Information
17 Emtibeui 25-ro 58beon-gil, Siheung-si, Gyeonggi-do, South Korea
+82 31-495-2074
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Overview
- Summary
- JESAGI HANKOOK is a specialized manufacturer of vacuum and atmospheric plasma surface treatment devices, established in 1991. The company focuses on the manufacturing of plasma surface treatment (cleaning, coating, etching, modification) systems and process technology development essential for the semiconductor, PCB, and display industries. It strengthens its market position by supplying plasma surface treatment systems and process technologies to world-class companies both domestically and internationally. Through continuous efforts in advanced technology development and commercialization, the company maintains a leading position in the industrial automation machinery sector.JESAGI HANKOOK is a specialized manufacturer of vacuum and atmospheric plasma surface treatment devices, established in 1991. The company focuses on the manufacturing of plasma surface treatment (cleaning, coating, etching, modification) systems and process technology development essential for the semiconductor, PCB, and display industries. It strengthens its market position by supplying plasma surface treatment systems and process technologies to world-class companies both domestically and internationally. Through continuous efforts in advanced technology development and commercialization, the company maintains a leading position in the industrial automation machinery sector.
- Key Products/Technologies
- World's first development and supply of large plasma descum devices and 'Plasma Desmear Systems' for PCBs and packages.World's first development and supply of large plasma descum devices and 'Plasma Desmear Systems' for PCBs and packages.
- World's first development and supply of large and automatic plasma cleaning machines for FPCB Fine Pattern processes to top-tier companies.World's first development and supply of large and automatic plasma cleaning machines for FPCB Fine Pattern processes to top-tier companies.
- Development of semiconductor packaging substrate equipment and its supply to world-class mobile phone packaging substrate manufacturers both domestically and internationally.Development of semiconductor packaging substrate equipment and its supply to world-class mobile phone packaging substrate manufacturers both domestically and internationally.
- Product lineup for semiconductor/LED devices including Wafer Ashing/Cleaning System, strip plasma equipment, and flow plasma equipment.Product lineup for semiconductor/LED devices including Wafer Ashing/Cleaning System, strip plasma equipment, and flow plasma equipment.
- Provision of various surface treatment solutions such as atmospheric plasma devices, coating (PVD/PECVD) devices, and sputter guns.Provision of various surface treatment solutions such as atmospheric plasma devices, coating (PVD/PECVD) devices, and sputter guns.
- Metal heat/surface treatment equipment including large-capacity plasma nitriding systems, JS treatment (low-temperature nitriding) systems, PECVD systems for special alloy surface heat treatment, and high vacuum pressurized vacuum heat treatment (bright annealing) technology.Metal heat/surface treatment equipment including large-capacity plasma nitriding systems, JS treatment (low-temperature nitriding) systems, PECVD systems for special alloy surface heat treatment, and high vacuum pressurized vacuum heat treatment (bright annealing) technology.
- Track record in automated environmental equipment manufacturing, including plasma fine dust collection sterilizers, plasma odor decomposition devices, and UV water sterilization devices.Track record in automated environmental equipment manufacturing, including plasma fine dust collection sterilizers, plasma odor decomposition devices, and UV water sterilization devices.
- Continuous development of new technologies and equipment, such as TGV Substrate Sputter for High Adhesion Deposition (2023), TGV Substrate Plasma Desmear & Descum System (2022), and ECR development (2021).Continuous development of new technologies and equipment, such as TGV Substrate Sputter for High Adhesion Deposition (2023), TGV Substrate Plasma Desmear & Descum System (2022), and ECR development (2021).
- Core Advantages
- Over 30 years of accumulated plasma surface treatment technology and process know-how since its establishment in 1991.Over 30 years of accumulated plasma surface treatment technology and process know-how since its establishment in 1991.
- Capability for the world's first development of large plasma descum devices and plasma desmear systems for PCBs and packages.Capability for the world's first development of large plasma descum devices and plasma desmear systems for PCBs and packages.
