LASER AND PHYSICS Co., Ltd. is a specialized company in the research, development, and production of laser and laser application systems, providing precision processing solutions for advanced industrial sectors such as semiconductors, displays, PCBs, and medical fields. Leveraging the optical technology expertise of researchers from government-funded research institutes, the company develops and supplies laser cutting machines, markers, and welders required in various industrial settings. The company demonstrates particular strength in the development of excimer laser modules and related application systems.LASERANDPHYSICSCo.,Ltd.isaspecializedcompanyintheresearch,development,andproductionoflaserandlaserapplicationsystems,providingprecisionprocessingsolutionsforadvancedindustrialsectorssuchassemiconductors,displays,PCBs,andmedicalfields.Leveragingtheopticaltechnologyexpertiseofresearchersfromgovernment-fundedresearchinstitutes,thecompanydevelopsandsupplieslasercuttingmachines,markers,andweldersrequiredinvariousindustrialsettings.Thecompanydemonstratesparticularstrengthinthedevelopmentofexcimerlasermodulesandrelatedapplicationsystems.
Key Products/TechnologiesKeyProducts/Technologies
Excimer Laser Module: Model EX-30H, a product requiring highly complex gas medium control technology, capable of emitting various wavelength ranges for versatile applications.ExcimerLaserModule:ModelEX-30H,aproductrequiringhighlycomplexgasmediumcontroltechnology,capableofemittingvariouswavelengthrangesforversatileapplications.
Laser Cutter: Model LPC-DT610, a UV laser-based system utilized for precision processing such as ITO patterning, FPCB cutting, glass marking, sapphire scribing, and wafer dicing. Other models include LPC-F200, LPC-C3000, LPC-DT600, and LPC-DT250.LaserCutter:ModelLPC-DT610,aUVlaser-basedsystemutilizedforprecisionprocessingsuchasITOpatterning,FPCBcutting,glassmarking,sapphirescribing,andwaferdicing.OthermodelsincludeLPC-F200,LPC-C3000,LPC-DT600,andLPC-DT250.
Laser Marker: LPM-100 Series, LPM-200 Series, LPM-FBB20P models, including inline laser markers, low-depth markers, and universal laser markers like Mark2wayin, offering high-speed precision marking on various materials.LaserMarker:LPM-100Series,LPM-200Series,LPM-FBB20Pmodels,includinginlinelasermarkers,low-depthmarkers,anduniversallasermarkerslikeMark2wayin,offeringhigh-speedprecisionmarkingonvariousmaterials.
Excimer Micro Processing System: Model LPD-EK500, an integrated system combining KrF(ArF) excimer laser with high-precision optics and X-Y-Z stages.ExcimerMicroProcessingSystem:ModelLPD-EK500,anintegratedsystemcombiningKrF(ArF)excimerlaserwithhigh-precisionopticsandX-Y-Zstages.
Excimer Laser Annealing System: Model LPA-EXA100, a system utilizing XeCl excimer laser for TFT LCD annealing processes, converting amorphous silicon into polycrystalline silicon.ExcimerLaserAnnealingSystem:ModelLPA-EXA100,asystemutilizingXeClexcimerlaserforTFTLCDannealingprocesses,convertingamorphoussiliconintopolycrystallinesilicon.
Solid State Laser: Includes models such as DNA-B35P, DNA-B60P, FNA-B600P, DNA-T100S, DNL-B100S, utilizing various laser materials like Nd:YAG, Nd:YLF, and Nd:YVO4. DPSS (Diode Pumped Solid State) laser technology uses high-power semiconductor lasers as pumping light sources, offering improved beam characteristics and extended lifespan.SolidStateLaser:IncludesmodelssuchasDNA-B35P,DNA-B60P,FNA-B600P,DNA-T100S,DNL-B100S,utilizingvariouslasermaterialslikeNd:YAG,Nd:YLF,andNd:YVO4.DPSS(DiodePumpedSolidState)lasertechnologyuseshigh-powersemiconductorlasersaspumpinglightsources,offeringimprovedbeamcharacteristicsandextendedlifespan.
