MIMCERAMICS, The Republic of Korea - Komachine Supplier Profile and Product List

- MIMCERAMICS CO., LTD. is a specialized manufacturer of precision ceramic components for electrical and electronic parts, established in 2000, leveraging innovative ceramic molding and sub-micrometer precision processing technologies to supply various high-performance ceramic componentsMIMCERAMICS CO., LTD. is a specialized manufacturer of precision ceramic components for electrical and electronic parts, established in 2000, leveraging innovative ceramic molding and sub-micrometer precision processing technologies to supply various high-performance ceramic components
- A diverse range of precision ceramic products for electrical and electronic components, including Ceramic Slit for LCD Probe, Memory Probe Block, Micron Size Ceramic Hole, Ceramic Ink Jet Nozzle Array, Square Holes, Bonding Tip, Ceramic Lid (Ceramic Air Package), Epoxy Ceramic Lid, Ceramic Substrate for LED, and Ceramic Chip DeviceA diverse range of precision ceramic products for electrical and electronic components, including Ceramic Slit for LCD Probe, Memory Probe Block, Micron Size Ceramic Hole, Ceramic Ink Jet Nozzle Array, Square Holes, Bonding Tip, Ceramic Lid (Ceramic Air Package), Epoxy Ceramic Lid, Ceramic Substrate for LED, and Ceramic Chip Device
- Production capabilities for specialized ceramic materials and components such as Ceramic Part for Inductor, Alumina Crucible (Micro-Pan), and Dielectric CeramicProduction capabilities for specialized ceramic materials and components such as Ceramic Part for Inductor, Alumina Crucible (Micro-Pan), and Dielectric Ceramic
- Possession of innovative ceramic molding technology and sub-micrometer precision processing technology as core competenciesPossession of innovative ceramic molding technology and sub-micrometer precision processing technology as core competencies
- Specifically, the 'precision dimensional control by positive pressure molding press' technology achieves world-class standards, enabling production from small 2.0x1.5x1.0mm to large 1x1 inch components with a thickness deviation of ±10㎛ and warpage within 10㎛Specifically, the 'precision dimensional control by positive pressure molding press' technology achieves world-class standards, enabling production from small 2.0x1.5x1.0mm to large 1x1 inch components with a thickness deviation of ±10㎛ and warpage within 10㎛
- This precision molding technology is crucial for manufacturing high-precision electronic components like surface-mounted ceramic resonators for wireless signal filtering, Surface Acoustic Wave (SAW) filters, and RF module packagingThis precision molding technology is crucial for manufacturing high-precision electronic components like surface-mounted ceramic resonators for wireless signal filtering, Surface Acoustic Wave (SAW) filters, and RF module packaging
- Specialization in precision ceramic manufacturing based on innovative ceramic molding technologies accumulated since its establishment in 2000Specialization in precision ceramic manufacturing based on innovative ceramic molding technologies accumulated since its establishment in 2000
- Flexible response capability to diverse and complex customer requirements through secured ultra-precision processing technology at the sub-micrometer levelFlexible response capability to diverse and complex customer requirements through secured ultra-precision processing technology at the sub-micrometer level
- Proprietary competitive advantage of 'precision dimensional control by positive pressure molding press' technology, with patent applications pending in the US, Korea, and ChinaProprietary competitive advantage of 'precision dimensional control by positive pressure molding press' technology, with patent applications pending in the US, Korea, and China
- Stable mass production system for small and large ceramic components with strict dimensional accuracy, including thickness deviation of ±10㎛ and warpage within 10㎛Stable mass production system for small and large ceramic components with strict dimensional accuracy, including thickness deviation of ±10㎛ and warpage within 10㎛
- Technological strength to proactively address the accelerating miniaturization and surface mounting of electronic components, as well as the increasing demand for low-cost SAW componentsTechnological strength to proactively address the accelerating miniaturization and surface mounting of electronic components, as well as the increasing demand for low-cost SAW components
- Efficient production processes contributing to cost reduction in manufacturing surface-mounted components such as ceramic resonators and high-frequency modulesEfficient production processes contributing to cost reduction in manufacturing surface-mounted components such as ceramic resonators and high-frequency modules
- General electrical and electronic component industriesGeneral electrical and electronic component industries
- Display industry (Ceramic Slit for LCD Probe Unit)Display industry (Ceramic Slit for LCD Probe Unit)
- Semiconductor industry (Memory Probe Block, Ceramic Chip Device, CCD package for solid-state imaging devices)Semiconductor industry (Memory Probe Block, Ceramic Chip Device, CCD package for solid-state imaging devices)
- LED lighting and display industries (Ceramic Substrate for LED)LED lighting and display industries (Ceramic Substrate for LED)
- RF communication and high-frequency module industries (Ceramic Lid, SAW filters, RF module packaging)RF communication and high-frequency module industries (Ceramic Lid, SAW filters, RF module packaging)
- Precision medical instruments and implants (potential application of MIM ceramic technology)Precision medical instruments and implants (potential application of MIM ceramic technology)
- TaiwanTaiwan
- Patent applications pending in the US, Korea, and China for 'precision dimensional control by positive pressure molding press' technologyPatent applications pending in the US, Korea, and China for 'precision dimensional control by positive pressure molding press' technology
- Possession of technology for developing ceramic lids for solid-state imaging device (CCD) packages, utilizing multi-layer ceramic substrates and powder molding methodsPossession of technology for developing ceramic lids for solid-state imaging device (CCD) packages, utilizing multi-layer ceramic substrates and powder molding methods