A company that successfully localized silver-coated copper powder, a core advanced basic material for electrical and electronic components, for the first time in Korea. A specialized enterprise in the development and production of conductive powders for solving electromagnetic interference (EMI) and heat generation problems. A provider of various functional composite powder and material solutions.Acompanythatsuccessfullylocalizedsilver-coatedcopperpowder,acoreadvancedbasicmaterialforelectricalandelectroniccomponents,forthefirsttimeinKorea.Aspecializedenterpriseinthedevelopmentandproductionofconductivepowdersforsolvingelectromagneticinterference(EMI)andheatgenerationproblems.Aproviderofvariousfunctionalcompositepowderandmaterialsolutions.
Key Products/TechnologiesKeyProducts/Technologies
Silver Coated Copper (SCC): A conductive powder combining excellent electrical conductivity and chemical stability. Available in various forms such as Dendrite, Granule, and Flake, with silver coating content adjustable from 5% to 30% according to customer requirements. Utilized in advanced technology applications including conductive pastes, adhesives, photovoltaics, printed circuit boards, and semiconductor device manufacturing. Diverse applications include EMI shielding paints, conductive tapes, conductive fillers, and Low Temp Sintering Bond.SilverCoatedCopper(SCC):Aconductivepowdercombiningexcellentelectricalconductivityandchemicalstability.AvailableinvariousformssuchasDendrite,Granule,andFlake,withsilvercoatingcontentadjustablefrom5%to30%accordingtocustomerrequirements.Utilizedinadvancedtechnologyapplicationsincludingconductivepastes,adhesives,photovoltaics,printedcircuitboards,andsemiconductordevicemanufacturing.DiverseapplicationsincludeEMIshieldingpaints,conductivetapes,conductivefillers,andLowTempSinteringBond.
Copper Powder: A material made from fine copper particles, characterized by a high surface area to volume ratio. A fundamental material used in the production of mechanical parts and materials across various industries. Notably, the development of Die-Attach Copper Paste (DACP) for power modules, achieving high-temperature durability and 20MPa shear strength.CopperPowder:Amaterialmadefromfinecopperparticles,characterizedbyahighsurfaceareatovolumeratio.Afundamentalmaterialusedintheproductionofmechanicalpartsandmaterialsacrossvariousindustries.Notably,thedevelopmentofDie-AttachCopperPaste(DACP)forpowermodules,achievinghigh-temperaturedurabilityand20MPashearstrength.
Silver Powder (Ag Powder): The ability to stably supply products that meet customer quality requirements, based on proprietary physical property control technology and a high degree of process automation.SilverPowder(AgPowder):Theabilitytostablysupplyproductsthatmeetcustomerqualityrequirements,basedonproprietaryphysicalpropertycontroltechnologyandahighdegreeofprocessautomation.
Core-Shell Powder: A technology for manufacturing powders with complex properties by coating various core particles with different ceramics or metals, overcoming the limitations of single materials.Core-ShellPowder:Atechnologyformanufacturingpowderswithcomplexpropertiesbycoatingvariouscoreparticleswithdifferentceramicsormetals,overcomingthelimitationsofsinglematerials.
Core AdvantagesCoreAdvantages
First Domestic Localization of Silver-Coated Copper Powder: A leading technological capability, having successfully localized silver-coated copper powder for advanced electrical and electronic components for the first time in Korea since its establishment in 2003.FirstDomesticLocalizationofSilver-CoatedCopperPowder:Aleadingtechnologicalcapability,havingsuccessfullylocalizedsilver-coatedcopperpowderforadvancedelectricalandelectroniccomponentsforthefirsttimeinKoreasinceitsestablishmentin2003.
Differentiated R&D Capabilities: A unique technological prowess developed over 19 years of continuous research and development, leading to conductive powders that address electromagnetic interference and heat generation issues. Efforts to expand the applicability of new material technologies across various industrial sectors.DifferentiatedR&DCapabilities:Auniquetechnologicalprowessdevelopedover19yearsofcontinuousresearchanddevelopment,leadingtoconductivepowdersthataddresselectromagneticinterferenceandheatgenerationissues.Effortstoexpandtheapplicabilityofnewmaterialtechnologiesacrossvariousindustrialsectors.
