Tae Sung, The Republic of Korea - Komachine Supplier Profile and Product List

- Tae Sung Co., Ltd., established in 2000, is a comprehensive manufacturer of PCB pre-processing equipment and polishing machines. The company supplies essential automation equipment for PCB production, including scrubbing machines, copper powder filters, WET LINEs, and ceramic brushes [database, 19, 21]. It leads the localization of PCB equipment, establishing a dominant position in the domestic market. Recently, the company has expanded its business into 2nd battery composite copper foil and glass substrate equipment, positioning itself as a technology-leading enterprise.Tae Sung Co., Ltd., established in 2000, is a comprehensive manufacturer of PCB pre-processing equipment and polishing machines. The company supplies essential automation equipment for PCB production, including scrubbing machines, copper powder filters, WET LINEs, and ceramic brushes [database, 19, 21]. It leads the localization of PCB equipment, establishing a dominant position in the domestic market. Recently, the company has expanded its business into 2nd battery composite copper foil and glass substrate equipment, positioning itself as a technology-leading enterprise.
- Its main product lines include various polishing equipment such as scrubbing machines, copper powder filters, WET LINEs, and ceramic brushes for PCB pre-processing [database, 19, 21].Its main product lines include various polishing equipment such as scrubbing machines, copper powder filters, WET LINEs, and ceramic brushes for PCB pre-processing [database, 19, 21].
- The scrubbing machine lineup offers diverse models for Rigid general, 0.084T thin, 0.06T ultra-thin, high multi-layer rigid, SUS, flexible, and single-axis applications (TSG-104R,L-N, TSG-104R,L-T, TSG-104R,L-P, TSG-106,104R,L-S, TSG-104R,L-F, TSG-101R,L-BS) [database].The scrubbing machine lineup offers diverse models for Rigid general, 0.084T thin, 0.06T ultra-thin, high multi-layer rigid, SUS, flexible, and single-axis applications (TSG-104R,L-N, TSG-104R,L-T, TSG-104R,L-P, TSG-106,104R,L-S, TSG-104R,L-F, TSG-101R,L-BS) [database].
- Copper powder filters, specifically models TSGE-201 and TSGE-202, contribute to enhancing the efficiency of PCB processes [database].Copper powder filters, specifically models TSGE-201 and TSGE-202, contribute to enhancing the efficiency of PCB processes [database].
- WET LINEs provide wet process equipment for PTH, SURFACE, ETCH, and FINISHING stages, including 8-Series, 7-Series, and 3-Series models [database].WET LINEs provide wet process equipment for PTH, SURFACE, ETCH, and FINISHING stages, including 8-Series, 7-Series, and 3-Series models [database].
- In new business areas, the company has developed Roll-to-Roll (RTR) plating equipment for 2nd battery composite copper foil manufacturing, with anticipated mass production for global Top-Tier cell makers.In new business areas, the company has developed Roll-to-Roll (RTR) plating equipment for 2nd battery composite copper foil manufacturing, with anticipated mass production for global Top-Tier cell makers.
- For glass substrate equipment, it has secured proprietary technologies such as alkali etching-based TGV cleaning and etching equipment, non-contact magnetic drive systems, and chemical copper metallization processes.For glass substrate equipment, it has secured proprietary technologies such as alkali etching-based TGV cleaning and etching equipment, non-contact magnetic drive systems, and chemical copper metallization processes.
- The development of special blackening plating technology for high-resolution camera aperture modules is also a key focus.The development of special blackening plating technology for high-resolution camera aperture modules is also a key focus.
- Successful localization of 18 core PCB equipment types and securing over 90% dominant market share in the domestic market.Successful localization of 18 core PCB equipment types and securing over 90% dominant market share in the domestic market.
- Continuous R&D investment and accumulated wet process technology leading to in-house development of core etching equipment technologies like vacuum devices and two-fluid spray devices.Continuous R&D investment and accumulated wet process technology leading to in-house development of core etching equipment technologies like vacuum devices and two-fluid spray devices.
- Proactive technology development and patent applications in future growth engines such as 2nd battery composite copper foil and glass substrate equipment.Proactive technology development and patent applications in future growth engines such as 2nd battery composite copper foil and glass substrate equipment.
- Establishment of a global customer network including major domestic companies like Samsung Electro-Mechanics, LG Innotek, and overseas global PCB manufacturers such as Foxconn in Taiwan, ZDT in China, and Ibiden and Meiko in Japan.Establishment of a global customer network including major domestic companies like Samsung Electro-Mechanics, LG Innotek, and overseas global PCB manufacturers such as Foxconn in Taiwan, ZDT in China, and Ibiden and Meiko in Japan.
