Shin Kwang Chemicals Co., Ltd., established in 1995, is a South Korean company specializing in the manufacturing and sales of eco-friendly, high-performance adhesives, molding compounds, and coatings. The company supplies advanced chemical materials tailored for high-tech industries such as display, mobile, secondary batteries, and semiconductors. It focuses on developing cutting-edge technologies and achieving innovative cost reductions and production efficiencies to meet customer needs. The company's management policy emphasizes flawless quality, optimal pricing, and shortest delivery times.ShinKwangChemicalsCo.,Ltd.,establishedin1995,isaSouthKoreancompanyspecializinginthemanufacturingandsalesofeco-friendly,high-performanceadhesives,moldingcompounds,andcoatings.Thecompanysuppliesadvancedchemicalmaterialstailoredforhigh-techindustriessuchasdisplay,mobile,secondarybatteries,andsemiconductors.Itfocusesondevelopingcutting-edgetechnologiesandachievinginnovativecostreductionsandproductionefficienciestomeetcustomerneeds.Thecompany'smanagementpolicyemphasizesflawlessquality,optimalpricing,andshortestdeliverytimes.
Key Products/TechnologiesKeyProducts/Technologies
UV Resin: Development and mass production capabilities for UV-curable adhesives for mobile phone CLI lamination, keypad bonding, UV-curable resins for BLU-related optical sheets (prism), and UV-curable adhesives for LCD panel lamination.UVResin:DevelopmentandmassproductioncapabilitiesforUV-curableadhesivesformobilephoneCLIlamination,keypadbonding,UV-curableresinsforBLU-relatedopticalsheets(prism),andUV-curableadhesivesforLCDpanellamination.
Epoxy Resin: Possession of technology for dual-curable epoxy adhesive compositions that maintain high adhesion between dissimilar materials like metal and resin, and related bonding methods.EpoxyResin:Possessionoftechnologyfordual-curableepoxyadhesivecompositionsthatmaintainhighadhesionbetweendissimilarmaterialslikemetalandresin,andrelatedbondingmethods.
Urethane Resin: Possession of technology for modified urethane hot-press adhesive compositions that maintain high adhesion between dissimilar materials like metal and resin, and related bonding methods.UrethaneResin:Possessionoftechnologyformodifiedurethanehot-pressadhesivecompositionsthatmaintainhighadhesionbetweendissimilarmaterialslikemetalandresin,andrelatedbondingmethods.
Silicone: Possession of technology for tin-free one-component moisture-curable silylated polyether sealant adhesive compositions and their manufacturing methods.Silicone:Possessionoftechnologyfortin-freeone-componentmoisture-curablesilylatedpolyethersealantadhesivecompositionsandtheirmanufacturingmethods.
Adhesives for Camera Modules: Development and mass production application of various adhesives for camera modules, including flange adhesives, lens bonding adhesives, DUAL CURE adhesives for active alignment, IR filter adhesives, housing adhesives, underfill, dam, lid attach, corner fill (side sealing), and molding.AdhesivesforCameraModules:Developmentandmassproductionapplicationofvariousadhesivesforcameramodules,includingflangeadhesives,lensbondingadhesives,DUALCUREadhesivesforactivealignment,IRfilteradhesives,housingadhesives,underfill,dam,lidattach,cornerfill(sidesealing),andmolding.
Adhesives and Coatings for Display Panels: Development and mass production application of electrode protective agents for ITO electrodes and flexible circuit board connections, and SIDE SEAL resins for preventing light leakage and sealing display panels.AdhesivesandCoatingsforDisplayPanels:DevelopmentandmassproductionapplicationofelectrodeprotectiveagentsforITOelectrodesandflexiblecircuitboardconnections,andSIDESEALresinsforpreventinglightleakageandsealingdisplaypanels.
PCB Conformal Coating Resins: Development and mass production application of UV+moisture curable products that improve curing speed by incorporating UV curing, addressing the slower curing of traditional silicone or two-component urethane.PCBConformalCoatingResins:DevelopmentandmassproductionapplicationofUV+moisturecurableproductsthatimprovecuringspeedbyincorporatingUVcuring,addressingtheslowercuringoftraditionalsiliconeortwo-componenturethane.
Adhesives for Semiconductors: Development capabilities for high-performance adhesives used in semiconductor packages, including underfill for BGA, CSP, Flip chip packages, capillary, molded underfill adhesives, and Dual cure (UV+Heat) system underfill.AdhesivesforSemiconductors:Developmentcapabilitiesforhigh-performanceadhesivesusedinsemiconductorpackages,includingunderfillforBGA,CSP,Flipchippackages,capillary,moldedunderfilladhesives,andDualcure(UV+Heat)systemunderfill.
Core AdvantagesCoreAdvantages
Differentiated Advanced Technology Development Capabilities: Possessing development capabilities for various adhesives and coatings, including UV-curable resins, room-temperature and heat-curable urethanes and epoxies, moisture-curable modified silicones, and DUAL CURE (UV+heat curing/UV+moisture curing) resins.DifferentiatedAdvancedTechnologyDevelopmentCapabilities:Possessingdevelopmentcapabilitiesforvariousadhesivesandcoatings,includingUV-curableresins,room-temperatureandheat-curableurethanesandepoxies,moisture-curablemodifiedsilicones,andDUALCURE(UV+heatcuring/UV+moisturecuring)resins.