- Reliability established by securing global top-tier companies in advanced industries like semiconductors, displays, and PCBs as clients.Reliability established by securing global top-tier companies in advanced industries like semiconductors, displays, and PCBs as clients.
- Strength in environmentally friendly dry plasma etching technology, significantly reducing environmental pollution compared to wet etching methods.Strength in environmentally friendly dry plasma etching technology, significantly reducing environmental pollution compared to wet etching methods.
- Establishment of a clean factory in Siheung MTV Industrial Complex for the development and supply of equipment requiring cleanroom assembly, such as 5G substrates and semiconductor packages.Establishment of a clean factory in Siheung MTV Industrial Complex for the development and supply of equipment requiring cleanroom assembly, such as 5G substrates and semiconductor packages.
- Investment in advanced development and infrastructure construction for plasma devices and process technologies necessary for future technology fields like fine circuit and micro-hole processing, and the 5G industry.Investment in advanced development and infrastructure construction for plasma devices and process technologies necessary for future technology fields like fine circuit and micro-hole processing, and the 5G industry.
- Expansion of plasma application technology scope and development capabilities in metal heat treatment, PCB, and environmental industries through technical partnerships with advanced foreign specialized companies.Expansion of plasma application technology scope and development capabilities in metal heat treatment, PCB, and environmental industries through technical partnerships with advanced foreign specialized companies.
- Ability to supply new products suitable for rapidly changing PCB, semiconductor, LED, and LCD manufacturing processes, and to provide high-performance solutions.Ability to supply new products suitable for rapidly changing PCB, semiconductor, LED, and LCD manufacturing processes, and to provide high-performance solutions.
- Target Industrie
- Semiconductor industry (packaging, wafer cleaning and ashing).Semiconductor industry (packaging, wafer cleaning and ashing).
- PCB (Printed Circuit Board) industry (desmear, descum, etching, cleaning).PCB (Printed Circuit Board) industry (desmear, descum, etching, cleaning).
- Display industry (LCD, OLED, TSP, Pol Film attachment).Display industry (LCD, OLED, TSP, Pol Film attachment).
- LED industry (devices and processes).LED industry (devices and processes).
- Metal heat treatment and surface treatment industry (nitriding, special alloy surface heat treatment).Metal heat treatment and surface treatment industry (nitriding, special alloy surface heat treatment).
- Environmental industry (fine dust collection, odor decomposition, water sterilization).Environmental industry (fine dust collection, odor decomposition, water sterilization).
- 5G communication substrate manufacturing industry (plasma devices for special substrates).5G communication substrate manufacturing industry (plasma devices for special substrates).
- Electronic materials industry (plasma application processes).Electronic materials industry (plasma application processes).
- Major Markets
- South Korea, Japan, ChinaSouth Korea, Japan, China
- United StatesUnited States
- Certifications/Patents
- Selection as a 'KICOX Global Leading Company' by the Korea Industrial Complex Corporation in 2018.Selection as a 'KICOX Global Leading Company' by the Korea Industrial Complex Corporation in 2018.
- World's first development technology for large plasma descum devices and 'Plasma Desmear Systems' for PCBs and packages.World's first development technology for large plasma descum devices and 'Plasma Desmear Systems' for PCBs and packages.
- World's first development technology for large and automatic plasma cleaning machines for FPCB Fine Pattern processes.World's first development technology for large and automatic plasma cleaning machines for FPCB Fine Pattern processes.
- Capability for advanced development of plasma devices and process technologies required for fine circuit and micro-hole processing in semiconductor packaging and the 5G industry.Capability for advanced development of plasma devices and process technologies required for fine circuit and micro-hole processing in semiconductor packaging and the 5G industry.
Introduction
Location
17 Emtibeui 25-ro 58beon-gil, Siheung-si, Gyeonggi-do, South Korea
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