- Demonstrated global market competitiveness in technology and quality through numerous export awards, including the '30 Million Dollar Export Tower' (2022).Demonstrated global market competitiveness in technology and quality through numerous export awards, including the '30 Million Dollar Export Tower' (2022).
- Stable supply chain establishment through the expansion of its new factory in Ansan, Gyeonggi-do, doubling production capacity.Stable supply chain establishment through the expansion of its new factory in Ansan, Gyeonggi-do, doubling production capacity.
- Supply of essential pre-processing and wet process equipment for the entire Printed Circuit Board (PCB) manufacturing industry [database, 19, 21, 32, 40].Supply of essential pre-processing and wet process equipment for the entire Printed Circuit Board (PCB) manufacturing industry [database, 19, 21, 32, 40].
- Application of high-precision etching and cleaning equipment required for AI semiconductor and High-Performance Computing (HPC) semiconductor package substrate manufacturing.Application of high-precision etching and cleaning equipment required for AI semiconductor and High-Performance Computing (HPC) semiconductor package substrate manufacturing.
- Contribution to the production of core components for various electronic products, including smartphones, displays, and automotive electronic components.Contribution to the production of core components for various electronic products, including smartphones, displays, and automotive electronic components.
- Supply of 2nd battery composite copper foil production, electrode cleaning, and surface treatment equipment for enhanced battery safety and weight reduction.Supply of 2nd battery composite copper foil production, electrode cleaning, and surface treatment equipment for enhanced battery safety and weight reduction.
- Provision of ultra-precision etching technology-based cleaning equipment and aperture modules for high-resolution camera module manufacturing.Provision of ultra-precision etching technology-based cleaning equipment and aperture modules for high-resolution camera module manufacturing.
- China is a major export market due to the operation of its Guangdong Dongguan factory and rapidly increasing demand for AI semiconductor substrates., Market expansion through the supply of equipment to leading PCB companies in Asia, including Taiwan (Foxconn) and Japan (Ibiden, Meiko)., Notably, the achievement of exporting PCB equipment to Japan, a technology leader, serves as significant evidence of its technological competitiveness.China is a major export market due to the operation of its Guangdong Dongguan factory and rapidly increasing demand for AI semiconductor substrates., Market expansion through the supply of equipment to leading PCB companies in Asia, including Taiwan (Foxconn) and Japan (Ibiden, Meiko)., Notably, the achievement of exporting PCB equipment to Japan, a technology leader, serves as significant evidence of its technological competitiveness.
- Recognition of its technology and quality in the European market through the export of PCB equipment to Germany, a technologically advanced nation.Recognition of its technology and quality in the European market through the export of PCB equipment to Germany, a technologically advanced nation.
- Possession of numerous quality and technology-related certifications, including Corporate R&D Center accreditation, Main Biz confirmation, ISO9001, ISO14001, and EC(CCQS UK).Possession of numerous quality and technology-related certifications, including Corporate R&D Center accreditation, Main Biz confirmation, ISO9001, ISO14001, and EC(CCQS UK).
- Recognition of technological prowess and growth potential through certifications such as IBK Strong Small and Medium Enterprise, Gyeonggi Province Promising SME, Venture Company, Inno-Biz, and Specialized Material, Parts, and Equipment Company.Recognition of technological prowess and growth potential through certifications such as IBK Strong Small and Medium Enterprise, Gyeonggi Province Promising SME, Venture Company, Inno-Biz, and Specialized Material, Parts, and Equipment Company.
- Government and institutional awards for years of export performance, including the '30 Million Dollar Export Tower' (2022), '10 Million Dollar Export Tower' (2015), and 'Industrial Service Medal' (2015).Government and institutional awards for years of export performance, including the '30 Million Dollar Export Tower' (2022), '10 Million Dollar Export Tower' (2015), and 'Industrial Service Medal' (2015).
- Ownership of intellectual property rights, including a total of 11 patents.Ownership of intellectual property rights, including a total of 11 patents.
- Completion of patent applications in 6 countries for composite copper foil RTR plating equipment and acquisition of a patent for 2nd battery anode plating equipment.Completion of patent applications in 6 countries for composite copper foil RTR plating equipment and acquisition of a patent for 2nd battery anode plating equipment.
- Ongoing patent applications for non-contact equipment and D.E.S line technologies related to glass substrates.Ongoing patent applications for non-contact equipment and D.E.S line technologies related to glass substrates.