Information
Jayumuyeok-ro, Jung-gu, Incheon, South Korea
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Overview
- Summary
- A leading global provider of semiconductor system integration packaging and testing services, specializing in the manufacturing of semiconductor devices and similar components. Ranked as the third-largest Outsourced Semiconductor Assembly and Test (OSAT) company worldwide. Offering full-stack turnkey services, including semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final test, and direct shipment to global vendors. A comprehensive portfolio covering a wide range of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial sectors.A leading global provider of semiconductor system integration packaging and testing services, specializing in the manufacturing of semiconductor devices and similar components. Ranked as the third-largest Outsourced Semiconductor Assembly and Test (OSAT) company worldwide. Offering full-stack turnkey services, including semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final test, and direct shipment to global vendors. A comprehensive portfolio covering a wide range of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial sectors.
- Key Products/Technologies
- Advanced Wafer-Level Packaging Technologies: Including Fan-Out Wafer-Level Packaging (FOWLP) and proprietary eWLB Fan-Out Wafer-Level Packaging technology.Advanced Wafer-Level Packaging Technologies: Including Fan-Out Wafer-Level Packaging (FOWLP) and proprietary eWLB Fan-Out Wafer-Level Packaging technology.
- 2.5D/3D System Integration Packaging Technologies: Providing advanced packaging solutions for 4D millimeter-wave radar through XDFOI™, a high-density multi-dimensional heterogeneous integration chiplet technology.2.5D/3D System Integration Packaging Technologies: Providing advanced packaging solutions for 4D millimeter-wave radar through XDFOI™, a high-density multi-dimensional heterogeneous integration chiplet technology.
- System-in-Packaging (SiP) Solutions: Offering advanced SiP solutions for increased integration, improved electrical performance, reduced power consumption, and faster speeds.System-in-Packaging (SiP) Solutions: Offering advanced SiP solutions for increased integration, improved electrical performance, reduced power consumption, and faster speeds.
- Reliable Flip Chip and Wire Bonding Technologies: A broad flip chip portfolio ranging from large single-die packages with passive components to complex advanced 3D packaging, alongside wire bonding interconnect solutions.Reliable Flip Chip and Wire Bonding Technologies: A broad flip chip portfolio ranging from large single-die packages with passive components to complex advanced 3D packaging, alongside wire bonding interconnect solutions.
- Diverse Package Types: Capabilities in various packaging types such as WLCSP, FC-BGA, FC-CSP, QFN, PoP, and MEMS.Diverse Package Types: Capabilities in various packaging types such as WLCSP, FC-BGA, FC-CSP, QFN, PoP, and MEMS.
- Comprehensive Testing Services: Expertise in wafer probing, final test, and system-level test (SLT) capabilities.Comprehensive Testing Services: Expertise in wafer probing, final test, and system-level test (SLT) capabilities.
- Semiconductor Device Product Families: Including integrated circuit packaging, processors and controllers, memory, transistors, diodes, and integrated circuit parts.Semiconductor Device Product Families: Including integrated circuit packaging, processors and controllers, memory, transistors, diodes, and integrated circuit parts.
- Core Advantages
- Global OSAT Market Leadership: A strong market position as China's largest and the world's third-largest OSAT provider.Global OSAT Market Leadership: A strong market position as China's largest and the world's third-largest OSAT provider.
- Full-Stack Turnkey Service Provision: Offering end-to-end solutions from semiconductor package integration design to final test and direct shipment, streamlining customer supply chain management and accelerating time-to-market.Full-Stack Turnkey Service Provision: Offering end-to-end solutions from semiconductor package integration design to final test and direct shipment, streamlining customer supply chain management and accelerating time-to-market.
- Advanced Packaging Technology Prowess: Leading capabilities in high-value advanced packaging technologies, including wafer-level packaging, 2.5D/3D integration, SiP, fan-out wafer-level packaging, and flip chip.Advanced Packaging Technology Prowess: Leading capabilities in high-value advanced packaging technologies, including wafer-level packaging, 2.5D/3D integration, SiP, fan-out wafer-level packaging, and flip chip.
- Global Manufacturing and R&D Network: An efficient global supply chain and technological collaboration supported by eight manufacturing sites and two R&D centers across China, South Korea, and Singapore, with worldwide sales centers.Global Manufacturing and R&D Network: An efficient global supply chain and technological collaboration supported by eight manufacturing sites and two R&D centers across China, South Korea, and Singapore, with worldwide sales centers.
