CN1, The Republic of Korea - Komachine Supplier Profile and Product List

- CN1 Co., Ltd. is a specialized manufacturer of semiconductor and high-tech equipment, providing Atomic Layer Deposition (ALD) technology-based equipment and coating solutions. The company possesses core capabilities focused on the successful localization of ALD equipment and continuous R&D for global market expansion.CN1 Co., Ltd. is a specialized manufacturer of semiconductor and high-tech equipment, providing Atomic Layer Deposition (ALD) technology-based equipment and coating solutions. The company possesses core capabilities focused on the successful localization of ALD equipment and continuous R&D for global market expansion.
- The main product line includes Atomic Layer Deposition (ALD) equipment, with various models such as Atomic-Classic, Atomic-Premium, Atomic-Shell, Atomic-Basic, and Atomic-Mega.The main product line includes Atomic Layer Deposition (ALD) equipment, with various models such as Atomic-Classic, Atomic-Premium, Atomic-Shell, Atomic-Basic, and Atomic-Mega.
- Atomic-Premium is a showerhead-type Plasma-Enhanced ALD (PE-ALD) system, featuring plasma processing and treatment, adjustable gap between showerhead and substrate, diverse gas delivery systems, completely separated source delivery, ALD/CVD mode process configuration, excellent thin film uniformity and quality, maximum process temperature of 500°C, four precursor canisters (standard), and support for 4-12 inch wafer substrate sizes.Atomic-Premium is a showerhead-type Plasma-Enhanced ALD (PE-ALD) system, featuring plasma processing and treatment, adjustable gap between showerhead and substrate, diverse gas delivery systems, completely separated source delivery, ALD/CVD mode process configuration, excellent thin film uniformity and quality, maximum process temperature of 500°C, four precursor canisters (standard), and support for 4-12 inch wafer substrate sizes.
- This equipment is utilized for depositing dielectric thin films (Al2O3, HfO2, ZrO2, TiO2, ZnO2, ZnS, GST, Laminate films, etc.), nitride films (AlN, TiN, TiAlN, TaN, etc.), and metal films (Ru, Co, Ti, Ni, etc.).This equipment is utilized for depositing dielectric thin films (Al2O3, HfO2, ZrO2, TiO2, ZnO2, ZnS, GST, Laminate films, etc.), nitride films (AlN, TiN, TiAlN, TaN, etc.), and metal films (Ru, Co, Ti, Ni, etc.).
- Atomic-Classic applies a traveling wave ALD system, capable of processing 4-12 inch wafers and 370x470mm glass substrates.Atomic-Classic applies a traveling wave ALD system, capable of processing 4-12 inch wafers and 370x470mm glass substrates.
- Atomic-Shell supports nano powder coating ALD processes, with customizable reactor volumes ranging from 100cc to 5L.Atomic-Shell supports nano powder coating ALD processes, with customizable reactor volumes ranging from 100cc to 5L.
- Atomic-Mega is a furnace-type reactor supporting thermal ALD processes at temperatures above 600°C, including a wafer boat that accommodates up to 100 substrates.Atomic-Mega is a furnace-type reactor supporting thermal ALD processes at temperatures above 600°C, including a wafer boat that accommodates up to 100 substrates.
- Coating Solution and Anneal System are also part of the key product offerings.Coating Solution and Anneal System are also part of the key product offerings.
- Canisters for liquid chemicals used in ALD and CVD related processes in the semiconductor industry are supplied in various types, featuring volumes from 1 to 200 liters, EP-treated 316L stainless steel bodies, maximum hydraulic pressure of 300kPa, and a leak rate under 2.0×10-9 mbar·l/sec.Canisters for liquid chemicals used in ALD and CVD related processes in the semiconductor industry are supplied in various types, featuring volumes from 1 to 200 liters, EP-treated 316L stainless steel bodies, maximum hydraulic pressure of 300kPa, and a leak rate under 2.0×10-9 mbar·l/sec.
- Core technologies include Atomic Layer Deposition (ALD) technology, plasma process technology, and proprietary ALD equipment design technology.Core technologies include Atomic Layer Deposition (ALD) technology, plasma process technology, and proprietary ALD equipment design technology.
