ISP Co., Ltd. is a specialized optical instrument company based on X-ray fluorescence (XRF) and micro computed tomography (uCT) technologies. The company provides non-destructive elemental analysis, precision plating thickness measurement, and high-resolution imaging solutions. It possesses the capability to develop and supply customized in-line applications optimized for production and quality control. As the only company in Korea with X-ray fluorescence analysis technology, it sets new standards for industrial safety and quality.ISPCo.,Ltd.isaspecializedopticalinstrumentcompanybasedonX-rayfluorescence(XRF)andmicrocomputedtomography(uCT)technologies.Thecompanyprovidesnon-destructiveelementalanalysis,precisionplatingthicknessmeasurement,andhigh-resolutionimagingsolutions.Itpossessesthecapabilitytodevelopandsupplycustomizedin-lineapplicationsoptimizedforproductionandqualitycontrol.AstheonlycompanyinKoreawithX-rayfluorescenceanalysistechnology,itsetsnewstandardsforindustrialsafetyandquality.
Key Products/TechnologiesKeyProducts/Technologies
Key technologies include X-ray fluorescence (XRF) and micro computed tomography (uCT) technologies. The company also holds SEM (Scanning Electron Microscopy) and high-resolution imaging technology using electron beams.KeytechnologiesincludeX-rayfluorescence(XRF)andmicrocomputedtomography(uCT)technologies.ThecompanyalsoholdsSEM(ScanningElectronMicroscopy)andhigh-resolutionimagingtechnologyusingelectronbeams.
Representative product lines include composition analyzers, precious metal analyzers, plating thickness gauges, Automatic In-Line measurement analyzers, and imaging analyzers.Representativeproductlinesincludecompositionanalyzers,preciousmetalanalyzers,platingthicknessgauges,AutomaticIn-Linemeasurementanalyzers,andimaginganalyzers.
Composition analyzers include hazardous substance content analyzers and in-line plating solution concentration analysis systems (iEDX-100L OLA XRF System).Compositionanalyzersincludehazardoussubstancecontentanalyzersandin-lineplatingsolutionconcentrationanalysissystems(iEDX-100LOLAXRFSystem).
Plating thickness gauge models include the iEDX-750T automatic gold plating thickness gauge, iEDX-150WT dedicated plating thickness gauge, and iTG-B10 PCB copper plating thickness gauge.PlatingthicknessgaugemodelsincludetheiEDX-750Tautomaticgoldplatingthicknessgauge,iEDX-150WTdedicatedplatingthicknessgauge,andiTG-B10PCBcopperplatingthicknessgauge.
Imaging analyzers utilize 2D/3D X-ray imaging devices with micro or sub-micro resolution.Imaginganalyzersutilize2D/3DX-rayimagingdeviceswithmicroorsub-microresolution.
Standard reference materials are also part of the product range.Standardreferencematerialsarealsopartoftheproductrange.
Core AdvantagesCoreAdvantages
Possession of core technological capabilities in X-ray fluorescence (XRF) and micro computed tomography (uCT).PossessionofcoretechnologicalcapabilitiesinX-rayfluorescence(XRF)andmicrocomputedtomography(uCT).
Ability to provide cost savings and optimal service through the localization of XRF technology, which was highly dependent on foreign technology.AbilitytoprovidecostsavingsandoptimalservicethroughthelocalizationofXRFtechnology,whichwashighlydependentonforeigntechnology.
Provision of dedicated software for non-destructive elemental analysis and single/multi-layer thin film thickness analysis.Provisionofdedicatedsoftwarefornon-destructiveelementalanalysisandsingle/multi-layerthinfilmthicknessanalysis.
Development of 2D/3D X-ray imaging analysis devices with micro/sub-micro resolution capable of non-destructively viewing the interior of products with microstructures.Developmentof2D/3DX-rayimaginganalysisdeviceswithmicro/sub-microresolutioncapableofnon-destructivelyviewingtheinteriorofproductswithmicrostructures.
Offering optimized solutions for production and quality control through the application of customized in-line applications.Offeringoptimizedsolutionsforproductionandqualitycontrolthroughtheapplicationofcustomizedin-lineapplications.
Continuous technological development and product commercialization capabilities, such as the development of wafer metal thin film thickness gauges in 2023 and the launch of in-line battery electrode inspection devices in 2022.Continuoustechnologicaldevelopmentandproductcommercializationcapabilities,suchasthedevelopmentofwafermetalthinfilmthicknessgaugesin2023andthelaunchofin-linebatteryelectrodeinspectiondevicesin2022.
Securing technological reliability and market competitiveness through collaboration with global top-tier clients.Securingtechnologicalreliabilityandmarketcompetitivenessthroughcollaborationwithglobaltop-tierclients.
Target IndustrieTargetIndustrie
Analysis of components and content in plastics, metals, alloys, cement, petroleum, energy, and environmental fields.Analysisofcomponentsandcontentinplastics,metals,alloys,cement,petroleum,energy,andenvironmentalfields.
Plating thickness measurement and analysis of single/multi-layer thin film thickness.Platingthicknessmeasurementandanalysisofsingle/multi-layerthinfilmthickness.
Non-destructive internal imaging analysis of products with microstructures such as semiconductors, sensors, biosensors, and small animals.Non-destructiveinternalimaginganalysisofproductswithmicrostructuressuchassemiconductors,sensors,biosensors,andsmallanimals.
Analysis of hazardous substances in the automotive, electrical and electronic, connector, and PCB industries.Analysisofhazardoussubstancesintheautomotive,electricalandelectronic,connector,andPCBindustries.
Determination of elemental composition in mining and geochemistry.Determinationofelementalcompositioninminingandgeochemistry.
Material analysis in the scrap and recycling industries.Materialanalysisinthescrapandrecyclingindustries.
Application in advanced industrial fields such as battery electrode inspection and wafer metal thin film thickness measurement.Applicationinadvancedindustrialfieldssuchasbatteryelectrodeinspectionandwafermetalthinfilmthicknessmeasurement.
Major MarketsMajorMarkets
--
Certifications/PatentsCertifications/Patents
Acquisition of ISO 9001, INNO-BIZ, and MAIN-BIZ certifications in 2011.AcquisitionofISO9001,INNO-BIZ,andMAIN-BIZcertificationsin2011.
Obtainment of CE certification for fluorescence analysis equipment in 2010.ObtainmentofCEcertificationforfluorescenceanalysisequipmentin2010.
Acquisition of XRD (30kV, 5mA) production approval in 2017.AcquisitionofXRD(30kV,5mA)productionapprovalin2017.
Designation as an advanced technology company in 2019.Designationasanadvancedtechnologycompanyin2019.
Key patent applications include an X-ray fluorescence analysis system and method for continuous print thickness measurement in 2021, a variable X-ray generator using X-ray focusing optics in 2020, and a non-contact thickness measurement device using fluorescence X-rays in 2012.KeypatentapplicationsincludeanX-rayfluorescenceanalysissystemandmethodforcontinuousprintthicknessmeasurementin2021,avariableX-raygeneratorusingX-rayfocusingopticsin2020,andanon-contactthicknessmeasurementdeviceusingfluorescenceX-raysin2012.
Introduction
Location
109 Wonmanseong-ro, Deokjin-gu, Jeonju, Jeonbuk State, South Korea
클릭하여 위치 살펴보기
Information
109 Wonmanseong-ro, Deokjin-gu, Jeonju, Jeonbuk State, South Korea