LEENO INDUSTRIAL, The Republic of Korea - Komachine Supplier Profile and Product List

- LEENO INDUSTRIAL, established in 1978, is a manufacturer of essential components for PCB and semiconductor IC inspection equipment. The company primarily produces its own branded LEENO PINs and IC Test Sockets. It supplies consumable parts for checking electrical defects in semiconductor testing processes and also operates in the medical equipment component business. The company specializes in multi-product, small-batch, and customized production, particularly for the non-memory semiconductor R&D market.LEENO INDUSTRIAL, established in 1978, is a manufacturer of essential components for PCB and semiconductor IC inspection equipment. The company primarily produces its own branded LEENO PINs and IC Test Sockets. It supplies consumable parts for checking electrical defects in semiconductor testing processes and also operates in the medical equipment component business. The company specializes in multi-product, small-batch, and customized production, particularly for the non-memory semiconductor R&D market.
- LEENO PIN: Consumable parts for checking electrical defects in semiconductors and Printed Circuit Boards (PCBs). Possesses world-class technology for manufacturing ultra-fine test pins as thin as 0.075mm. A key product holding a 70% share in the wafer test ultra-precision test pin market.LEENO PIN: Consumable parts for checking electrical defects in semiconductors and Printed Circuit Boards (PCBs). Possesses world-class technology for manufacturing ultra-fine test pins as thin as 0.075mm. A key product holding a 70% share in the wafer test ultra-precision test pin market.
- IC Test Socket: Essential components that securely hold semiconductor chips and transmit electrical signals. Offers comprehensive test socket solutions for various package types (BGA, LGA, QFN, QFP, CSP, TSOP, SOP), including Logic Test Socket, RF Socket, Memory Test Socket, Elastomer Socket, Camera Module Socket, and SLT Socket. Capable of handling pitches of 0.25P or more.IC Test Socket: Essential components that securely hold semiconductor chips and transmit electrical signals. Offers comprehensive test socket solutions for various package types (BGA, LGA, QFN, QFP, CSP, TSOP, SOP), including Logic Test Socket, RF Socket, Memory Test Socket, Elastomer Socket, Camera Module Socket, and SLT Socket. Capable of handling pitches of 0.25P or more.
- Medical Equipment Components: Self-produces core components used in ultrasound diagnostic equipment. Utilizes micro-processing know-how accumulated from semiconductor manufacturing equipment, providing a differentiated competitive edge in the medical equipment sector.Medical Equipment Components: Self-produces core components used in ultrasound diagnostic equipment. Utilizes micro-processing know-how accumulated from semiconductor manufacturing equipment, providing a differentiated competitive edge in the medical equipment sector.
- Probe Head: Provides various test-related products such as WLCSP probe cards and secondary charge/discharge battery probes. Actively developing probe cards for wafer-level packaging and advancing micro-pitch probe card technology.Probe Head: Provides various test-related products such as WLCSP probe cards and secondary charge/discharge battery probes. Actively developing probe cards for wafer-level packaging and advancing micro-pitch probe card technology.
- High-Performance Socket Technology: Possesses micro-process response technology to meet the increasing demand for high-performance sockets for AI chips (TPU, GPU). Developing 100GHz compatible sockets and securing Short Signal Length pin manufacturing technology. Developing SI/PI performance-enhanced sockets with new materials to meet customer demands for next-generation HI SPEED/low-power product testing.High-Performance Socket Technology: Possesses micro-process response technology to meet the increasing demand for high-performance sockets for AI chips (TPU, GPU). Developing 100GHz compatible sockets and securing Short Signal Length pin manufacturing technology. Developing SI/PI performance-enhanced sockets with new materials to meet customer demands for next-generation HI SPEED/low-power product testing.
- Vertically Integrated Production System: Possesses technology for in-house production of all processes, from product design to precision machining, plating, and assembly. This ensures stable quality, cost reduction, and quick delivery response.Vertically Integrated Production System: Possesses technology for in-house production of all processes, from product design to precision machining, plating, and assembly. This ensures stable quality, cost reduction, and quick delivery response.
- Ultra-Precision Micro-Processing Technology: World-class technology capable of manufacturing test pins as thin as 0.075mm. Essential for producing high-precision test pins and sockets required by the semiconductor miniaturization trend.Ultra-Precision Micro-Processing Technology: World-class technology capable of manufacturing test pins as thin as 0.075mm. Essential for producing high-precision test pins and sockets required by the semiconductor miniaturization trend.
