PROTEC, The Republic of Korea - Komachine Supplier Profile and Product List

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Overview

- PROTEC, established in 1997, is a specialized manufacturer of semiconductor packaging equipment. The company has grown into a global leader in the semiconductor, LED, and SMT fields, primarily focusing on high-precision dispensing systems. It has expanded its business into laser bonding systems for next-generation semiconductor packaging, chip transfer equipment for MicroLED displays, and electromagnetic interference (EMI) shielding process equipment. Through continuous research and development and unique technological capabilities, PROTEC contributes to enhancing productivity and quality in advanced industries.PROTEC, established in 1997, is a specialized manufacturer of semiconductor packaging equipment. The company has grown into a global leader in the semiconductor, LED, and SMT fields, primarily focusing on high-precision dispensing systems. It has expanded its business into laser bonding systems for next-generation semiconductor packaging, chip transfer equipment for MicroLED displays, and electromagnetic interference (EMI) shielding process equipment. Through continuous research and development and unique technological capabilities, PROTEC contributes to enhancing productivity and quality in advanced industries.
- Dispensing System (FDS-1000, FDS-5000, FDS-5000DM, Wonder-S, Wonder-SD): Automated equipment for precise application of liquid materials like adhesives and solder paste in semiconductor packaging and SMT processes. Proprietary Piezo and diaphragm pump technologies enable ultra-fine dispensing at nanoliter (nL) levels and high repetitive precision.Dispensing System (FDS-1000, FDS-5000, FDS-5000DM, Wonder-S, Wonder-SD): Automated equipment for precise application of liquid materials like adhesives and solder paste in semiconductor packaging and SMT processes. Proprietary Piezo and diaphragm pump technologies enable ultra-fine dispensing at nanoliter (nL) levels and high repetitive precision.
- Large Board Dispensing System (Large Bard Dualflex Dispensing System): Dispensing solutions for large-sized substrates.Large Board Dispensing System (Large Bard Dualflex Dispensing System): Dispensing solutions for large-sized substrates.
- Die Bonder (Epoxy Die Bonder, Eutectic Die Bonder, Hybrid Die Bonder, PB-200L, PB-200LU, PPA-300): Equipment for picking and aligning chips from wafers and attaching them onto substrates/leadframes. Essential process equipment where precision and uniformity are critical.Die Bonder (Epoxy Die Bonder, Eutectic Die Bonder, Hybrid Die Bonder, PB-200L, PB-200LU, PPA-300): Equipment for picking and aligning chips from wafers and attaching them onto substrates/leadframes. Essential process equipment where precision and uniformity are critical.
- Laser Assisted Bonder (PLA-100, PLA-400RT, PRO-7020FC, PRO-2020, PRO-400, PRO-1020D, PH01-A, PH01-G, PH01-K): Advanced bonding equipment for next-generation semiconductor packaging technologies such as 3D-IC and Fan-Out Wafer Level Package (FO-WLP). Utilizes lasers as a heat source for fast and accurate chip bonding to substrates, achieving high alignment accuracy of ±2㎛. Particularly contributes to significantly improving production yield and reliability of high-performance semiconductors like HBM.Laser Assisted Bonder (PLA-100, PLA-400RT, PRO-7020FC, PRO-2020, PRO-400, PRO-1020D, PH01-A, PH01-G, PH01-K): Advanced bonding equipment for next-generation semiconductor packaging technologies such as 3D-IC and Fan-Out Wafer Level Package (FO-WLP). Utilizes lasers as a heat source for fast and accurate chip bonding to substrates, achieving high alignment accuracy of ±2㎛. Particularly contributes to significantly improving production yield and reliability of high-performance semiconductors like HBM.
- Flip-chip Attach system (PRO-7020FC): System for bonding chips to substrates in flip-chip bonding processes.Flip-chip Attach system (PRO-7020FC): System for bonding chips to substrates in flip-chip bonding processes.
- LID Attach system (PRO-2020): System for precise attachment of LID components.LID Attach system (PRO-2020): System for precise attachment of LID components.
- Chip Transfer Equipment for MicroLED Displays: Possesses laser transfer technology for rapidly and accurately transferring millions of micro-LED chips to desired positions on display substrates.Chip Transfer Equipment for MicroLED Displays: Possesses laser transfer technology for rapidly and accurately transferring millions of micro-LED chips to desired positions on display substrates.
- Electromagnetic Interference (EMI) Shielding Process Equipment: Technology for supplying EMI shielding process equipment for iPhone semiconductors to SK Hynix. Manufactures and sells spray-type EMI shielding devices.Electromagnetic Interference (EMI) Shielding Process Equipment: Technology for supplying EMI shielding process equipment for iPhone semiconductors to SK Hynix. Manufactures and sells spray-type EMI shielding devices.
- Automated Pneumatic Components (Rotary Joint, PRJ, Check Valve, PCV, General Hand PH05-30): Through its Pneumatic business unit, manufactures and supplies pneumatic cylinders and automated pneumatic components for various industrial production lines.Automated Pneumatic Components (Rotary Joint, PRJ, Check Valve, PCV, General Hand PH05-30): Through its Pneumatic business unit, manufactures and supplies pneumatic cylinders and automated pneumatic components for various industrial production lines.
