Seonghyeon Technology, The Republic of Korea - Komachine Supplier Profile and Product List

- A specialized company in precision processing equipment, focusing on 4-axis, 2-axis machining, grinding, and system equipment. The company's philosophy emphasizes continuous technological development and aggressive facility investment for 100% customer satisfaction. A vision to be a pioneer and leader in the global market.A specialized company in precision processing equipment, focusing on 4-axis, 2-axis machining, grinding, and system equipment. The company's philosophy emphasizes continuous technological development and aggressive facility investment for 100% customer satisfaction. A vision to be a pioneer and leader in the global market.
- 4-Axis Machining Center: Precision grinding and processing equipment featuring models 450/450A/450SA, FAGOR 8055i CNC controller, X,Y,Z travel of x280 y450 z200mm, a 1200*450mm table, a spindle with up to 40,000 RPM, and a 4-tool ATC system. Capable of precision processing for glass touch panels, semiconductor silicon, and sapphire wafer materials.4-Axis Machining Center: Precision grinding and processing equipment featuring models 450/450A/450SA, FAGOR 8055i CNC controller, X,Y,Z travel of x280 y450 z200mm, a 1200*450mm table, a spindle with up to 40,000 RPM, and a 4-tool ATC system. Capable of precision processing for glass touch panels, semiconductor silicon, and sapphire wafer materials.
- 2-Axis Machining Center: Precision processing facilities utilized across various industrial sectors.2-Axis Machining Center: Precision processing facilities utilized across various industrial sectors.
- 1-Axis Machining Center: Equipment with models 500/500A/500SA, FAGOR 8055i CNC controller, X,Y,Z travel of x450 y450 z200mm, a 500*500mm table, a spindle with up to 40,000 RPM, and a 4-tool ATC system. Offers precision grinding and processing capabilities for glass touch panels, semiconductor silicon, and sapphire wafer materials.1-Axis Machining Center: Equipment with models 500/500A/500SA, FAGOR 8055i CNC controller, X,Y,Z travel of x450 y450 z200mm, a 500*500mm table, a spindle with up to 40,000 RPM, and a 4-tool ATC system. Offers precision grinding and processing capabilities for glass touch panels, semiconductor silicon, and sapphire wafer materials.
- Grinding Equipment: CMP (Chemical Mechanical Polishing) equipment utilizing a 36-inch platen, specialized for processing Silicon, Sapphire, and SiC materials. Features forced drive of the pressure plate, platen temperature control (with external chiller), and a full cover type exterior.Grinding Equipment: CMP (Chemical Mechanical Polishing) equipment utilizing a 36-inch platen, specialized for processing Silicon, Sapphire, and SiC materials. Features forced drive of the pressure plate, platen temperature control (with external chiller), and a full cover type exterior.
- System Equipment: Customized system solutions for efficient production process implementation.System Equipment: Customized system solutions for efficient production process implementation.
- Other Products: Includes 12-inch rings, 8-inch rings, 12-inch electrodes 1, and 12-inch electrodes 2, which are components related to semiconductors and displays.Other Products: Includes 12-inch rings, 8-inch rings, 12-inch electrodes 1, and 12-inch electrodes 2, which are components related to semiconductors and displays.
- Continuous technological development and aggressive facility investment to achieve 100% customer satisfaction.Continuous technological development and aggressive facility investment to achieve 100% customer satisfaction.
- Establishment of excellent production and process management systems.Establishment of excellent production and process management systems.
- A corporate vision aiming to be a pioneer and leader in the global market.A corporate vision aiming to be a pioneer and leader in the global market.
- High-rigidity machine structure design ensuring precise machining without whitening or corner edge trembling at high feed rates and RPMs.High-rigidity machine structure design ensuring precise machining without whitening or corner edge trembling at high feed rates and RPMs.
- Enhanced productivity by 20-40% compared to existing products, achieved through the installation of a cast vacuum table for thermal deformation prevention.Enhanced productivity by 20-40% compared to existing products, achieved through the installation of a cast vacuum table for thermal deformation prevention.
- Implementation of ultra-precision dimensional machining through numerical control system (CNC) and automatic tool change (ATC) systems.Implementation of ultra-precision dimensional machining through numerical control system (CNC) and automatic tool change (ATC) systems.
- Semiconductor Manufacturing Industry: Precision grinding and processing of silicon, sapphire wafers, and SiC materials.Semiconductor Manufacturing Industry: Precision grinding and processing of silicon, sapphire wafers, and SiC materials.
- Display Industry: Precision processing applications for glass touch panels.Display Industry: Precision processing applications for glass touch panels.
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- No direct information regarding official patents, certifications, or awards is available.No direct information regarding official patents, certifications, or awards is available.
- Technological strengths include a vibration-absorbing precision structure for grinding equipment, numerical control system (CNC), and automatic tool change (ATC) system for ultra-precision dimensional machining capabilities.Technological strengths include a vibration-absorbing precision structure for grinding equipment, numerical control system (CNC), and automatic tool change (ATC) system for ultra-precision dimensional machining capabilities.
- Advanced engineering in high-rigidity machine structures and cast vacuum table technology for thermal deformation prevention.Advanced engineering in high-rigidity machine structures and cast vacuum table technology for thermal deformation prevention.