POWEL CORPORATION, established in 1999, a specialized company for core devices and components in the semiconductor, secondary battery, and power semiconductor sectors. Its main focus on the development and supply of Electrostatic Chucks (ESC), an essential component in semiconductor processes. A technology innovation company, notably the world's first to develop the Plasma Density Sensor Embedded ESC (PDS ESC). Possession of non-contact transfer rollers for secondary battery and display industries, along with bonding technology for power semiconductors, indicating a diversified business structure.POWELCORPORATION,establishedin1999,aspecializedcompanyforcoredevicesandcomponentsinthesemiconductor,secondarybattery,andpowersemiconductorsectors.ItsmainfocusonthedevelopmentandsupplyofElectrostaticChucks(ESC),anessentialcomponentinsemiconductorprocesses.Atechnologyinnovationcompany,notablytheworld'sfirsttodevelopthePlasmaDensitySensorEmbeddedESC(PDSESC).Possessionofnon-contacttransferrollersforsecondarybatteryanddisplayindustries,alongwithbondingtechnologyforpowersemiconductors,indicatingadiversifiedbusinessstructure.
Key Products/TechnologiesKeyProducts/Technologies
Semiconductor Business Division: Development and supply of Electrostatic Chucks (ESC) for precise silicon wafer fixation using electrostatic force in semiconductor dry etching processes. Products composed of aluminum bases and ceramic plates, with capabilities in developing multi-zone ESC products including heaters. Possession of the world's first PDS ESC (Plasma Density Sensor Embedded ESC) technology for real-time plasma density measurement during the process. The PDS ESC as an innovative solution for diagnosing plasma conditions at the center, middle, and edge without opening the chamber. Key product offerings also include power supply units for stable power to ESCs, ALN heaters for rapid heating and uniform temperature distribution, and porous chucks utilizing non-contact adsorption systems. Development of various semiconductor-related components and solutions, including ion sources, inspection equipment, and embedded items.SemiconductorBusinessDivision:DevelopmentandsupplyofElectrostaticChucks(ESC)forprecisesiliconwaferfixationusingelectrostaticforceinsemiconductordryetchingprocesses.Productscomposedofaluminumbasesandceramicplates,withcapabilitiesindevelopingmulti-zoneESCproductsincludingheaters.Possessionoftheworld'sfirstPDSESC(PlasmaDensitySensorEmbeddedESC)technologyforreal-timeplasmadensitymeasurementduringtheprocess.ThePDSESCasaninnovativesolutionfordiagnosingplasmaconditionsatthecenter,middle,andedgewithoutopeningthechamber.KeyproductofferingsalsoincludepowersupplyunitsforstablepowertoESCs,ALNheatersforrapidheatinganduniformtemperaturedistribution,andporouschucksutilizingnon-contactadsorptionsystems.Developmentofvarioussemiconductor-relatedcomponentsandsolutions,includingionsources,inspectionequipment,andembeddeditems.
Secondary Battery/Display Business Division: Production of Air Bearing Rollers (ABR) and Suction Rollers (SR) made from high-purity carbon materials. Application of non-contact transfer technology minimizing damage, contamination, scratches, wrinkles, and distortions during the transfer of thin film materials. Contribution to yield improvement for secondary battery and film production companies by replacing conventional metal rollers in Roll-to-Roll equipment. Active engagement in mass production tests with domestic and international secondary battery manufacturers.SecondaryBattery/DisplayBusinessDivision:ProductionofAirBearingRollers(ABR)andSuctionRollers(SR)madefromhigh-puritycarbonmaterials.Applicationofnon-contacttransfertechnologyminimizingdamage,contamination,scratches,wrinkles,anddistortionsduringthetransferofthinfilmmaterials.ContributiontoyieldimprovementforsecondarybatteryandfilmproductioncompaniesbyreplacingconventionalmetalrollersinRoll-to-Rollequipment.Activeengagementinmassproductiontestswithdomesticandinternationalsecondarybatterymanufacturers.
Power Semiconductor Business Division: Development of metal powders, pastes, and bonding technologies required for Direct Bonded Copper (DBC) module bonding for Insulated Gate Bipolar Transistors (IGBTs). Development of copper-based Die Attach Copper Paste (DACP) technology as a substitute for expensive silver, addressing changes in the power semiconductor market.PowerSemiconductorBusinessDivision:Developmentofmetalpowders,pastes,andbondingtechnologiesrequiredforDirectBondedCopper(DBC)modulebondingforInsulatedGateBipolarTransistors(IGBTs).Developmentofcopper-basedDieAttachCopperPaste(DACP)technologyasasubstituteforexpensivesilver,addressingchangesinthepowersemiconductormarket.
Core AdvantagesCoreAdvantages
World's First PDS ESC Development: The world's first development of PDS ESC for real-time plasma density measurement during semiconductor processes, contributing to yield improvement and smart process management based on predictive maintenance. This technology provides an innovative solution overcoming the limitations of conventional methods.World'sFirstPDSESCDevelopment:Theworld'sfirstdevelopmentofPDSESCforreal-timeplasmadensitymeasurementduringsemiconductorprocesses,contributingtoyieldimprovementandsmartprocessmanagementbasedonpredictivemaintenance.Thistechnologyprovidesaninnovativesolutionovercomingthelimitationsofconventionalmethods.
Localization of Core Components and Technology Internalization: Successful independent development and localization of semiconductor ESCs, previously reliant on Japanese imports. A strategy of accelerating technology internalization from raw materials to core components, ensuring supply chain stability and enhancing competitiveness.LocalizationofCoreComponentsandTechnologyInternalization:SuccessfulindependentdevelopmentandlocalizationofsemiconductorESCs,previouslyreliantonJapaneseimports.Astrategyofacceleratingtechnologyinternalizationfromrawmaterialstocorecomponents,ensuringsupplychainstabilityandenhancingcompetitiveness.