Customer-Centric Customized Product Development: Focusing on developing high-performance and eco-friendly products that meet customer value requirements, providing solutions tailored to specific needs across various industrial sectors.Customer-CentricCustomizedProductDevelopment:Focusingondevelopinghigh-performanceandeco-friendlyproductsthatmeetcustomervaluerequirements,providingsolutionstailoredtospecificneedsacrossvariousindustrialsectors.
Flawless Quality and Production Efficiency: A management policy that achieves flawless quality, optimal pricing, and shortest delivery times through innovative cost reduction and production efficiency.FlawlessQualityandProductionEfficiency:Amanagementpolicythatachievesflawlessquality,optimalpricing,andshortestdeliverytimesthroughinnovativecostreductionandproductionefficiency.
Broad Application Industries and Major Client Acquisition: Extensive application areas across advanced industries such as DISPLAY, MOBILE, secondary batteries, and semiconductors, securing major domestic and international companies like LG Electronics, LG Display, Samsung SDI, Samsung Electronics, and CSOT as 1st Vendors.BroadApplicationIndustriesandMajorClientAcquisition:ExtensiveapplicationareasacrossadvancedindustriessuchasDISPLAY,MOBILE,secondarybatteries,andsemiconductors,securingmajordomesticandinternationalcompanieslikeLGElectronics,LGDisplay,SamsungSDI,SamsungElectronics,andCSOTas1stVendors.
Continuous R&D Investment and Corporate Research Institute Operation: Through its corporate research institute established in 2010, the company is dedicated to continuous technological development and new product innovation in the fields of adhesives and coatings for displays, mobile devices, and electrical/electronic applications.ContinuousR&DInvestmentandCorporateResearchInstituteOperation:Throughitscorporateresearchinstituteestablishedin2010,thecompanyisdedicatedtocontinuoustechnologicaldevelopmentandnewproductinnovationinthefieldsofadhesivesandcoatingsfordisplays,mobiledevices,andelectrical/electronicapplications.
Target IndustrieTargetIndustrie
Display Industry (OLED, LCD, and other devices): Adhesives for panel lamination, electrode protective agents, Side-seal, Panel bonding, resins for optical sheets, etc..DisplayIndustry(OLED,LCD,andotherdevices):Adhesivesforpanellamination,electrodeprotectiveagents,Side-seal,Panelbonding,resinsforopticalsheets,etc..
Mobile Industry (CCM, SPEAKER, and other devices): Adhesives for camera modules, waterproof gaskets, fingerprint sensor coatings, UV-curable adhesives for mobile phone CLI lamination/keypad bonding, etc..MobileIndustry(CCM,SPEAKER,andotherdevices):Adhesivesforcameramodules,waterproofgaskets,fingerprintsensorcoatings,UV-curableadhesivesformobilephoneCLIlamination/keypadbonding,etc..
Secondary Battery Industry: Adhesives and coatings for thermal management, cylindrical bonding, and other structural components.SecondaryBatteryIndustry:Adhesivesandcoatingsforthermalmanagement,cylindricalbonding,andotherstructuralcomponents.
Other Industries: BLU molding, hard coating, artificial turf, road construction, solar cells, card molding and adhesives, glass bonding and filling in construction, etc..OtherIndustries:BLUmolding,hardcoating,artificialturf,roadconstruction,solarcells,cardmoldingandadhesives,glassbondingandfillinginconstruction,etc..
Major MarketsMajorMarkets
China (Shenzhen branch, ElecFix logo trademark registration), Hong Kong (Hong Kong corporate entity established)China(Shenzhenbranch,ElecFixlogotrademarkregistration),HongKong(HongKongcorporateentityestablished)
Certifications/PatentsCertifications/Patents
Establishment of Corporate Research Institute (2010)EstablishmentofCorporateResearchInstitute(2010)
ISO 9001:2015 and ISO 14001:2015 certification acquisitionISO9001:2015andISO14001:2015certificationacquisition
Venture Company certification (2012)VentureCompanycertification(2012)
Gyeonggi-do Promising Small and Medium Business certification (2013)Gyeonggi-doPromisingSmallandMediumBusinesscertification(2013)
Designation as Export Promising Small and Medium Business (2016)DesignationasExportPromisingSmallandMediumBusiness(2016)
Confirmation as Material and Component Specialist Company (2019)ConfirmationasMaterialandComponentSpecialistCompany(2019)
UL Certification (related to PCB Conformal Coating Resin)ULCertification(relatedtoPCBConformalCoatingResin)
Patent Registration: UV-curable adhesive and its manufacturing method (including display front panel bonding method).PatentRegistration:UV-curableadhesiveanditsmanufacturingmethod(includingdisplayfrontpanelbondingmethod).
Patent Registration: Anisotropic conductive adhesive composition for electrical or electronic component connection.PatentRegistration:Anisotropicconductiveadhesivecompositionforelectricalorelectroniccomponentconnection.
Patent Registration: Curable adhesive composition with low shrinkage rate and bonding method using the same.PatentRegistration:Curableadhesivecompositionwithlowshrinkagerateandbondingmethodusingthesame.
Trademark Registration: 'ElecFix' logo (Korea, China) and 'SHINKWANG' logo (China).TrademarkRegistration:'ElecFix'logo(Korea,China)and'SHINKWANG'logo(China).
Introduction
Location
53 Suworam 5-gil, Seotan-myeon, Pyeongtaek, Gyeonggi-do, South Korea
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Information
53 Suworam 5-gil, Seotan-myeon, Pyeongtaek, Gyeonggi-do, South Korea