HUTEM, The Republic of Korea - Komachine Supplier Profile and Product List

- HUTEM Co., Ltd. is a technology innovation company specializing in the development and manufacturing of semiconductor manufacturing process equipment and prefilled syringe automatic filling systems for the pharmaceutical and bio industries. The company possesses capabilities in producing semiconductor equipment such as wafer bonders, bonding aligners, and nanoimprint systems. Additionally, it supplies pharmaceutical automation equipment including prefilled syringe filling machines, vial filling lines, and ampoule filling lines. HUTEM aims to create maximum value based on human-centered technology, providing solutions that contribute to customer success.HUTEM Co., Ltd. is a technology innovation company specializing in the development and manufacturing of semiconductor manufacturing process equipment and prefilled syringe automatic filling systems for the pharmaceutical and bio industries. The company possesses capabilities in producing semiconductor equipment such as wafer bonders, bonding aligners, and nanoimprint systems. Additionally, it supplies pharmaceutical automation equipment including prefilled syringe filling machines, vial filling lines, and ampoule filling lines. HUTEM aims to create maximum value based on human-centered technology, providing solutions that contribute to customer success.
- **Pharmaceutical and Bio Automation Filling Equipment**: Prefilled syringe filling machines (models HFS-200, HFS-300, HFS-4000, HFS-5000, HFS-6000) are capable of handling a wide range of drug viscosities, from low-viscosity vaccines to high-viscosity fillers. The HFS-300 model offers a capacity of 300 syringes per hour, a dosing volume of 1ml to 10ml, and applicability to vials and prefilled syringes. The HFS-6000 model is a 10-lane system with a capacity of 9000 syringes per hour. Prefilled syringe assembly machines (models HAS-4000, HAS-6000) automatically attach finger grips and plunger rods, with the development of the high-speed Grip & Rod Assembly Machine (HAS-6000). The company offers a diverse lineup of pharmaceutical packaging and filling lines, including vial filling lines (RVM-Series), ampoule filling lines (RAW-Series), foreign object inspection machines, labeling machines (A-Series), tray formers/inserters, blister packaging machines (600ppm), cartoners, and water treatment systems.**Pharmaceutical and Bio Automation Filling Equipment**: Prefilled syringe filling machines (models HFS-200, HFS-300, HFS-4000, HFS-5000, HFS-6000) are capable of handling a wide range of drug viscosities, from low-viscosity vaccines to high-viscosity fillers. The HFS-300 model offers a capacity of 300 syringes per hour, a dosing volume of 1ml to 10ml, and applicability to vials and prefilled syringes. The HFS-6000 model is a 10-lane system with a capacity of 9000 syringes per hour. Prefilled syringe assembly machines (models HAS-4000, HAS-6000) automatically attach finger grips and plunger rods, with the development of the high-speed Grip & Rod Assembly Machine (HAS-6000). The company offers a diverse lineup of pharmaceutical packaging and filling lines, including vial filling lines (RVM-Series), ampoule filling lines (RAW-Series), foreign object inspection machines, labeling machines (A-Series), tray formers/inserters, blister packaging machines (600ppm), cartoners, and water treatment systems.
- **Advanced Semiconductor and Display Process Equipment**: Wafer bonders (models MWB-8000, HBS-800S Series, HBS-800A, HBS-400A, HBS-800S, HBS-600M, HBS-400M, HBS-600) apply high-precision wafer bonding and aligning technologies. The HBS-800S Series supports wafer sizes up to 8 inches and applies Eutectic, Adhesive, Epoxy, and Polymer bonding methods to various wafer types such as Si, Sapphire, GaAs, and GaN. Nanoimprint equipment utilizes high-precision SCIL (Substrate Conformal Imprint Lithography) technology. The company develops and supplies core semiconductor process equipment, including laser lift-off and laser scribing systems. HUTEM provides customized equipment based on precise mechanical design, vacuum control, and plasma application technologies.**Advanced Semiconductor and Display Process Equipment**: Wafer bonders (models MWB-8000, HBS-800S Series, HBS-800A, HBS-400A, HBS-800S, HBS-600M, HBS-400M, HBS-600) apply high-precision wafer bonding and aligning technologies. The HBS-800S Series supports wafer sizes up to 8 inches and applies Eutectic, Adhesive, Epoxy, and Polymer bonding methods to various wafer types such as Si, Sapphire, GaAs, and GaN. Nanoimprint equipment utilizes high-precision SCIL (Substrate Conformal Imprint Lithography) technology. The company develops and supplies core semiconductor process equipment, including laser lift-off and laser scribing systems. HUTEM provides customized equipment based on precise mechanical design, vacuum control, and plasma application technologies.
- **Smart Factory Solutions**: The company offers smart factory solutions such as RMS (Recipe Management System), FMMS (Factory Monitoring & Management System), and UDI (Automatic Supply Reporting). These solutions support secure recipe management, production status monitoring, and enhanced production efficiency through data-driven insights.**Smart Factory Solutions**: The company offers smart factory solutions such as RMS (Recipe Management System), FMMS (Factory Monitoring & Management System), and UDI (Automatic Supply Reporting). These solutions support secure recipe management, production status monitoring, and enhanced production efficiency through data-driven insights.
