Information
48 Samsung 1-ro 4-gil, Hwaseong-si, Gyeonggi-do, South Korea
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Overview
- Summary
- PSK Inc. is a global leader in semiconductor manufacturing equipment, maintaining the top market share in plasma dry strip and dry cleaning processes. The company provides total solutions for photoresist and residue removal for next-generation semiconductor processes. With over 30 years of accumulated technological expertise, it consistently drives innovation in the semiconductor equipment industry.PSK Inc. is a global leader in semiconductor manufacturing equipment, maintaining the top market share in plasma dry strip and dry cleaning processes. The company provides total solutions for photoresist and residue removal for next-generation semiconductor processes. With over 30 years of accumulated technological expertise, it consistently drives innovation in the semiconductor equipment industry.
- Key Products/Technologies
- Key product lines include Dry Strip, Dry Cleaning, New Hard Mask (NHM) Strip, Bevel Etch, and Wafer Edge Clean equipment.Key product lines include Dry Strip, Dry Cleaning, New Hard Mask (NHM) Strip, Bevel Etch, and Wafer Edge Clean equipment.
- Dry strip equipment, such as the SUPRA series (SUPRA Vplus, SUPRA N, SUPRA Nm), offers stable dry strip processing with the world's largest market share.Dry strip equipment, such as the SUPRA series (SUPRA Vplus, SUPRA N, SUPRA Nm), offers stable dry strip processing with the world's largest market share.
- Dry cleaning equipment, including the INTEGER series (INTEGER plus, INTEGER XP) and ZIVIS II models, enables high-aspect ratio contact cleaning and patterning, meeting semiconductor cleaning process requirements below 65 nanometers.Dry cleaning equipment, including the INTEGER series (INTEGER plus, INTEGER XP) and ZIVIS II models, enables high-aspect ratio contact cleaning and patterning, meeting semiconductor cleaning process requirements below 65 nanometers.
- The New Hard Mask Strip equipment, OMNIS series, provides a solution for selectively removing films with high etching resistance, as well as underlying films like oxides and nitrides.The New Hard Mask Strip equipment, OMNIS series, provides a solution for selectively removing films with high etching resistance, as well as underlying films like oxides and nitrides.
- Wafer Edge Cleaning equipment, the PRECIA series, offers advantages in improving edge yield and achieving lower Cost of Ownership (CoO).Wafer Edge Cleaning equipment, the PRECIA series, offers advantages in improving edge yield and achieving lower Cost of Ownership (CoO).
- Other products include Tigma series, Ecolite series, DAS series, Profiler, and Futas, covering various semiconductor process equipment.Other products include Tigma series, Ecolite series, DAS series, Profiler, and Futas, covering various semiconductor process equipment.
- Core technologies encompass In-Situ Bake Process, Low Damage Microwave System, High Throughput, In-Line Wafer ID Trace, Field Proven HW/SW Reliability, compliance with SEMI standard Equipment Data Acquisition (EDA), and self-developed software PABIT (Predictive Analytics by Integrated Technology).Core technologies encompass In-Situ Bake Process, Low Damage Microwave System, High Throughput, In-Line Wafer ID Trace, Field Proven HW/SW Reliability, compliance with SEMI standard Equipment Data Acquisition (EDA), and self-developed software PABIT (Predictive Analytics by Integrated Technology).
- 3D IC packaging equipment offerings include plasma surface treatment, reflow systems, hot DI systems, and plasma sources.3D IC packaging equipment offerings include plasma surface treatment, reflow systems, hot DI systems, and plasma sources.
- Core Advantages
- Sustained global market share leadership in the plasma dry strip sector for over 30 years, based on accumulated technological expertise.Sustained global market share leadership in the plasma dry strip sector for over 30 years, based on accumulated technological expertise.
- Technological leadership in photoresist (PR) strip and dry cleaning equipment.Technological leadership in photoresist (PR) strip and dry cleaning equipment.
- Critical equipment supply capabilities for high-density 3D NAND flash memory production, securing a leading market position.Critical equipment supply capabilities for high-density 3D NAND flash memory production, securing a leading market position.
- Strong relationships and continuous joint technology development with major clients like Samsung and SK Hynix, fostering stable partnerships.Strong relationships and continuous joint technology development with major clients like Samsung and SK Hynix, fostering stable partnerships.
- A focused business model enabling agility and innovation, allowing for rapid adaptation to market changes.A focused business model enabling agility and innovation, allowing for rapid adaptation to market changes.
- Aggressive R&D investments, strategic marketing, strengthened process standardization, and human resource development as continuous growth drivers.Aggressive R&D investments, strategic marketing, strengthened process standardization, and human resource development as continuous growth drivers.
- A global network with 14 overseas offices, ensuring quick customer response and technical service provision.A global network with 14 overseas offices, ensuring quick customer response and technical service provision.
- Pivotal role in the 10nm-class DRAM semiconductor era by replacing Japanese dry cleaning equipment, demonstrating technological superiority.Pivotal role in the 10nm-class DRAM semiconductor era by replacing Japanese dry cleaning equipment, demonstrating technological superiority.
- Continuous capture of competitor market share, particularly benefiting from US-China trade tensions, further solidifying market position.Continuous capture of competitor market share, particularly benefiting from US-China trade tensions, further solidifying market position.
- Target Industrie
- Semiconductor industry in general.Semiconductor industry in general.
- Memory and Logic semiconductor mass production processes.Memory and Logic semiconductor mass production processes.
- High-density 3D NAND flash memory production.High-density 3D NAND flash memory production.
- 3D IC packaging processes.3D IC packaging processes.
- Next-generation semiconductor processes and micro-processes.Next-generation semiconductor processes and micro-processes.
- Major Markets
- South Korea, China, Japan, Singapore, TaiwanSouth Korea, China, Japan, Singapore, Taiwan
- IrelandIreland
- USAUSA
- Certifications/Patents
- Possession of 280 total patent documents (including applications and grants), with 106 granted patents.Possession of 280 total patent documents (including applications and grants), with 106 granted patents.
- Patent for "Apparatus for processing substrate" (US Patent No. 12562346, granted February 24, 2026).Patent for "Apparatus for processing substrate" (US Patent No. 12562346, granted February 24, 2026).
- Patent for "Substrate processing apparatus and substrate processing method" (US Patent No. 12424417, granted September 23, 2025).Patent for "Substrate processing apparatus and substrate processing method" (US Patent No. 12424417, granted September 23, 2025).
- Patent for "Support unit and substrate processing apparatus including same" (US Patent No. 12531216, granted January 20, 2026).Patent for "Support unit and substrate processing apparatus including same" (US Patent No. 12531216, granted January 20, 2026).
- Patent for "Substrate processing apparatus" (US Patent No. 11862434, granted January 2, 2024).Patent for "Substrate processing apparatus" (US Patent No. 11862434, granted January 2, 2024).
- Recipient of Intel's 2023 EPIC Distinguished Supplier Award.Recipient of Intel's 2023 EPIC Distinguished Supplier Award.
- Recipient of Intel's 2022 EPIC Valued Supplier Award (Quality category).Recipient of Intel's 2022 EPIC Valued Supplier Award (Quality category).
- Information Security Management System BSI registration certification (2010).Information Security Management System BSI registration certification (2010).
- Deloitte Technology Fast 50 Excellence Award (2005).Deloitte Technology Fast 50 Excellence Award (2005).
- Certification as a world-class manufacturing company.Certification as a world-class manufacturing company.
Introduction
Location
48 Samsung 1-ro 4-gil, Hwaseong-si, Gyeonggi-do, South Korea
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