SSP, The Republic of Korea - Komachine Supplier Profile and Product List

- SSP Inc., established in 1996, is a specialized semiconductor equipment manufacturer. The company's core business involves the development, manufacturing, and sale of semiconductor post-processing equipment, including ball mounters, camera module equipment, test handlers, and automation equipment. Operating under the management philosophy of 'realizing imagination through technology,' the company focuses on technological innovation and providing differentiated products. It has built trust with global partners as a strong global technology company.SSP Inc., established in 1996, is a specialized semiconductor equipment manufacturer. The company's core business involves the development, manufacturing, and sale of semiconductor post-processing equipment, including ball mounters, camera module equipment, test handlers, and automation equipment. Operating under the management philosophy of 'realizing imagination through technology,' the company focuses on technological innovation and providing differentiated products. It has built trust with global partners as a strong global technology company.
- Auto Ball Placement System (BPS-8200, BPS-7200HD, BPS-7200FC, BPS-6200FC): Ball placement systems for substrate strip carriers or single-unit packages. The BPS-8200 model is applicable to FBGA and FCCSP packages, offering a placement accuracy of ±20um and fine pitch capability of 0.200mm ball pitch with 0.100mm ball diameter. The BPS-7200HD model is a Finer Pitch Solder Ball Placement System, incorporating core technologies for semiconductor packaging equipment. The BPS-7200FC model is a ball placement system for FCBGA single-unit packages.Auto Ball Placement System (BPS-8200, BPS-7200HD, BPS-7200FC, BPS-6200FC): Ball placement systems for substrate strip carriers or single-unit packages. The BPS-8200 model is applicable to FBGA and FCCSP packages, offering a placement accuracy of ±20um and fine pitch capability of 0.200mm ball pitch with 0.100mm ball diameter. The BPS-7200HD model is a Finer Pitch Solder Ball Placement System, incorporating core technologies for semiconductor packaging equipment. The BPS-7200FC model is a ball placement system for FCBGA single-unit packages.
- Finer Pitch Solder Ball Placement System: Possessing Wafer Level Micro Solder Ball Mounter technology capable of producing 0.1mm pitch and 0.06mm balls. Various equipment platforms are available to handle different carrier formats and offer customer-friendly system designs based on requirements.Finer Pitch Solder Ball Placement System: Possessing Wafer Level Micro Solder Ball Mounter technology capable of producing 0.1mm pitch and 0.06mm balls. Various equipment platforms are available to handle different carrier formats and offer customer-friendly system designs based on requirements.
- Strip Marking System (SMS-5000): A system designed for marking operations on semiconductor packages in strip format.Strip Marking System (SMS-5000): A system designed for marking operations on semiconductor packages in strip format.
- Lead To Lead Attach System (LTL-5000): Equipment for automating the lead-to-lead bonding process.Lead To Lead Attach System (LTL-5000): Equipment for automating the lead-to-lead bonding process.
- Process Automation System: Including Strip & Cover Plate Off Loading System with Vision System (ASU-5000), Strip & Cover Plate Loading System with Laser Marking (ASL-5000), and Automatic Substrate Loading System, among other diverse automation equipment lineups.Process Automation System: Including Strip & Cover Plate Off Loading System with Vision System (ASU-5000), Strip & Cover Plate Loading System with Laser Marking (ASL-5000), and Automatic Substrate Loading System, among other diverse automation equipment lineups.
- Package Sorter System (APP-7000L, PSS-7000, APP-7200UR, APP-7000UR): Systems for sorting and handling semiconductor packages. This includes Pick&Place systems for EMI Shielding.Package Sorter System (APP-7000L, PSS-7000, APP-7200UR, APP-7000UR): Systems for sorting and handling semiconductor packages. This includes Pick&Place systems for EMI Shielding.
- Camera Module Assembly System: Automated equipment and technology required for camera module manufacturing processes. Product lines include Automatic Lens Fix System (LFS-3000) and Auto Snap Cure System (SCS-3000).Camera Module Assembly System: Automated equipment and technology required for camera module manufacturing processes. Product lines include Automatic Lens Fix System (LFS-3000) and Auto Snap Cure System (SCS-3000).
- Laser Application System: Capabilities in developing high-power/high-precision laser control systems.Laser Application System: Capabilities in developing high-power/high-precision laser control systems.
- Unique Technology and Expertise: Over 20 years of accumulated technical capabilities and expertise, focusing on semiconductor equipment since its establishment in 1996. The company has secured world-class technology and global market share in the ball mounter equipment sector.Unique Technology and Expertise: Over 20 years of accumulated technical capabilities and expertise, focusing on semiconductor equipment since its establishment in 1996. The company has secured world-class technology and global market share in the ball mounter equipment sector.