- Multi-Product, Small-Batch Production and Customization Capabilities: Ability to develop and supply sockets in a timely manner according to customer's R&D and mass production chip designs. A differentiated business model focusing on the high-value-added non-memory R&D market.Multi-Product, Small-Batch Production and Customization Capabilities: Ability to develop and supply sockets in a timely manner according to customer's R&D and mass production chip designs. A differentiated business model focusing on the high-value-added non-memory R&D market.
- High Market Share and Exceptional Profitability: Holds over 70% global market share in the ultra-precision test pin market for wafer testing. Achieves impressive operating profit margins in the high 40s (49.8% as of Q3 2025).High Market Share and Exceptional Profitability: Holds over 70% global market share in the ultra-precision test pin market for wafer testing. Achieves impressive operating profit margins in the high 40s (49.8% as of Q3 2025).
- Global Customer Network: Secures over 1,000 global semiconductor companies as clients, including Samsung Electronics, SK Hynix, Qualcomm, Microsoft, TSMC, and NVIDIA.Global Customer Network: Secures over 1,000 global semiconductor companies as clients, including Samsung Electronics, SK Hynix, Qualcomm, Microsoft, TSMC, and NVIDIA.
- Continuous R&D Investment: Invests over 3.5% of its average three-year revenue in R&D to secure technological competitiveness. Plans for future technology development include TSV probe cards, Tri-Temperature Test probes, and 100GHz compatible sockets.Continuous R&D Investment: Invests over 3.5% of its average three-year revenue in R&D to secure technological competitiveness. Plans for future technology development include TSV probe cards, Tri-Temperature Test probes, and 100GHz compatible sockets.
- Semiconductor Industry: Supplies critical components for checking electrical defects throughout the semiconductor chip design, wafer processing, packaging, and testing stages. Particularly active in the system semiconductor (AP, CPU, GPU, etc.) inspection market and AI semiconductor testing market.Semiconductor Industry: Supplies critical components for checking electrical defects throughout the semiconductor chip design, wafer processing, packaging, and testing stages. Particularly active in the system semiconductor (AP, CPU, GPU, etc.) inspection market and AI semiconductor testing market.
- PCB (Printed Circuit Board) Industry: Provides test pins for checking electrical defects in PCBs.PCB (Printed Circuit Board) Industry: Provides test pins for checking electrical defects in PCBs.
- Medical Equipment Industry: Applied in probe components for diagnostic imaging equipment such as ultrasound diagnostic devices.Medical Equipment Industry: Applied in probe components for diagnostic imaging equipment such as ultrasound diagnostic devices.
- Fourth Industrial Revolution Related Industries: Increased demand for test sockets driven by new IT device demands in IoT, AI, 5G, VR, AR, Big Data, autonomous driving, and electric vehicles.Fourth Industrial Revolution Related Industries: Increased demand for test sockets driven by new IT device demands in IoT, AI, 5G, VR, AR, Big Data, autonomous driving, and electric vehicles.
- South Korea (No. 1 in domestic market share), Taiwan (No. 1 in semiconductor pin market share), ChinaSouth Korea (No. 1 in domestic market share), Taiwan (No. 1 in semiconductor pin market share), China
- Patents: 162 registered in Korea, 130 registered overseas (as of December 31, 2024). Total of 272 patents held.Patents: 162 registered in Korea, 130 registered overseas (as of December 31, 2024). Total of 272 patents held.
- Design Rights: 42 registered in Korea, 6 registered overseas (as of December 31, 2024).Design Rights: 42 registered in Korea, 6 registered overseas (as of December 31, 2024).
- Trademarks: 10 registered in Korea, 16 registered overseas (as of December 31, 2024).Trademarks: 10 registered in Korea, 16 registered overseas (as of December 31, 2024).
- ISO 45001 Certification.ISO 45001 Certification.
- Acquired patent for memory module test socket (2006).Acquired patent for memory module test socket (2006).
- Selected as a '9th Excellent Long-Lived Company' by the Ministry of SMEs and Startups (2024).Selected as a '9th Excellent Long-Lived Company' by the Ministry of SMEs and Startups (2024).
- Awarded the 2016 Busan Export Grand Prize.Awarded the 2016 Busan Export Grand Prize.
- Received 'Export Tower' awards for 50 million, 70 million, 100 million, and 200 million USD on Trade Day.Received 'Export Tower' awards for 50 million, 70 million, 100 million, and 200 million USD on Trade Day.
- Awarded the Grand Prize at the 1st Busan Venture Entrepreneur Awards (CEO Lee Chae-yoon).Awarded the Grand Prize at the 1st Busan Venture Entrepreneur Awards (CEO Lee Chae-yoon).