- Securing proprietary technology through the successful localization of ALD equipment, which was highly dependent on foreign sources, and over 20 years of R&D expertise.Securing proprietary technology through the successful localization of ALD equipment, which was highly dependent on foreign sources, and over 20 years of R&D expertise.
- Customized equipment development capabilities, offering flexible structures and adaptable process condition settings, including customization technologies for optimizing vacuum levels and gas treatment according to customer requirements.Customized equipment development capabilities, offering flexible structures and adaptable process condition settings, including customization technologies for optimizing vacuum levels and gas treatment according to customer requirements.
- Support for various ALD methods such as Thermal ALD, Plasma ALD, and atmospheric pressure ALD, enabling broad application in diverse fields.Support for various ALD methods such as Thermal ALD, Plasma ALD, and atmospheric pressure ALD, enabling broad application in diverse fields.
- Provision of rapid after-sales service through a dedicated customer service team, with a system for on-site problem resolution within 24 hours in case of serious issues.Provision of rapid after-sales service through a dedicated customer service team, with a system for on-site problem resolution within 24 hours in case of serious issues.
- A unique position in the R&D market, supplying R&D ALD equipment to research institutes of leading global semiconductor equipment companies such as Applied Materials, ASM, Kokusai, Merck, and Air Liquide.A unique position in the R&D market, supplying R&D ALD equipment to research institutes of leading global semiconductor equipment companies such as Applied Materials, ASM, Kokusai, Merck, and Air Liquide.
- Strengthening after-sales support capabilities and securing a stable equipment supply chain through the localization of key components.Strengthening after-sales support capabilities and securing a stable equipment supply chain through the localization of key components.
- Continuous R&D investment, allocating 10% of annual sales to technology development, thereby expanding its technology portfolio and securing future growth engines.Continuous R&D investment, allocating 10% of annual sales to technology development, thereby expanding its technology portfolio and securing future growth engines.
- Ability to build stable systems through patented technology that prevents internal parasitic plasma in plasma application processes.Ability to build stable systems through patented technology that prevents internal parasitic plasma in plasma application processes.
- Semiconductor Industry: Front-end processes, deposition of MTJ Capping Layers, insulating films, and diffusion barrier films for next-generation memory devices like PIM semiconductors and MRAM, formation processes for capacitors and transistors, and insulating and protective film formation for ultra-fine circuit processes.Semiconductor Industry: Front-end processes, deposition of MTJ Capping Layers, insulating films, and diffusion barrier films for next-generation memory devices like PIM semiconductors and MRAM, formation processes for capacitors and transistors, and insulating and protective film formation for ultra-fine circuit processes.
- Display Industry: OLED encapsulation processes, micro OLEDs, and thin film formation for flat panel displays.Display Industry: OLED encapsulation processes, micro OLEDs, and thin film formation for flat panel displays.
- Secondary Battery Industry: ALD coating of raw materials such as anode and cathode materials to improve battery safety, efficiency, and extend lifespan.Secondary Battery Industry: ALD coating of raw materials such as anode and cathode materials to improve battery safety, efficiency, and extend lifespan.
- Solar Energy Industry: Passivation processes.Solar Energy Industry: Passivation processes.
- Bio Industry: Surface coating for implants.Bio Industry: Surface coating for implants.
- Energy Industry: SOFC (Solid Oxide Fuel Cells) and catalyst fields.Energy Industry: SOFC (Solid Oxide Fuel Cells) and catalyst fields.
- Precision components and advanced industries in general.Precision components and advanced industries in general.
- South Korea (over 50% domestic market share), China, Japan, Taiwan, Singapore, IndiaSouth Korea (over 50% domestic market share), China, Japan, Taiwan, Singapore, India
- Europe (including France, Germany)Europe (including France, Germany)
- United StatesUnited States
- Possession of multiple core patents related to ALD equipment.Possession of multiple core patents related to ALD equipment.
- Specifically, holding patented technology to prevent internal parasitic plasma in plasma application processes.Specifically, holding patented technology to prevent internal parasitic plasma in plasma application processes.
- Acquisition of European CE certification, demonstrating the integrity of its equipment in the global market.Acquisition of European CE certification, demonstrating the integrity of its equipment in the global market.
- Securing differentiated competitive advantage in relevant fields based on proprietary core technologies.Securing differentiated competitive advantage in relevant fields based on proprietary core technologies.