Information
18-5 Angung 2-gil, Seonghwan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
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Overview
- Summary
- OPTIFLEX Co., Ltd. is a company providing various solutions necessary for the Photo Lithography process. A specialized company supplying optimal manufacturing equipment for fine pattern realization, including wafer UV exposure machines and RTR double-sided automatic exposure machines. Possessing capabilities to support effective process configuration and reduce review time based on years of diverse experience both domestically and internationally. A company focused on the development and supply of core equipment for the semiconductor and display industries.OPTIFLEX Co., Ltd. is a company providing various solutions necessary for the Photo Lithography process. A specialized company supplying optimal manufacturing equipment for fine pattern realization, including wafer UV exposure machines and RTR double-sided automatic exposure machines. Possessing capabilities to support effective process configuration and reduce review time based on years of diverse experience both domestically and internationally. A company focused on the development and supply of core equipment for the semiconductor and display industries.
- Key Products/Technologies
- Wafer UV Exposure Machine: Applicable to 6, 8, 12-inch wafers, Working Size 150x150, 200x200, 300x300mm, Thickness 0.1~1.0mm, Intensity 30mW/㎠, Uniformity 92%, supporting Contact modes (Hard/Soft/Proximity).Wafer UV Exposure Machine: Applicable to 6, 8, 12-inch wafers, Working Size 150x150, 200x200, 300x300mm, Thickness 0.1~1.0mm, Intensity 30mW/㎠, Uniformity 92%, supporting Contact modes (Hard/Soft/Proximity).
- Roll To Roll Double Side Auto Exposure (RCS5-5050DWS): RTR double-sided automatic exposure machine, 5KW parallel light, equipment size W3,400 x D2,240 x H2,400(mm), applicable to Rolled Flexible PCB materials (Size 250x300mm ~ 500xW500mm, Thickness 0.05~0.5mm), 4-point CCD alignment method, Align Accuracy ±10㎛.Roll To Roll Double Side Auto Exposure (RCS5-5050DWS): RTR double-sided automatic exposure machine, 5KW parallel light, equipment size W3,400 x D2,240 x H2,400(mm), applicable to Rolled Flexible PCB materials (Size 250x300mm ~ 500xW500mm, Thickness 0.05~0.5mm), 4-point CCD alignment method, Align Accuracy ±10㎛.
- Mask Aligner (Wafer): Equipment for photolithography processes essential for manufacturing miniature semiconductor devices.Mask Aligner (Wafer): Equipment for photolithography processes essential for manufacturing miniature semiconductor devices.
- UV LED Light Source: Comprising UV LED Unit, Power Supply, and Chiller (Option), Working Size 150x150mm, 300x300mm, Wavelength 365nm or 395nm, Uniformity ≥90%, Collimation Angle (CA) ≤1.5˚.UV LED Light Source: Comprising UV LED Unit, Power Supply, and Chiller (Option), Working Size 150x150mm, 300x300mm, Wavelength 365nm or 395nm, Uniformity ≥90%, Collimation Angle (CA) ≤1.5˚.
- AI Machine Vision: Various vision inspection and measurement equipment solutions such as OLED/HIAA Hole inspection/microscope, OCR label inspector, Zygo PV measuring instrument, and AI drum internal liquid leak vision inspector.AI Machine Vision: Various vision inspection and measurement equipment solutions such as OLED/HIAA Hole inspection/microscope, OCR label inspector, Zygo PV measuring instrument, and AI drum internal liquid leak vision inspector.
- Other exposure and related equipment including Sheet single-sided automatic exposure machine, Vertical Type RTR Exposure, Long-Flex Auto Exposure, Glass double-sided automatic exposure machine, Thin Glass Screen Print System, Auto Peeler (RPCB), and fully automatic and semi-automatic vacuum laminators.Other exposure and related equipment including Sheet single-sided automatic exposure machine, Vertical Type RTR Exposure, Long-Flex Auto Exposure, Glass double-sided automatic exposure machine, Thin Glass Screen Print System, Auto Peeler (RPCB), and fully automatic and semi-automatic vacuum laminators.
- Core Advantages
- Capability to provide diverse solutions across the entire Photo Lithography process.Capability to provide diverse solutions across the entire Photo Lithography process.
- Possession of a wide range of exposure machine product lines compatible with various substrates such as wafers, FPCBs, and glass.Possession of a wide range of exposure machine product lines compatible with various substrates such as wafers, FPCBs, and glass.
- Advanced automatic exposure machine technology like the Roll To Roll Double Side Auto Exposure (RCS5-5050DWS), with proven performance utilized by clients for Apple-bound FPCB production.Advanced automatic exposure machine technology like the Roll To Roll Double Side Auto Exposure (RCS5-5050DWS), with proven performance utilized by clients for Apple-bound FPCB production.
- Precise exposure control capabilities through UV LED light source technology, maintaining high uniformity and collimation angle.Precise exposure control capabilities through UV LED light source technology, maintaining high uniformity and collimation angle.
- Enhancement of process efficiency through the provision of precision inspection and measurement equipment utilizing AI Machine Vision technology.Enhancement of process efficiency through the provision of precision inspection and measurement equipment utilizing AI Machine Vision technology.
- Prompt technological development and product supply capabilities in response to the latest industry trends, including orders for power semiconductor AMB substrate equipment and shipments of thin-film laminators for TGV.Prompt technological development and product supply capabilities in response to the latest industry trends, including orders for power semiconductor AMB substrate equipment and shipments of thin-film laminators for TGV.
- Expertise in supplying optimized equipment for fine pattern realization based on years of domestic and international experience.Expertise in supplying optimized equipment for fine pattern realization based on years of domestic and international experience.
- Target Industrie
- Semiconductor Industry: Fine pattern formation processes through wafer exposure machines and mask aligners.Semiconductor Industry: Fine pattern formation processes through wafer exposure machines and mask aligners.
- Display Industry: Hole inspection and exposure processes in OLED and HIAA fields.Display Industry: Hole inspection and exposure processes in OLED and HIAA fields.
- FPCB (Flexible Printed Circuit Board) Industry: Production of flexible substrates using Roll To Roll double-sided automatic exposure machines.FPCB (Flexible Printed Circuit Board) Industry: Production of flexible substrates using Roll To Roll double-sided automatic exposure machines.
- Power Semiconductor Industry: Support for next-generation semiconductor manufacturing through the supply of AMB substrate equipment.Power Semiconductor Industry: Support for next-generation semiconductor manufacturing through the supply of AMB substrate equipment.
- Solar Energy Industry: Application of PV measuring instruments and solar exposure machine related technologies.Solar Energy Industry: Application of PV measuring instruments and solar exposure machine related technologies.
- Specialty Glass Industry: Application of UTG/UFG equipment and Thin Glass Screen Print Systems.Specialty Glass Industry: Application of UTG/UFG equipment and Thin Glass Screen Print Systems.
- Major Markets
- China: Indication of sales activities and participation in HKPCA exhibition.China: Indication of sales activities and participation in HKPCA exhibition.
- Certifications/Patents
- Awarded the 'Export Tower' at the 60th Trade Day.Awarded the 'Export Tower' at the 60th Trade Day.
Introduction
Location
18-5 Angung 2-gil, Seonghwan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
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