- Extensive Patent Portfolio: Securing technological innovation and competitive advantage with approximately 2,600 patents as of 2016 and a total of 1,593 patents.Extensive Patent Portfolio: Securing technological innovation and competitive advantage with approximately 2,600 patents as of 2016 and a total of 1,593 patents.
- Customer-Centric Quality and Service: High recognition from global customers due to continuous improvements in production and service quality.Customer-Centric Quality and Service: High recognition from global customers due to continuous improvements in production and service quality.
- Strategic Focus on High-Growth Markets: Concentrated investment and technological development in high-value-added application areas such as automotive electronics, high-performance computing, 5G RF, AI, and IoT.Strategic Focus on High-Growth Markets: Concentrated investment and technological development in high-value-added application areas such as automotive electronics, high-performance computing, 5G RF, AI, and IoT.
- Target Industrie
- Mobile and Communications: 5G and RF packaging and test solutions for mobile devices and communication infrastructure.Mobile and Communications: 5G and RF packaging and test solutions for mobile devices and communication infrastructure.
- High-Performance Computing (HPC) and AI: AI accelerators, high-performance computing chips, blockchain, and edge intelligence.High-Performance Computing (HPC) and AI: AI accelerators, high-performance computing chips, blockchain, and edge intelligence.
- Automotive Electronics: ADAS, infotainment systems, vehicle sensors, smart vehicle features, 4D millimeter-wave radar, MCUs, and power semiconductors.Automotive Electronics: ADAS, infotainment systems, vehicle sensors, smart vehicle features, 4D millimeter-wave radar, MCUs, and power semiconductors.
- Consumer Electronics: General consumer electronic products.Consumer Electronics: General consumer electronic products.
- Industrial: Industrial applications and industrial IoT.Industrial: Industrial applications and industrial IoT.
- Big Data Storage and Memory: High-density storage devices, 3D NAND SSDs, and high-performance memory.Big Data Storage and Memory: High-density storage devices, 3D NAND SSDs, and high-performance memory.
- Internet of Things (IoT) and Smart Home: Semiconductor components for IoT devices and smart home applications.Internet of Things (IoT) and Smart Home: Semiconductor components for IoT devices and smart home applications.
- Major Markets
- China, South Korea, Singapore, Hong Kong, Taiwan, Philippines, Japan, IndiaChina, South Korea, Singapore, Hong Kong, Taiwan, Philippines, Japan, India
- Germany, NetherlandsGermany, Netherlands
- United StatesUnited States
- Certifications/Patents
- Possession of 1,593 total patents. Approximately 2,600 patents as of 2016.Possession of 1,593 total patents. Approximately 2,600 patents as of 2016.
- Patents under JCET STATS ChipPAC Korea Limited: Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation (US Patent No. 12431437, issued September 30, 2025).Patents under JCET STATS ChipPAC Korea Limited: Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation (US Patent No. 12431437, issued September 30, 2025).
- Patents under JCET STATS ChipPAC Korea Limited: Semiconductor device and method of forming compartment shielding for a semiconductor package (US Patent No. 12444718, issued October 14, 2025).Patents under JCET STATS ChipPAC Korea Limited: Semiconductor device and method of forming compartment shielding for a semiconductor package (US Patent No. 12444718, issued October 14, 2025).
- Patents under JCET Shanghai Automotive Co., LTD.: Lead frame, package structure and method for forming the same (US Publication No. 20260090405, published March 26, 2026).Patents under JCET Shanghai Automotive Co., LTD.: Lead frame, package structure and method for forming the same (US Publication No. 20260090405, published March 26, 2026).
- Recipient of the '2022 China Top 100 Enterprise Award'.Recipient of the '2022 China Top 100 Enterprise Award'.
- Subsidiaries JCAP and STATS ChipPAC Korea received multiple Texas Instruments (TI) 'Supplier Excellence Awards' (2020, 2021).Subsidiaries JCAP and STATS ChipPAC Korea received multiple Texas Instruments (TI) 'Supplier Excellence Awards' (2020, 2021).
- Attainment of ISO 9001 and ISO 14001 international certifications.Attainment of ISO 9001 and ISO 14001 international certifications.
- Possession of IATF 16949 certified lines and AEC-Q100/101 capabilities, meeting automotive industry requirements.Possession of IATF 16949 certified lines and AEC-Q100/101 capabilities, meeting automotive industry requirements.
Introduction
Location
Jayumuyeok-ro, Jung-gu, Incheon, South Korea
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