Information
59 Dongjeonsandandong-ro, Buk-myeon, Uichang-gu, Changwon-si, Gyeongsangnam-do, South Korea
+82 55-298-1334
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Overview
- Summary
- Saehan Nanotech, established in 2000, is a specialized manufacturer of equipment for the semiconductor and display industries, focusing on the development and production of ultra-precision micro-processing machinery such as ceramic processing machine tools, micro-drilling machines, and wire sawing machines. The company actively contributes to the localization of key component processing equipment for semiconductor etching processes, leading technological innovation.Saehan Nanotech, established in 2000, is a specialized manufacturer of equipment for the semiconductor and display industries, focusing on the development and production of ultra-precision micro-processing machinery such as ceramic processing machine tools, micro-drilling machines, and wire sawing machines. The company actively contributes to the localization of key component processing equipment for semiconductor etching processes, leading technological innovation.
- Key Products/Technologies
- Both Side Spindle Drilling Machine: Equipment optimized for silicon (Si) micro-hole processing, developed and patented as a world-first technology. Capable of simultaneous dual-axis processing, enabling long-term unmanned operation, up to double productivity, and minimal human error for enhanced quality.Both Side Spindle Drilling Machine: Equipment optimized for silicon (Si) micro-hole processing, developed and patented as a world-first technology. Capable of simultaneous dual-axis processing, enabling long-term unmanned operation, up to double productivity, and minimal human error for enhanced quality.
- Multi Wire Sawing Machine: Equipment for efficient cutting of difficult-to-machine materials such as silicon, SiC, sapphire, quartz, and ceramics. Possesses multi-wire saw technology allowing workpiece tilting or rotation.Multi Wire Sawing Machine: Equipment for efficient cutting of difficult-to-machine materials such as silicon, SiC, sapphire, quartz, and ceramics. Possesses multi-wire saw technology allowing workpiece tilting or rotation.
- Single Wire Sawing Machine: Equipment utilizing wire sawing technology for precise cutting of various materials.Single Wire Sawing Machine: Equipment utilizing wire sawing technology for precise cutting of various materials.
- Grinding Center Machine: Equipment for precision grinding processes.Grinding Center Machine: Equipment for precision grinding processes.
- Core Drilling Machine: Drilling equipment used for specific core processing.Core Drilling Machine: Drilling equipment used for specific core processing.
- Polishing Machine: Equipment utilized for post-processing and surface finishing of semiconductor etching components like electrodes and focus rings.Polishing Machine: Equipment utilized for post-processing and surface finishing of semiconductor etching components like electrodes and focus rings.
- Vertical Grinding Machine: Equipment specialized in vertical grinding processes.Vertical Grinding Machine: Equipment specialized in vertical grinding processes.
- Nanoimprinting Machine: Equipment applying nano-scale pattern formation technology, with capabilities for 6-8 inch wafers and 40nm resolution.Nanoimprinting Machine: Equipment applying nano-scale pattern formation technology, with capabilities for 6-8 inch wafers and 40nm resolution.
- Ultrasonic Drilling Machine: Micro-processing equipment developed in 2008.Ultrasonic Drilling Machine: Micro-processing equipment developed in 2008.
- Development of Si Micro Drilling Machine and Wire Sawing Machine: Pioneering the localization of semiconductor equipment with the development of Si micro-drilling machines in 2001 and Si wire sawing machines in 2003.Development of Si Micro Drilling Machine and Wire Sawing Machine: Pioneering the localization of semiconductor equipment with the development of Si micro-drilling machines in 2001 and Si wire sawing machines in 2003.
- Core Advantages
- Leading Localization Technology: Pioneering the localization of ceramic processing machine tools in a market dominated by foreign equipment, successfully achieving domestic production of semiconductor and display equipment. Over 20 years of stable equipment supply to major domestic clients.Leading Localization Technology: Pioneering the localization of ceramic processing machine tools in a market dominated by foreign equipment, successfully achieving domestic production of semiconductor and display equipment. Over 20 years of stable equipment supply to major domestic clients.
- Ultra-precision Micro-processing Technology: Proprietary R&D capabilities for high-precision processing of hard-to-machine materials such as silicon, SiC, quartz, and ceramics. The Both Side Spindle Drilling Machine, optimized for silicon micro-hole processing, is a world-first patented technology.Ultra-precision Micro-processing Technology: Proprietary R&D capabilities for high-precision processing of hard-to-machine materials such as silicon, SiC, quartz, and ceramics. The Both Side Spindle Drilling Machine, optimized for silicon micro-hole processing, is a world-first patented technology.