- **Diversified Core Technologies**: HUTEM possesses core technologies in both prefilled syringe filling for the pharmaceutical bio industry and high-precision wafer bonding and nanoimprint for the semiconductor industry. The company has secured unique competitiveness in wafer-level direct bonding technology and vacuum-based liquid filling technology.**Diversified Core Technologies**: HUTEM possesses core technologies in both prefilled syringe filling for the pharmaceutical bio industry and high-precision wafer bonding and nanoimprint for the semiconductor industry. The company has secured unique competitiveness in wafer-level direct bonding technology and vacuum-based liquid filling technology.
- **Versatile Liquid Handling Capability**: The prefilled syringe filling equipment demonstrates technical prowess in stably filling drug solutions of various viscosities, from low-viscosity vaccines to high-viscosity fillers. This capability positions the equipment as optimal for diverse biopharmaceutical product manufacturing.**Versatile Liquid Handling Capability**: The prefilled syringe filling equipment demonstrates technical prowess in stably filling drug solutions of various viscosities, from low-viscosity vaccines to high-viscosity fillers. This capability positions the equipment as optimal for diverse biopharmaceutical product manufacturing.
- **Customer-Tailored Solutions**: The company's ability to design and manufacture customized equipment based on specific customer process conditions, various wafer sizes (from 4-inch to 12-inch), and required specifications. Adherence to KGMP standards and a philosophy of prioritizing customer convenience in equipment manufacturing.**Customer-Tailored Solutions**: The company's ability to design and manufacture customized equipment based on specific customer process conditions, various wafer sizes (from 4-inch to 12-inch), and required specifications. Adherence to KGMP standards and a philosophy of prioritizing customer convenience in equipment manufacturing.
- **Smart Factory and Automation Capabilities**: Provision of smart factory solutions that optimize productivity and quality through automated precision production processes for filling and assembly systems. Real-time data monitoring and automatic quality control systems minimize defect rates and ensure efficient production processes.**Smart Factory and Automation Capabilities**: Provision of smart factory solutions that optimize productivity and quality through automated precision production processes for filling and assembly systems. Real-time data monitoring and automatic quality control systems minimize defect rates and ensure efficient production processes.
- **Extensive Patents and Certifications**: Ownership of patents for void-free filling methods for prefilled syringes, along with numerous patents registered and filed for wafer bonders and imprint devices. ISO 9001 certification and selection as a venture company, demonstrating excellence in technology and quality management systems.**Extensive Patents and Certifications**: Ownership of patents for void-free filling methods for prefilled syringes, along with numerous patents registered and filed for wafer bonders and imprint devices. ISO 9001 certification and selection as a venture company, demonstrating excellence in technology and quality management systems.
- **Global Market Penetration and References**: Recognition of its technology through equipment supply to major domestic filler manufacturers and successful entry into overseas markets such as UAE, Taiwan, and Russia. Actively pursuing expansion into international markets based on strong trust built in the domestic market.**Global Market Penetration and References**: Recognition of its technology through equipment supply to major domestic filler manufacturers and successful entry into overseas markets such as UAE, Taiwan, and Russia. Actively pursuing expansion into international markets based on strong trust built in the domestic market.
- Pharmaceutical IndustryPharmaceutical Industry
- Bio IndustryBio Industry
- Semiconductor IndustrySemiconductor Industry
- Display IndustryDisplay Industry
- Medical Device IndustryMedical Device Industry
- Cosmetic IndustryCosmetic Industry
- Advanced Electronic Component Manufacturing (e.g., LED, MEMS, CMOS Image Sensors (CIS))Advanced Electronic Component Manufacturing (e.g., LED, MEMS, CMOS Image Sensors (CIS))
- Smart Factory SolutionsSmart Factory Solutions
- South Korea, Taiwan, UAESouth Korea, Taiwan, UAE
- RussiaRussia
- Patent for void-free filling method for prefilled syringes.Patent for void-free filling method for prefilled syringes.
- Patent registration for wafer bonder and imprint device (2008).Patent registration for wafer bonder and imprint device (2008).
- Patent registration for transparent surface heater and its manufacturing method (2007).Patent registration for transparent surface heater and its manufacturing method (2007).
- Patent registration for wafer bonder using electromagnetic wave heating (2013).Patent registration for wafer bonder using electromagnetic wave heating (2013).
- Patent registration for wafer bonder and wafer bonding method using dual cooling (2013).Patent registration for wafer bonder and wafer bonding method using dual cooling (2013).
- Patent registration for wafer bonder, wafer bonding apparatus, and wafer bonding method using plasma activation treatment (2014).Patent registration for wafer bonder, wafer bonding apparatus, and wafer bonding method using plasma activation treatment (2014).
- Development of a dedicated filling volume monitoring system for prefilled syringe fillers and 3 related patent applications (2025).Development of a dedicated filling volume monitoring system for prefilled syringe fillers and 3 related patent applications (2025).
- Acquisition of ISO 9001 Quality Management System certification.Acquisition of ISO 9001 Quality Management System certification.
- Selected as a venture company.Selected as a venture company.
- Manufacturing of filling equipment compliant with KGMP standards.Manufacturing of filling equipment compliant with KGMP standards.