EO TECHNICS, The Republic of Korea - Komachine Supplier Profile and Product List

- EO Technics is a comprehensive laser technology company specializing in the development and production of laser equipment for semiconductor, display, PCB, and macro manufacturing processes. The company holds a dominant global position in laser marking, offering a wide range of optimal laser solutions including cutting, drilling, patterning, grooving, and welding. It is a pioneering enterprise driving new paradigms in the IT industry through its ultra-fine precision processing technology.EO Technics is a comprehensive laser technology company specializing in the development and production of laser equipment for semiconductor, display, PCB, and macro manufacturing processes. The company holds a dominant global position in laser marking, offering a wide range of optimal laser solutions including cutting, drilling, patterning, grooving, and welding. It is a pioneering enterprise driving new paradigms in the IT industry through its ultra-fine precision processing technology.
- Semiconductor Laser Marking Equipment: Includes Strip marker (2-beam/4-beam), Strip & boat carrier marker, Tray marker (SC series, SVL series, SFL series, SLD series), Wafer marker (WM series), and ID card marker, among other models.Semiconductor Laser Marking Equipment: Includes Strip marker (2-beam/4-beam), Strip & boat carrier marker, Tray marker (SC series, SVL series, SFL series, SLD series), Wafer marker (WM series), and ID card marker, among other models.
- Laser Grooving & Dicing Equipment: Development of Grooving Equipment for enhanced chip yield by laser scribing low-k materials and metal wiring layers on wafers, and Dicing Equipment for direct laser cutting of thin wafers.Laser Grooving & Dicing Equipment: Development of Grooving Equipment for enhanced chip yield by laser scribing low-k materials and metal wiring layers on wafers, and Dicing Equipment for direct laser cutting of thin wafers.
- Laser Cutting Equipment: Package cutting equipment for various strips (substrates), featuring high accuracy through align vision and automatic scanner correction, and high productivity via flying processing methods.Laser Cutting Equipment: Package cutting equipment for various strips (substrates), featuring high accuracy through align vision and automatic scanner correction, and high productivity via flying processing methods.
- Laser Drilling Equipment: UV laser drilling equipment (models 4000U, 4200U) applicable to various materials like PCBs, metals, and films, and package drilling equipment for Strip and Wafer type BGA, DSMBGA, PoP.Laser Drilling Equipment: UV laser drilling equipment (models 4000U, 4200U) applicable to various materials like PCBs, metals, and films, and package drilling equipment for Strip and Wafer type BGA, DSMBGA, PoP.
- Laser Annealing and Cleaning Equipment: Development and supply of annealing equipment to improve electrical characteristics of fine transistors during semiconductor thermal processing, and cleaning equipment.Laser Annealing and Cleaning Equipment: Development and supply of annealing equipment to improve electrical characteristics of fine transistors during semiconductor thermal processing, and cleaning equipment.
- Laser Source Technology: Possession of diverse laser source technologies including DDL, DPSS (FS, PS, NS), and Fiber Laser (EF-Series).Laser Source Technology: Possession of diverse laser source technologies including DDL, DPSS (FS, PS, NS), and Fiber Laser (EF-Series).
- Precision Optical Design and Scanner Control Technology: Essential precision optical design and scanner control technologies for laser application equipment, enhancing the accuracy of laser markers.Precision Optical Design and Scanner Control Technology: Essential precision optical design and scanner control technologies for laser application equipment, enhancing the accuracy of laser markers.
- Vertical Integration System: Establishment of a vertically integrated system enabling direct design of all laser processing equipment manufacturing processes, from laser diodes to optics and systems.Vertical Integration System: Establishment of a vertically integrated system enabling direct design of all laser processing equipment manufacturing processes, from laser diodes to optics and systems.
- Global Leader in Laser Marking: Holding approximately 90% of the domestic market share and over 50% of the global market share in semiconductor laser marking, demonstrating world-leading technological prowess. Achieved 80% global market share in wafer marking equipment.Global Leader in Laser Marking: Holding approximately 90% of the domestic market share and over 50% of the global market share in semiconductor laser marking, demonstrating world-leading technological prowess. Achieved 80% global market share in wafer marking equipment.
- Comprehensive Laser Application Solutions: Providing optimal laser solutions across semiconductor, display, PCB, and macro processes, including marking, cutting, drilling, patterning, grooving, welding, annealing, and cleaning.Comprehensive Laser Application Solutions: Providing optimal laser solutions across semiconductor, display, PCB, and macro processes, including marking, cutting, drilling, patterning, grooving, welding, annealing, and cleaning.
- Ultra-fine Precision Processing Technology: Possession of unique laser processing technology capable of ultra-fine precision processing, which is impossible with traditional methods. This capability is crucial for high-integration semiconductor manufacturing and next-generation display processes.Ultra-fine Precision Processing Technology: Possession of unique laser processing technology capable of ultra-fine precision processing, which is impossible with traditional methods. This capability is crucial for high-integration semiconductor manufacturing and next-generation display processes.
