EUGENE TECHNOLOGY, The Republic of Korea - Komachine Supplier Profile and Product List

- Eugene Technology Co., Ltd. is a specialized manufacturer of semiconductor front-end equipment, uniquely positioned in Korea as the sole developer of single-type wafer process technology. The company possesses core technological capabilities in Low Pressure Chemical Vapor Deposition (LPCVD), plasma treatment, and Atomic Layer Deposition (ALD) equipment. Through flagship products like the Blue Jay system, it contributes to the production lines of leading global semiconductor device manufacturers. It is a solution provider enabling semiconductor technology evolution in the advanced nano-process era.Eugene Technology Co., Ltd. is a specialized manufacturer of semiconductor front-end equipment, uniquely positioned in Korea as the sole developer of single-type wafer process technology. The company possesses core technological capabilities in Low Pressure Chemical Vapor Deposition (LPCVD), plasma treatment, and Atomic Layer Deposition (ALD) equipment. Through flagship products like the Blue Jay system, it contributes to the production lines of leading global semiconductor device manufacturers. It is a solution provider enabling semiconductor technology evolution in the advanced nano-process era.
- Plasma Enhanced ALD System (Phoenix™): An ALD system utilizing plasma, aiming for high productivity through its 8-chamber configuration. The Harrier-M™ is a mini-batch ALD system for NAND, DRAM, and Logic devices, offering precision material engineering, excellent step coverage, high uniformity, low impurities, and enhanced throughput.Plasma Enhanced ALD System (Phoenix™): An ALD system utilizing plasma, aiming for high productivity through its 8-chamber configuration. The Harrier-M™ is a mini-batch ALD system for NAND, DRAM, and Logic devices, offering precision material engineering, excellent step coverage, high uniformity, low impurities, and enhanced throughput.
- Single Thermal LPCVD System (BlueJay™, BlueJay-e™): As Korea's sole developer and supplier of single-type LPCVD, these systems feature temperature uniformity control and tunable process gas flow. They provide excellent film thickness uniformity and repeatability, lower thermal budgets, and easy tool matching through a multi-chamber, single-wafer platform, capable of processes up to 800°C with high throughput. Experience in supplying 450mm Single Thermal LPCVD Systems and 300mm single LP-CVD equipment.Single Thermal LPCVD System (BlueJay™, BlueJay-e™): As Korea's sole developer and supplier of single-type LPCVD, these systems feature temperature uniformity control and tunable process gas flow. They provide excellent film thickness uniformity and repeatability, lower thermal budgets, and easy tool matching through a multi-chamber, single-wafer platform, capable of processes up to 800°C with high throughput. Experience in supplying 450mm Single Thermal LPCVD Systems and 300mm single LP-CVD equipment.
- Single Plasma Treatment System (Albatross™): Utilizes high-density and low-electron temperature plasma, featuring patented dual-rotated ICP plasma antenna technology and a quartz chamber for metal contamination-free processes, ensuring excellent film uniformity and a wide process range. Capable of high-temperature processes up to 600°C.Single Plasma Treatment System (Albatross™): Utilizes high-density and low-electron temperature plasma, featuring patented dual-rotated ICP plasma antenna technology and a quartz chamber for metal contamination-free processes, ensuring excellent film uniformity and a wide process range. Capable of high-temperature processes up to 600°C.
- Multi-Stack SEG(Selective Epitaxial Growth) System (Falcon™): Characterized by a multi-stack wafer architecture with independent gas distribution and wafer rotation, achieving high productivity and minimal pattern size effects. This system is applied in logic device SEG processes.Multi-Stack SEG(Selective Epitaxial Growth) System (Falcon™): Characterized by a multi-stack wafer architecture with independent gas distribution and wafer rotation, achieving high productivity and minimal pattern size effects. This system is applied in logic device SEG processes.
- Dry Cleaning System (Hawk™): A dry cleaning system for memory and logic devices, providing a perfectly clean Si surface for deep contact plug integration and supporting all Epi processes, including Si, SiGe, and III-V materials. It employs a single-wafer dry cleaning process with gas chemicals and the company's own dual-rotated spiral ICP antenna plasma source.Dry Cleaning System (Hawk™): A dry cleaning system for memory and logic devices, providing a perfectly clean Si surface for deep contact plug integration and supporting all Epi processes, including Si, SiGe, and III-V materials. It employs a single-wafer dry cleaning process with gas chemicals and the company's own dual-rotated spiral ICP antenna plasma source.
