Information
260 Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea
+82 41-543-2203
-
Overview
- Summary
- A company specializing in the development and manufacturing of die bonders and semiconductor manufacturing equipment, founded in 2008 and ceased operations in 2022. A company that pursued innovation by supplying new technology-based equipment to global semiconductor manufacturers.A company specializing in the development and manufacturing of die bonders and semiconductor manufacturing equipment, founded in 2008 and ceased operations in 2022. A company that pursued innovation by supplying new technology-based equipment to global semiconductor manufacturers.
- Key Products/Technologies
- Possession of various types of die bonder product lines.Possession of various types of die bonder product lines.
- Product lineup including Epoxy Die Bonder, Epoxy/Eutectic Die Bonder, Eutectic Die Bonder, Solder Die Bonder, MCP Die Bonder, and Multi Die Bonder.Product lineup including Epoxy Die Bonder, Epoxy/Eutectic Die Bonder, Eutectic Die Bonder, Solder Die Bonder, MCP Die Bonder, and Multi Die Bonder.
- Development of various models such as LDB-200D, LDB-200ED, LDB-2000D, LDB-2000ED, LDB-310D, LDB-200E, LDB-2000E, LDB-S1, DBD-7000, LDB-M1, LCT-10, UC-10, LEM-100, LDS-100, LDS-200D.Development of various models such as LDB-200D, LDB-200ED, LDB-2000D, LDB-2000ED, LDB-310D, LDB-200E, LDB-2000E, LDB-S1, DBD-7000, LDB-M1, LCT-10, UC-10, LEM-100, LDS-100, LDS-200D.
- Acquisition of technology through the inheritance of NIDEC TOSOK's IC semiconductor manufacturing die bonder business in Japan.Acquisition of technology through the inheritance of NIDEC TOSOK's IC semiconductor manufacturing die bonder business in Japan.
- Technological capability focused on new technology development through the establishment of research institutes in Korea and Japan.Technological capability focused on new technology development through the establishment of research institutes in Korea and Japan.
- Core Advantages
- Highly skilled development personnel with excellent technology in die bonder and semiconductor manufacturing equipment.Highly skilled development personnel with excellent technology in die bonder and semiconductor manufacturing equipment.
- A research and development-oriented management strategy investing over 50% of sales in new technology and equipment development.A research and development-oriented management strategy investing over 50% of sales in new technology and equipment development.
- Strengthening market competitiveness through the acquisition of NIDEC TOSOK's die bonder business in Japan.Strengthening market competitiveness through the acquisition of NIDEC TOSOK's die bonder business in Japan.
- A business vision aiming for global market expansion by supplying new technology-based equipment to domestic and international semiconductor manufacturers.A business vision aiming for global market expansion by supplying new technology-based equipment to domestic and international semiconductor manufacturers.
- Continuous efforts for technological innovation through research institutes established in Korea and Japan.Continuous efforts for technological innovation through research institutes established in Korea and Japan.
- Target Industrie
- Semiconductor manufacturing industry.Semiconductor manufacturing industry.
- Supply of core equipment for IC semiconductor manufacturing processes in particular.Supply of core equipment for IC semiconductor manufacturing processes in particular.
- Major Markets
- --
- Certifications/Patents
- Innovative technology development capabilities in the semiconductor manufacturing equipment sector.Innovative technology development capabilities in the semiconductor manufacturing equipment sector.
- Efforts to develop new concept semiconductor manufacturing equipment through the application of new technologies.Efforts to develop new concept semiconductor manufacturing equipment through the application of new technologies.
- Specific patent numbers or certification names not confirmed.Specific patent numbers or certification names not confirmed.
Introduction
Location
260 Sandong-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, South Korea
클릭하여 위치 살펴보기