- Eco-friendly and Efficient Technology: Offering environmentally friendly and efficient laser technology that eliminates chemical use, minimizes material deformation through non-contact processing, and achieves high-speed processing.Eco-friendly and Efficient Technology: Offering environmentally friendly and efficient laser technology that eliminates chemical use, minimizes material deformation through non-contact processing, and achieves high-speed processing.
- Strong R&D and Patent Portfolio: Establishment of a robust intellectual property portfolio with a total of 773 patents. Continuous investment in R&D and participation in national R&D projects demonstrate strong innovation capabilities.Strong R&D and Patent Portfolio: Establishment of a robust intellectual property portfolio with a total of 773 patents. Continuous investment in R&D and participation in national R&D projects demonstrate strong innovation capabilities.
- Solid Pipeline with Global Clients: Securing major domestic clients such as Samsung Electronics, SK Hynix, and LG Display, along with leading international semiconductor and display companies like ASE, BOE, and SPIL.Solid Pipeline with Global Clients: Securing major domestic clients such as Samsung Electronics, SK Hynix, and LG Display, along with leading international semiconductor and display companies like ASE, BOE, and SPIL.
- Semiconductor Industry: All aspects of semiconductor manufacturing processes, including laser marking, grooving, dicing, cutting, drilling, annealing, and cleaning.Semiconductor Industry: All aspects of semiconductor manufacturing processes, including laser marking, grooving, dicing, cutting, drilling, annealing, and cleaning.
- Display Industry: Various display panel manufacturing processes such as FPD, Flexible, Glass, TSP, PV, and Micro LED processes.Display Industry: Various display panel manufacturing processes such as FPD, Flexible, Glass, TSP, PV, and Micro LED processes.
- PCB Industry: Printed circuit board manufacturing processes, including PCB via hole drilling, marking, and cutting.PCB Industry: Printed circuit board manufacturing processes, including PCB via hole drilling, marking, and cutting.
- Macro Manufacturing Processes: Diverse industrial applications such as automotive and machine parts industries, involving cutting, welding, soldering, bonding, and marking processes.Macro Manufacturing Processes: Diverse industrial applications such as automotive and machine parts industries, involving cutting, welding, soldering, bonding, and marking processes.
- ID Card Manufacturing: Application of ID card marking equipment [database].ID Card Manufacturing: Application of ID card marking equipment [database].
- South Korea, China (Suzhou plant), Taiwan (subsidiary), Vietnam (branch), Indonesia (branch)South Korea, China (Suzhou plant), Taiwan (subsidiary), Vietnam (branch), Indonesia (branch)
- Germany (Innovavent GmbH acquired)Germany (Innovavent GmbH acquired)
- Holds a total of 773 patents. Key patents include 'Adhesive removing device and method' (Patent no. 11478828), 'Automatic inspection device and method of laser processing equipment' (Patent no. 10770298), and 'Variable-pulse-width flat-top laser device and operating method therefor' (Patent no. 12370625, 12214442).Holds a total of 773 patents. Key patents include 'Adhesive removing device and method' (Patent no. 11478828), 'Automatic inspection device and method of laser processing equipment' (Patent no. 10770298), and 'Variable-pulse-width flat-top laser device and operating method therefor' (Patent no. 12370625, 12214442).
- Holds a joint patent with Samsung Electronics for a Laser Annealing System.Holds a joint patent with Samsung Electronics for a Laser Annealing System.
- ISO 9001 certification for Quality Management System.ISO 9001 certification for Quality Management System.
- ISO 14001 certification for Environmental Management System.ISO 14001 certification for Environmental Management System.
- OHSAS 18001 certification for Occupational Health and Safety Management System.OHSAS 18001 certification for Occupational Health and Safety Management System.
- CE Mark for European conformity.CE Mark for European conformity.
- Compliance with SEMI international standards for semiconductor and flat panel display equipment and materials.Compliance with SEMI international standards for semiconductor and flat panel display equipment and materials.
- NRTL (Nationally Recognized Testing Laboratory) safety standard certification in the US.NRTL (Nationally Recognized Testing Laboratory) safety standard certification in the US.
- NFPA79 standard certification for fire protection and safety equipment.NFPA79 standard certification for fire protection and safety equipment.
- Achieved CMMI Level 3, a software process capability assessment and improvement model.Achieved CMMI Level 3, a software process capability assessment and improvement model.
- Awarded the '70 Million Dollars Export Trophy' in 2010 and the '100 Million Dollar Export Trophy' in 2014.Awarded the '70 Million Dollars Export Trophy' in 2010 and the '100 Million Dollar Export Trophy' in 2014.
- Recognized with the 'Patent Management Excellence Award' (Commissioner of the Korean Intellectual Property Office Award) in 2012.Recognized with the 'Patent Management Excellence Award' (Commissioner of the Korean Intellectual Property Office Award) in 2012.
- Selected as a KOSDAQ Rising Star in 2018, 2021, and 2022.Selected as a KOSDAQ Rising Star in 2018, 2021, and 2022.
- Designated as a 'World-Class Product Manufacturer' by the Ministry of Commerce, Industry and Energy.Designated as a 'World-Class Product Manufacturer' by the Ministry of Commerce, Industry and Energy.