- Cyclic CVD / Mini Batch ALD System (Harrier-L™): The Harrier-L™ is a new product for batch thermal and plasma-enhanced ALD and LPCVD processes, offering outstanding mass productivity compared to established batch systems and excellent process solutions through high vacuum conductance design and high thermal control accuracy.Cyclic CVD / Mini Batch ALD System (Harrier-L™): The Harrier-L™ is a new product for batch thermal and plasma-enhanced ALD and LPCVD processes, offering outstanding mass productivity compared to established batch systems and excellent process solutions through high vacuum conductance design and high thermal control accuracy.
- Exclusive position as Korea's sole developer of single-type wafer process equipment in the semiconductor front-end equipment market.Exclusive position as Korea's sole developer of single-type wafer process equipment in the semiconductor front-end equipment market.
- Proven technological prowess with flagship products like the Blue Jay System, validated and utilized as core process equipment by leading global semiconductor device manufacturers.Proven technological prowess with flagship products like the Blue Jay System, validated and utilized as core process equipment by leading global semiconductor device manufacturers.
- Innovative R&D capabilities and continuous investment, leading and shaping technological trends. Operation of a corporate research institute and overseas R&D organizations.Innovative R&D capabilities and continuous investment, leading and shaping technological trends. Operation of a corporate research institute and overseas R&D organizations.
- Capability to provide AI-based smart process solutions by integrating machine learning technology into equipment systems, aiming to improve DRAM and NAND flash process stability and equipment utilization. Implementation of a temperature prediction model with an error rate below 0.1 degrees in actual equipment.Capability to provide AI-based smart process solutions by integrating machine learning technology into equipment systems, aiming to improve DRAM and NAND flash process stability and equipment utilization. Implementation of a temperature prediction model with an error rate below 0.1 degrees in actual equipment.
- Strategic diversification of product portfolio, aiming to grow from a Nitride Solution Provider to a Total Solution Provider in the Single Wafer Deposition field. Dedicated R&D efforts towards becoming a Diffusion Solution Provider.Strategic diversification of product portfolio, aiming to grow from a Nitride Solution Provider to a Total Solution Provider in the Single Wafer Deposition field. Dedicated R&D efforts towards becoming a Diffusion Solution Provider.
- Ambitious goal of becoming one of the top 10 global semiconductor equipment companies by 2026 through proactive overseas market expansion.Ambitious goal of becoming one of the top 10 global semiconductor equipment companies by 2026 through proactive overseas market expansion.
- Semiconductor front-end equipment industrySemiconductor front-end equipment industry
- Memory semiconductor (DRAM, NAND) manufacturing industryMemory semiconductor (DRAM, NAND) manufacturing industry
- Logic device (LSI) manufacturing industryLogic device (LSI) manufacturing industry
- System LSI sectorSystem LSI sector
- South Korea, TaiwanSouth Korea, Taiwan
- United States (operation of R&D organization through subsidiary Eugenus Inc.)United States (operation of R&D organization through subsidiary Eugenus Inc.)
- Application of patented dual-rotated ICP plasma antenna technology in the Albatross™ system.Application of patented dual-rotated ICP plasma antenna technology in the Albatross™ system.
- Application of self-developed dual-rotated spiral ICP antenna plasma source in the Hawk™ system.Application of self-developed dual-rotated spiral ICP antenna plasma source in the Hawk™ system.
- Continuous investment in R&D, industry-academia cooperation, and joint development with device manufacturers since the establishment of the corporate research institute in January 2001. Operation of R&D organizations overseas (USA) for product development and technical research activities.Continuous investment in R&D, industry-academia cooperation, and joint development with device manufacturers since the establishment of the corporate research institute in January 2001. Operation of R&D organizations overseas (USA) for product development and technical research activities.
- Awarding of the Ungbi Medal of the Order of Science and Technology Merit to CEO Eom Pyeong-yong in 2017.Awarding of the Ungbi Medal of the Order of Science and Technology Merit to CEO Eom Pyeong-yong in 2017.