Korea Instrument, The Republic of Korea - Komachine Supplier Profile and Product List

- A specialized company developing probe cards for semiconductor wafer inspection. A manufacturer of probe cards for memory and System LSI semiconductor wafer testing, and high thermal conductivity and reliability metallized ceramic substrates for power semiconductor modules. A company that has grown to be the 6th largest probe card company worldwide through core technology development and talent acquisition in the previously barren domestic probe card market. A provider of advanced probe card solutions to ensure high yield, precise test accuracy, and quick market response for customers.A specialized company developing probe cards for semiconductor wafer inspection. A manufacturer of probe cards for memory and System LSI semiconductor wafer testing, and high thermal conductivity and reliability metallized ceramic substrates for power semiconductor modules. A company that has grown to be the 6th largest probe card company worldwide through core technology development and talent acquisition in the previously barren domestic probe card market. A provider of advanced probe card solutions to ensure high yield, precise test accuracy, and quick market response for customers.
- Cantilever Probe Card: Probe cards for LSI (ASIC), DDI (Display Driver IC), MCU, and Smart Card testing.Cantilever Probe Card: Probe cards for LSI (ASIC), DDI (Display Driver IC), MCU, and Smart Card testing.
- MEMS Probe Card: Various types of MEMS probe cards including MEMS Vertical (for AP, ASIC, CPU, GPU), MEMS CIS (for CIS), and LSI MEMS Card (DC). A lineup of MEMS probe cards for DRAM, HBM, and NAND Flash testing.MEMS Probe Card: Various types of MEMS probe cards including MEMS Vertical (for AP, ASIC, CPU, GPU), MEMS CIS (for CIS), and LSI MEMS Card (DC). A lineup of MEMS probe cards for DRAM, HBM, and NAND Flash testing.
- Vertical Probe Card for Flipchip: Vertical probe cards suitable for flip-chip semiconductor testing.Vertical Probe Card for Flipchip: Vertical probe cards suitable for flip-chip semiconductor testing.
- Fine Pitch Probe Card for DDI: Probe cards specialized for fine-pitch testing of DDI semiconductors.Fine Pitch Probe Card for DDI: Probe cards specialized for fine-pitch testing of DDI semiconductors.
- AMB Substrate (Active Metal Brazing Substrate): High thermal conductivity substrates applied in power modules for xEV, renewable energy, and aerospace industries.AMB Substrate (Active Metal Brazing Substrate): High thermal conductivity substrates applied in power modules for xEV, renewable energy, and aerospace industries.
- STC Substrate (Sputtered Thick Coating Substrate): Substrates applied in isolated discrete (TO-220 / TO-247) and SOT-227.STC Substrate (Sputtered Thick Coating Substrate): Substrates applied in isolated discrete (TO-220 / TO-247) and SOT-227.
- Core Technologies: Design capabilities through electrical circuit and electronics experts, including PCB/MLC/probe/material/process and thermal/power/signal/3D simulation technologies. Operation of an in-house MEMS Fab process line, 2D MEMS probe design and manufacturing, and ultra-precision alignment technology. Establishment of automated processes utilizing ultra-precision automatic insertion and bonding technology.Core Technologies: Design capabilities through electrical circuit and electronics experts, including PCB/MLC/probe/material/process and thermal/power/signal/3D simulation technologies. Operation of an in-house MEMS Fab process line, 2D MEMS probe design and manufacturing, and ultra-precision alignment technology. Establishment of automated processes utilizing ultra-precision automatic insertion and bonding technology.
- Leading Position in the Global Market: A company that has grown to be the 6th largest in the global probe card industry, securing global competitiveness.Leading Position in the Global Market: A company that has grown to be the 6th largest in the global probe card industry, securing global competitiveness.
- Unique Technology and Expertise: A pioneer in the domestic probe card market, with accumulated extensive experience and technical expertise through core technology development and talent acquisition.Unique Technology and Expertise: A pioneer in the domestic probe card market, with accumulated extensive experience and technical expertise through core technology development and talent acquisition.