Technology Expansion into Diverse Advanced Industries: Successful integration and expansion of core technologies into future growth industries such as secondary batteries, displays, and power semiconductors, beyond semiconductors. This diversification reduces reliance on specific industries and establishes a stable growth foundation.TechnologyExpansionintoDiverseAdvancedIndustries:Successfulintegrationandexpansionofcoretechnologiesintofuturegrowthindustriessuchassecondarybatteries,displays,andpowersemiconductors,beyondsemiconductors.Thisdiversificationreducesrelianceonspecificindustriesandestablishesastablegrowthfoundation.
Customer-Tailored and Collaborative Development Capabilities: Flexible response capabilities through collaborative development of high-functional ESC products with complex electrode designs and precise temperature control features, meeting specific customer requirements. A management philosophy centered on maximizing customer satisfaction.Customer-TailoredandCollaborativeDevelopmentCapabilities:Flexibleresponsecapabilitiesthroughcollaborativedevelopmentofhigh-functionalESCproductswithcomplexelectrodedesignsandprecisetemperaturecontrolfeatures,meetingspecificcustomerrequirements.Amanagementphilosophycenteredonmaximizingcustomersatisfaction.
Non-Contact Transfer Technology Based on High-Purity Materials: Unique transfer technology utilizing high-purity carbon materials for Air Bearing Rollers and Suction Rollers, minimizing damage to thin film materials. Proven effectiveness in improving secondary battery production yield by up to 35%, leading the next-generation roller market.Non-ContactTransferTechnologyBasedonHigh-PurityMaterials:Uniquetransfertechnologyutilizinghigh-puritycarbonmaterialsforAirBearingRollersandSuctionRollers,minimizingdamagetothinfilmmaterials.Proveneffectivenessinimprovingsecondarybatteryproductionyieldbyupto35%,leadingthenext-generationrollermarket.
Continuous R&D and Future Market Preemption Efforts: Ongoing pursuit of innovation through investments in ESC repair fabs, technology development for HBM market entry, and a target for mass production of power semiconductor sintering materials by 2027. A clear vision for achieving 100 billion KRW in sales and pursuing listing.ContinuousR&DandFutureMarketPreemptionEfforts:OngoingpursuitofinnovationthroughinvestmentsinESCrepairfabs,technologydevelopmentforHBMmarketentry,andatargetformassproductionofpowersemiconductorsinteringmaterialsby2027.Aclearvisionforachieving100billionKRWinsalesandpursuinglisting.
Recognition of Superior Technology and Awards: A company recognized for its technological prowess and growth potential through 5 consecutive years of winning the 'Korea Promising SME Award' in the AI semiconductor manufacturing equipment, materials, and parts sector from 2023 to 2025.RecognitionofSuperiorTechnologyandAwards:Acompanyrecognizedforitstechnologicalprowessandgrowthpotentialthrough5consecutiveyearsofwinningthe'KoreaPromisingSMEAward'intheAIsemiconductormanufacturingequipment,materials,andpartssectorfrom2023to2025.
Display Industry: FPD (Flat Panel Display) processes, film production.DisplayIndustry:FPD(FlatPanelDisplay)processes,filmproduction.
Secondary Battery Industry: Secondary battery production lines, Roll-to-Roll equipment.SecondaryBatteryIndustry:Secondarybatteryproductionlines,Roll-to-Rollequipment.
Power Semiconductor Industry: Manufacturing of IGBT (Insulated Gate Bipolar Transistor) and SiC (Silicon Carbide) based power semiconductors.PowerSemiconductorIndustry:ManufacturingofIGBT(InsulatedGateBipolarTransistor)andSiC(SiliconCarbide)basedpowersemiconductors.
General Home Appliances and Automotive Industries: Manufacturing processes for various industrial and consumer products.GeneralHomeAppliancesandAutomotiveIndustries:Manufacturingprocessesforvariousindustrialandconsumerproducts.
Major MarketsMajorMarkets
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Certifications/PatentsCertifications/Patents
Patents: Patents related to plasma-embedded electrostatic chucks. Domestic patent application and registration, and patent applications in 5 major countries for real-time plasma measurement ESC technology. Patent certificate for display panel taping system. Patent for battery charging device, battery pack, battery charging system, and charging method.Patents:Patentsrelatedtoplasma-embeddedelectrostaticchucks.Domesticpatentapplicationandregistration,andpatentapplicationsin5majorcountriesforreal-timeplasmameasurementESCtechnology.Patentcertificatefordisplaypaneltapingsystem.Patentforbatterychargingdevice,batterypack,batterychargingsystem,andchargingmethod.
Awards: 2023 'Korea Promising SME Award' in the semiconductor measurement component material development sector. 2024 'Korea Promising SME Award' in the AI semiconductor manufacturing equipment, materials, and parts sector. 2025 'Korea Promising SME Award' in the AI semiconductor manufacturing equipment, materials, and parts sector. (A company awarded for 5 consecutive years).Awards:2023'KoreaPromisingSMEAward'inthesemiconductormeasurementcomponentmaterialdevelopmentsector.2024'KoreaPromisingSMEAward'intheAIsemiconductormanufacturingequipment,materials,andpartssector.2025'KoreaPromisingSMEAward'intheAIsemiconductormanufacturingequipment,materials,andpartssector.(Acompanyawardedfor5consecutiveyears).
Introduction
Location
G-7F, South Korea, Gyeonggi-do, Gwacheon-si, Gwacheon-daero, 12 길 117
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G-7F, South Korea, Gyeonggi-do, Gwacheon-si, Gwacheon-daero, 12 길 117