LD (Laser Diode): Models LDS-120P, LDF-15P, DNA-B35PM, and others, with high-power LDs and fiber-coupled LDs being key products under development.LD(LaserDiode):ModelsLDS-120P,LDF-15P,DNA-B35PM,andothers,withhigh-powerLDsandfiber-coupledLDsbeingkeyproductsunderdevelopment.
Core AdvantagesCoreAdvantages
Possession of rare original excimer laser technology globally, enabling the production of excimer lasers applicable to various fields through advanced gas medium control technology.Possessionofrareoriginalexcimerlasertechnologyglobally,enablingtheproductionofexcimerlasersapplicabletovariousfieldsthroughadvancedgasmediumcontroltechnology.
Optical technology expertise from government-funded research institutes and continuous R&D know-how, leading to successful localization of semiconductor lithography lasers.Opticaltechnologyexpertisefromgovernment-fundedresearchinstitutesandcontinuousR&Dknow-how,leadingtosuccessfullocalizationofsemiconductorlithographylasers.
Extensive application system development capabilities utilizing various laser light sources such as Nd:YAG, excimer, CO2, Fiber, UV, and DPSS.ExtensiveapplicationsystemdevelopmentcapabilitiesutilizingvariouslaserlightsourcessuchasNd:YAG,excimer,CO2,Fiber,UV,andDPSS.
Customized laser system design and manufacturing capabilities tailored to customer requirements, providing precision processing solutions for diverse industrial sectors.Customizedlasersystemdesignandmanufacturingcapabilitiestailoredtocustomerrequirements,providingprecisionprocessingsolutionsfordiverseindustrialsectors.
Recognized technological prowess and market competitiveness, evidenced by awards such as the Million Dollar Export Tower (2013), selection as a Samsung Electronics Innovation Technology Company (2009), Gyeonggi Province Promising SME certification (2007), and Inno-biz certification (2006).Recognizedtechnologicalprowessandmarketcompetitiveness,evidencedbyawardssuchastheMillionDollarExportTower(2013),selectionasaSamsungElectronicsInnovationTechnologyCompany(2009),GyeonggiProvincePromisingSMEcertification(2007),andInno-bizcertification(2006).
Display Industry: Excimer laser annealing for AMOLED and Flexible OLED processes, laser lift-off, micro metal micromachining, glass laser scribing, ITO patterning.DisplayIndustry:ExcimerlaserannealingforAMOLEDandFlexibleOLEDprocesses,laserlift-off,micrometalmicromachining,glasslaserscribing,ITOpatterning.
PCB Industry: FPCB cutting, EMC shielding, and insulation for highly integrated PCBs.PCBIndustry:FPCBcutting,EMCshielding,andinsulationforhighlyintegratedPCBs.
Medical Industry: Development and preparation for commercialization of medical excimer lasers.MedicalIndustry:Developmentandpreparationforcommercializationofmedicalexcimerlasers.
General Industrial Processing: Precision processing of various materials including laser cutting, marking, and welding.GeneralIndustrialProcessing:Precisionprocessingofvariousmaterialsincludinglasercutting,marking,andwelding.
Major MarketsMajorMarkets
Japan, Southeast AsiaJapan,SoutheastAsia
Certifications/PatentsCertifications/Patents
Inno-biz (Technology Innovation Small and Medium Business) Certification (2006).Inno-biz(TechnologyInnovationSmallandMediumBusiness)Certification(2006).
Venture Company Certification (2000, renewed 2006).VentureCompanyCertification(2000,renewed2006).
Corporate R&D Center Certification (2000).CorporateR&DCenterCertification(2000).
Gyeonggi Province Promising SME Certification (2007).GyeonggiProvincePromisingSMECertification(2007).
CE certification for laser processing equipment (LPC-DT600 / LPM-DS10P / LPM-FBB20P).CEcertificationforlaserprocessingequipment(LPC-DT600/LPM-DS10P/LPM-FBB20P).
Patent-holding company.Patent-holdingcompany.
Awarded Million Dollar Export Tower (2013).AwardedMillionDollarExportTower(2013).