Customized Solution Provision: Flexibility in producing silver-coated products primarily according to customer requests, offering customized coating content (5%~30%) and product forms (Dendrite, Granule, Flake).CustomizedSolutionProvision:Flexibilityinproducingsilver-coatedproductsprimarilyaccordingtocustomerrequests,offeringcustomizedcoatingcontent(5%~30%)andproductforms(Dendrite,Granule,Flake).
Development of High-Temperature Durable Die Attach Copper Paste: Successful development of a low-cost copper (Cu)-based Die Attach Copper Paste (DACP) as an alternative to expensive silver (Ag) paste. Securing a competitive edge in the power conversion module market through 60-second ultra-high-speed bonding productivity, improved electrical and thermal conductivity, and enhanced heat dissipation.DevelopmentofHigh-TemperatureDurableDieAttachCopperPaste:Successfuldevelopmentofalow-costcopper(Cu)-basedDieAttachCopperPaste(DACP)asanalternativetoexpensivesilver(Ag)paste.Securingacompetitiveedgeinthepowerconversionmodulemarketthrough60-secondultra-high-speedbondingproductivity,improvedelectricalandthermalconductivity,andenhancedheatdissipation.
Proprietary Surface Treatment Technology: Possession of unique surface treatment technology for functional coated conductive materials.ProprietarySurfaceTreatmentTechnology:Possessionofuniquesurfacetreatmenttechnologyforfunctionalcoatedconductivematerials.
Target IndustrieTargetIndustrie
Electrical and Electronic Components Industry: Application in conductive pastes and adhesives, printed circuit boards (PCBs), and semiconductor device manufacturing.ElectricalandElectronicComponentsIndustry:Applicationinconductivepastesandadhesives,printedcircuitboards(PCBs),andsemiconductordevicemanufacturing.
Photovoltaic Industry: Utilization of silver-coated copper powder for maximizing the electrical efficiency of solar cells.PhotovoltaicIndustry:Utilizationofsilver-coatedcopperpowderformaximizingtheelectricalefficiencyofsolarcells.
Automotive and Power Conversion Module Industry: Application of high-temperature durable copper paste in the Die-Attach bonding process for EV/HEV (Electric Vehicle/Hybrid Electric Vehicle) power modules.AutomotiveandPowerConversionModuleIndustry:Applicationofhigh-temperaturedurablecopperpasteintheDie-AttachbondingprocessforEV/HEV(ElectricVehicle/HybridElectricVehicle)powermodules.
EMI/TIM Solution Industry: Provision of solutions for electromagnetic interference (EMI) shielding paints, conductive tapes, conductive fillers, and silicone elastomer fillers for modern electro-communication equipment's EMI and thermal issues.EMI/TIMSolutionIndustry:Provisionofsolutionsforelectromagneticinterference(EMI)shieldingpaints,conductivetapes,conductivefillers,andsiliconeelastomerfillersformodernelectro-communicationequipment'sEMIandthermalissues.
Advanced Technology Applications: Broad application across various advanced technology fields utilizing diverse composite powders and materials.AdvancedTechnologyApplications:Broadapplicationacrossvariousadvancedtechnologyfieldsutilizingdiversecompositepowdersandmaterials.
Major MarketsMajorMarkets
South KoreaSouthKorea
Certifications/PatentsCertifications/Patents
Presence of a 'Certification Status' page on the official website.Presenceofa'CertificationStatus'pageontheofficialwebsite.
Technological capability of successfully localizing silver-coated copper powder for the first time in Korea.Technologicalcapabilityofsuccessfullylocalizingsilver-coatedcopperpowderforthefirsttimeinKorea.
Differentiated conductive powder technology for solving electromagnetic interference and heat generation problems.Differentiatedconductivepowdertechnologyforsolvingelectromagneticinterferenceandheatgenerationproblems.
Securing proprietary technology for coating materials with silver.Securingproprietarytechnologyforcoatingmaterialswithsilver.
Die Attach Copper Paste (DACP) development technology.DieAttachCopperPaste(DACP)developmenttechnology.
Introduction
Location
165 Sunhwan-ro, Jungwon-gu, Seongnam-si, Gyeonggi-do, South Korea
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Information
165 Sunhwan-ro, Jungwon-gu, Seongnam-si, Gyeonggi-do, South Korea