- Diverse Product Portfolio and Customized Solutions: Establishment of a comprehensive lineup of high-precision equipment covering the entire semiconductor etching process, including Both Side Spindle Drilling Machines, Multi Wire Sawing Machines, Polishing Machines, Grinding Machines, and Core Drilling Machines. Capability for customized design and optimized processing solution proposals.Diverse Product Portfolio and Customized Solutions: Establishment of a comprehensive lineup of high-precision equipment covering the entire semiconductor etching process, including Both Side Spindle Drilling Machines, Multi Wire Sawing Machines, Polishing Machines, Grinding Machines, and Core Drilling Machines. Capability for customized design and optimized processing solution proposals.
- Continuous R&D and Technological Innovation: Ongoing R&D investment and new product development through the establishment of a corporate research institute (2009). Track record of joint research with national research institutions (KIMM) on technologies such as 3D thermal error compensation devices and roll/flat pattern processing machines.Continuous R&D and Technological Innovation: Ongoing R&D investment and new product development through the establishment of a corporate research institute (2009). Track record of joint research with national research institutions (KIMM) on technologies such as 3D thermal error compensation devices and roll/flat pattern processing machines.
- Overseas Market Expansion and Export Capability Enhancement: Participation in KOTRA's overseas branch program, establishment of official YouTube channels, multilingual websites, and e-catalogs to strengthen online promotion. Proactive response to customer demands through direct communication with existing key clients and visits to overseas customers. Achieved approximately $5 million in export contracts in the first half of 2024.Overseas Market Expansion and Export Capability Enhancement: Participation in KOTRA's overseas branch program, establishment of official YouTube channels, multilingual websites, and e-catalogs to strengthen online promotion. Proactive response to customer demands through direct communication with existing key clients and visits to overseas customers. Achieved approximately $5 million in export contracts in the first half of 2024.
- Quality Management and Productivity Improvement: Direct execution of the entire process from design to manufacturing, processing solutions, training, and after-sales service, aiming for the highest level of customer satisfaction. Enhanced productivity and quality through long-term unmanned processing and minimization of human error.Quality Management and Productivity Improvement: Direct execution of the entire process from design to manufacturing, processing solutions, training, and after-sales service, aiming for the highest level of customer satisfaction. Enhanced productivity and quality through long-term unmanned processing and minimization of human error.
- Target Industrie
- Semiconductor Industry: Manufacturing equipment for processing key components like silicon electrodes and rings used in the semiconductor etching process. Utilization of processing technology for hard-to-machine materials such as silicon, SiC, quartz, and ceramics.Semiconductor Industry: Manufacturing equipment for processing key components like silicon electrodes and rings used in the semiconductor etching process. Utilization of processing technology for hard-to-machine materials such as silicon, SiC, quartz, and ceramics.
- Display Industry: Manufacturing equipment and processing related components for the display sector.Display Industry: Manufacturing equipment and processing related components for the display sector.
- Secondary Battery Industry: Processing of secondary battery components using ultra-precision micro-processing technology.Secondary Battery Industry: Processing of secondary battery components using ultra-precision micro-processing technology.
- Precision Machining Industry: Application in various precision machining fields, including equipment for rare earth permanent magnet processing.Precision Machining Industry: Application in various precision machining fields, including equipment for rare earth permanent magnet processing.
- Advanced Display (NanoLED) Sector: Selected as the leading company for a national project in the advanced display (NanoLED) sector in 2024.Advanced Display (NanoLED) Sector: Selected as the leading company for a national project in the advanced display (NanoLED) sector in 2024.
- Major Markets
- ChinaChina
- United StatesUnited States
- Certifications/Patents
- 17 patents and 1 utility model registered.17 patents and 1 utility model registered.
- Patent registration for Both Side Spindle Drilling Machine (2016).Patent registration for Both Side Spindle Drilling Machine (2016).
- Venture company certification (2008).Venture company certification (2008).
- INNO-BIZ (Technology Innovation Small and Medium Business) certification (2009).INNO-BIZ (Technology Innovation Small and Medium Business) certification (2009).
- Material, Parts, and Equipment Specialist Company certification.Material, Parts, and Equipment Specialist Company certification.
- Establishment of a corporate research institute (2009).Establishment of a corporate research institute (2009).
- KSA ISO 9001 certification (2008).KSA ISO 9001 certification (2008).
- Minister of SMEs and Startups Commendation Award (2024).Minister of SMEs and Startups Commendation Award (2024).
Introduction
Location
59 Dongjeonsandandong-ro, Buk-myeon, Uichang-gu, Changwon-si, Gyeongsangnam-do, South Korea
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