- Total Probe Card Solution Provider: The only domestic company offering a total probe card solution for both memory and non-memory applications. Provides comprehensive wafer test solutions from probe pin design and simulation to probe manufacturing and card assembly.Total Probe Card Solution Provider: The only domestic company offering a total probe card solution for both memory and non-memory applications. Provides comprehensive wafer test solutions from probe pin design and simulation to probe manufacturing and card assembly.
- Customer-Oriented Advanced Solutions: Offers advanced probe card solutions for customers to achieve high yield, precise test accuracy, and rapid market response. Strengthens partnerships by supporting customer success with consistent quality competitiveness and technical capabilities.Customer-Oriented Advanced Solutions: Offers advanced probe card solutions for customers to achieve high yield, precise test accuracy, and rapid market response. Strengthens partnerships by supporting customer success with consistent quality competitiveness and technical capabilities.
- Future-Oriented Advanced Technology Development: Efforts in developing advanced technologies to proactively respond to the complex and sophisticated semiconductor testing requirements in AI, automotive electronics, and high-performance computing (HPC) fields.Future-Oriented Advanced Technology Development: Efforts in developing advanced technologies to proactively respond to the complex and sophisticated semiconductor testing requirements in AI, automotive electronics, and high-performance computing (HPC) fields.
- Diversified Product Portfolio: Responds to diverse customer needs through a wide range of probe cards including Cantilever, MEMS Vertical, MEMS CIS, Vertical, Fine Pitch, and AMB, STC substrate technologies.Diversified Product Portfolio: Responds to diverse customer needs through a wide range of probe cards including Cantilever, MEMS Vertical, MEMS CIS, Vertical, Fine Pitch, and AMB, STC substrate technologies.
- Semiconductor Industry: Overall semiconductor wafer inspection and testing for memory (DRAM, HBM, NAND Flash), logic (AP, ASIC, CPU, GPU), and power semiconductors.Semiconductor Industry: Overall semiconductor wafer inspection and testing for memory (DRAM, HBM, NAND Flash), logic (AP, ASIC, CPU, GPU), and power semiconductors.
- AI and High-Performance Computing (HPC): Testing of advanced semiconductor devices in AI and HPC fields.AI and High-Performance Computing (HPC): Testing of advanced semiconductor devices in AI and HPC fields.
- Automotive Electronics Industry: Power modules for xEV (electric vehicles) and automotive electronic components.Automotive Electronics Industry: Power modules for xEV (electric vehicles) and automotive electronic components.
- Renewable Energy and Aerospace Industry: Power modules for renewable energy systems and aerospace applications.Renewable Energy and Aerospace Industry: Power modules for renewable energy systems and aerospace applications.
- Display Industry: Testing of DDI (Display Driver IC) semiconductors.Display Industry: Testing of DDI (Display Driver IC) semiconductors.
- South Korea (HQ, Repair Center, Samsung Pyeongtaek, Samsung Hwaseong), China (Repair Center, Xian Samsung), Taiwan (Agent Hsinchu)South Korea (HQ, Repair Center, Samsung Pyeongtaek, Samsung Hwaseong), China (Repair Center, Xian Samsung), Taiwan (Agent Hsinchu)
- Technical Strengths: Possesses core technical capabilities including design expertise through electrical circuit and electronics specialists, operation of an in-house MEMS Fab process line, 2D MEMS probe design and manufacturing, ultra-precision alignment technology, and ultra-precision automatic insertion and bonding technology.Technical Strengths: Possesses core technical capabilities including design expertise through electrical circuit and electronics specialists, operation of an in-house MEMS Fab process line, 2D MEMS probe design and manufacturing, ultra-precision alignment technology, and ultra-precision automatic insertion and bonding technology.
- Adherence to Industry Standards: Provides advanced probe card solutions that meet the precision and reliability requirements of the semiconductor industry.Adherence to Industry Standards: Provides advanced probe card solutions that meet the precision and reliability requirements of the semiconductor industry.
- SEMI Membership: Actively participates in industry standards and technological trends as a member of SEMI, a global semiconductor industry association.SEMI Membership: Actively participates in industry standards and technological trends as a member of SEMI, a global semiconductor industry association.