- Customer-Centric Product Development and Service: Development of products that maximize production efficiency based on 'SIMPLE DESIGN and user convenience,' contributing to customer value creation. Provision of services prioritizing customer satisfaction through a 'BEFORE SERVICE' system that proactively addresses customer inconveniences.Customer-Centric Product Development and Service: Development of products that maximize production efficiency based on 'SIMPLE DESIGN and user convenience,' contributing to customer value creation. Provision of services prioritizing customer satisfaction through a 'BEFORE SERVICE' system that proactively addresses customer inconveniences.
- Global Market Response and Localization Strategy: High export ratio of 60-70% of total sales, indicating active engagement in global markets. Deployment of staff to the US and Mexico, and operation of overseas branches in China, Vietnam, the Philippines, and Malaysia with locally hired employees for prompt technical support and after-sales service.Global Market Response and Localization Strategy: High export ratio of 60-70% of total sales, indicating active engagement in global markets. Deployment of staff to the US and Mexico, and operation of overseas branches in China, Vietnam, the Philippines, and Malaysia with locally hired employees for prompt technical support and after-sales service.
- Continuous R&D and Intellectual Property Acquisition: Strengthening its position as a technology-leading company by filing and holding over 100 patents and utility models through its R&D center. Recognized for its IP-based technological competitiveness by being selected as a 'Global IP Star Company'.Continuous R&D and Intellectual Property Acquisition: Strengthening its position as a technology-leading company by filing and holding over 100 patents and utility models through its R&D center. Recognized for its IP-based technological competitiveness by being selected as a 'Global IP Star Company'.
- Diversified Product Portfolio: In addition to ball placement systems, the company offers a wide range of products including laser application systems, process automation systems, package sorter P&P systems, camera module assembly systems, and package EMI shielding systems, responding to diverse market demands.Diversified Product Portfolio: In addition to ball placement systems, the company offers a wide range of products including laser application systems, process automation systems, package sorter P&P systems, camera module assembly systems, and package EMI shielding systems, responding to diverse market demands.
- Semiconductor Manufacturing Industry: Supply of solder ball placement and automation equipment for various semiconductor package processes such as BGA, FCCSP, and FCBGA.Semiconductor Manufacturing Industry: Supply of solder ball placement and automation equipment for various semiconductor package processes such as BGA, FCCSP, and FCBGA.
- Camera Module Manufacturing Industry: Provision of camera module assembly and inspection equipment.Camera Module Manufacturing Industry: Provision of camera module assembly and inspection equipment.
- Electromagnetic Interference (EMI) Shielding Industry: Supply of Pick&Place systems for package EMI Shielding.Electromagnetic Interference (EMI) Shielding Industry: Supply of Pick&Place systems for package EMI Shielding.
- General Automation Industry: Contribution to increased production efficiency through various process automation systems.General Automation Industry: Contribution to increased production efficiency through various process automation systems.
- China, Vietnam, Philippines, MalaysiaChina, Vietnam, Philippines, Malaysia
- United States, MexicoUnited States, Mexico
- ISO 9001 (Quality Management System Certification).ISO 9001 (Quality Management System Certification).
- ISO 14000 (Environmental Management System Certification).ISO 14000 (Environmental Management System Certification).
- ISO 45001 (Occupational Health and Safety Management System Certification).ISO 45001 (Occupational Health and Safety Management System Certification).
- CE Certification (Ball Mount System, Auto Holder Attach System).CE Certification (Ball Mount System, Auto Holder Attach System).
- Over 118 patents and utility models (108 domestic, 10 international). Key patents include solder ball placement devices for ball grid arrays, methods and devices for solder ball attachment in integrated circuit packages, and housing attaching equipment and methods for camera modules.Over 118 patents and utility models (108 domestic, 10 international). Key patents include solder ball placement devices for ball grid arrays, methods and devices for solder ball attachment in integrated circuit packages, and housing attaching equipment and methods for camera modules.
- IR52 Jang Young-shil Award (BPS-DH1) in 2022.IR52 Jang Young-shil Award (BPS-DH1) in 2022.
- Minister of Science and ICT Award (Jang Young-shil Award) in 2022.Minister of Science and ICT Award (Jang Young-shil Award) in 2022.
- Korea Small and Medium Business Innovation Award (Intellectual Property Sector) in 2020.Korea Small and Medium Business Innovation Award (Intellectual Property Sector) in 2020.
- Presidential Citation for Materials, Parts, and Equipment Promotion in 2020.Presidential Citation for Materials, Parts, and Equipment Promotion in 2020.
- Presidential Citation for Excellent Venture in 2018.Presidential Citation for Excellent Venture in 2018.
- Excellent Semiconductor Patent Award in 2017.Excellent Semiconductor Patent Award in 2017.
- Korea Excellent Patent Award (Second Half) in 2019.Korea Excellent Patent Award (Second Half) in 2019.
- Selected as a Global IP Star Company (2025).Selected as a Global IP Star Company (2025).
- Designated as a Specialized Company for Materials, Parts, and Equipment (2025).Designated as a Specialized Company for Materials, Parts, and Equipment (2025).