- Unrivaled Dispensing Technology: Possesses high-performance Piezo pump and control technology capable of ultra-fine dispensing at nanoliter (nL) levels. Ensures high repetitive precision through a Full Closed-Loop motion control system and offers flexibility to handle various materials. Maintains a global leading position in the domestic dispenser market, holding an 80% market share in Korea.Unrivaled Dispensing Technology: Possesses high-performance Piezo pump and control technology capable of ultra-fine dispensing at nanoliter (nL) levels. Ensures high repetitive precision through a Full Closed-Loop motion control system and offers flexibility to handle various materials. Maintains a global leading position in the domestic dispenser market, holding an 80% market share in Korea.
- Leadership in Next-Generation Semiconductor Packaging Technology: Continuously develops innovative equipment solutions such as laser bonding systems and MicroLED chip transfer equipment, aligning with the growth of high-value-added semiconductor markets like HBM. The laser bonder, in particular, offers advantages over traditional thermo-compression (TC) bonders by reducing heat exposure time and minimizing PCB warpage, thereby increasing productivity and yield.Leadership in Next-Generation Semiconductor Packaging Technology: Continuously develops innovative equipment solutions such as laser bonding systems and MicroLED chip transfer equipment, aligning with the growth of high-value-added semiconductor markets like HBM. The laser bonder, in particular, offers advantages over traditional thermo-compression (TC) bonders by reducing heat exposure time and minimizing PCB warpage, thereby increasing productivity and yield.
- Extensive Customer Network and Business Diversification: Secures major domestic and international semiconductor and electronics companies as clients, including Samsung Electronics, SK Hynix, LG Electronics, Amkor Technology, ASE Korea, and StatsChipPAC Korea. Diversifies its business portfolio through the development of new equipment beyond dispensers, such as die bonders, laser reflow, micro solder ball attach, semiconductor logistics equipment, and EMI shielding.Extensive Customer Network and Business Diversification: Secures major domestic and international semiconductor and electronics companies as clients, including Samsung Electronics, SK Hynix, LG Electronics, Amkor Technology, ASE Korea, and StatsChipPAC Korea. Diversifies its business portfolio through the development of new equipment beyond dispensers, such as die bonders, laser reflow, micro solder ball attach, semiconductor logistics equipment, and EMI shielding.
- Continuous Research and Development and Patent Acquisition: Holds numerous patents, including 162 domestic patents and 112 international patents, and has accumulated unique technological capabilities through government R&D projects. Acquired patents related to semiconductor chip manufacturing dispenser devices and dispensing methods.Continuous Research and Development and Patent Acquisition: Holds numerous patents, including 162 domestic patents and 112 international patents, and has accumulated unique technological capabilities through government R&D projects. Acquired patents related to semiconductor chip manufacturing dispenser devices and dispensing methods.
- Global Market Entry and Competitiveness: The only domestic company in the LED dispenser field to successfully expand overseas. Competes with foreign companies by entering markets in Singapore and Taiwan through ATS and Goloconda. Strengthens its position within the global microelectronics ecosystem as a SEMI member.Global Market Entry and Competitiveness: The only domestic company in the LED dispenser field to successfully expand overseas. Competes with foreign companies by entering markets in Singapore and Taiwan through ATS and Goloconda. Strengthens its position within the global microelectronics ecosystem as a SEMI member.
- Semiconductor Industry: Semiconductor packaging, back-end processes, 3D-IC, Fan-Out Wafer Level Package (FO-WLP), HBM (High Bandwidth Memory) production processes.Semiconductor Industry: Semiconductor packaging, back-end processes, 3D-IC, Fan-Out Wafer Level Package (FO-WLP), HBM (High Bandwidth Memory) production processes.
- Display Industry: MicroLED display production, LED dispensing and packaging.Display Industry: MicroLED display production, LED dispensing and packaging.
- Mobile/SMT Industry: Smart device manufacturing, Surface Mount Technology (SMT), chip attachment and protective material coating for smartphone PCBs, camera lens perimeter bonding, wearable device sealing, and smartphone waterproofing.Mobile/SMT Industry: Smart device manufacturing, Surface Mount Technology (SMT), chip attachment and protective material coating for smartphone PCBs, camera lens perimeter bonding, wearable device sealing, and smartphone waterproofing.
- Electronics/Medical Device Industry: Utilization of dispensers for high resolution and accuracy due to component miniaturization.Electronics/Medical Device Industry: Utilization of dispensers for high resolution and accuracy due to component miniaturization.
- Automation Industry: Supply of pneumatic cylinders and automated pneumatic components to various industrial production lines.Automation Industry: Supply of pneumatic cylinders and automated pneumatic components to various industrial production lines.
- South Korea, Singapore, Taiwan, ChinaSouth Korea, Singapore, Taiwan, China
- Holds 162 domestic patents and 112 international patents.Holds 162 domestic patents and 112 international patents.
- Acquired patent for semiconductor chip manufacturing dispenser device (October 20, 2008).Acquired patent for semiconductor chip manufacturing dispenser device (October 20, 2008).
- Acquired patent for semiconductor chip manufacturing dispensing method and its dispenser device (December 15, 2006).Acquired patent for semiconductor chip manufacturing dispensing method and its dispenser device (December 15, 2006).
- ISO 14001:2015 Environmental Management System certification.ISO 14001:2015 Environmental Management System certification.
- ISO 45001:2018 Occupational Health and Safety Management System certification.ISO 45001:2018 Occupational Health and Safety Management System certification.
- ISO 9001:2015 Quality Management System certification.ISO 9001:2015 Quality Management System certification.
- Possesses excellent R&D personnel through certified corporate research institute.Possesses excellent R&D personnel through certified corporate research institute.