation in a national project for multi-system packaging equipment development (2009).Participation in a national project for multi-system packaging equipment development (2009).
- Awarded the 5 Million Dollar Export Tower (2011).Awarded the 5 Million Dollar Export Tower (2011).
- Awarded the IR52 Jang Young-shil Award (2012).Awarded the IR52 Jang Young-shil Award (2012).
- Awarded the 10 Million Dollar Export Tower (2014).Awarded the 10 Million Dollar Export Tower (2014).
- Designated as a specialized Root Industry company (2016).Designated as a specialized Root Industry company (2016).
- Selected as a Global Leading Company (KICOX, 2019).Selected as a Global Leading Company (KICOX, 2019).
- Surface Treatment Technology Industrial Technology Confirmation Certification (Advanced Technology Product Registration for Plating Equipment, 2019).Surface Treatment Technology Industrial Technology Confirmation Certification (Advanced Technology Product Registration for Plating Equipment, 2019).
- Achieved 30 Million Dollar export performance (2019).Achieved 30 Million Dollar export performance (2019).
- Possession of over 40 proprietary patent technologies.Possession of over 40 proprietary patent technologies.