APTC, The Republic of Korea - Komachine Supplier Profile and Product List

- A South Korean company manufacturing dry etch equipment and plasma-based systems for semiconductor front-end processes, which officially changed its name to VM Inc. in March 2024, actively pursuing advanced semiconductor process technology development and market expansionA South Korean company manufacturing dry etch equipment and plasma-based systems for semiconductor front-end processes, which officially changed its name to VM Inc. in March 2024, actively pursuing advanced semiconductor process technology development and market expansion
- Dry Etch System: Possessing Poly Etcher models for 300mm wafers such as Leo NK I, Leo NK I-C, Leo WH, Leo WS, and Leo WSE. Holding Metal Etcher models for 300mm wafers, including Selex 200 & 300. Developing and aiming for mass production of 300mm Oxide Etcher models like Selex 300 and TIGRIS.Dry Etch System: Possessing Poly Etcher models for 300mm wafers such as Leo NK I, Leo NK I-C, Leo WH, Leo WS, and Leo WSE. Holding Metal Etcher models for 300mm wafers, including Selex 200 & 300. Developing and aiming for mass production of 300mm Oxide Etcher models like Selex 300 and TIGRIS.
- Plasma Doping System: Featuring the APIS 300 model, a next-generation ion implanter, applying technology to uniformly implant ionized dopant gas into wafers within a vacuum chamber.Plasma Doping System: Featuring the APIS 300 model, a next-generation ion implanter, applying technology to uniformly implant ionized dopant gas into wafers within a vacuum chamber.
- A diverse portfolio of plasma-based semiconductor processing equipment, including LED Etcher, TSV Etcher, and Plasma Sawing System.A diverse portfolio of plasma-based semiconductor processing equipment, including LED Etcher, TSV Etcher, and Plasma Sawing System.
- Core technology involves a proprietary Dual ACP (Adaptive Coupled Plasma) plasma source, combining the advantages of Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP). This technology serves as the foundational technology for 300mm wafer dry etch equipment, offering precise control for sub-20nm processes.Core technology involves a proprietary Dual ACP (Adaptive Coupled Plasma) plasma source, combining the advantages of Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP). This technology serves as the foundational technology for 300mm wafer dry etch equipment, offering precise control for sub-20nm processes.
- Development of advanced etching equipment technologies, including upgrading Radio Frequency Power Supply (RFS) specifications from 3kW to 6kW and modifying RF multi-level pulsing to 4 or more levels for 3rd generation etchers. Enhanced Turbo Molecular Pump (TMP) capacity from 3300L to 4400L for improved chamber cleanliness and productivity.Development of advanced etching equipment technologies, including upgrading Radio Frequency Power Supply (RFS) specifications from 3kW to 6kW and modifying RF multi-level pulsing to 4 or more levels for 3rd generation etchers. Enhanced Turbo Molecular Pump (TMP) capacity from 3300L to 4400L for improved chamber cleanliness and productivity.
- Capability in developing various plasma-based semiconductor process equipment technologies, such as Chemical Vapor Deposition (CVD) equipment, Atomic Layer Deposition (ALD) equipment, and Atomic Layer Etching (ALE) equipment.Capability in developing various plasma-based semiconductor process equipment technologies, such as Chemical Vapor Deposition (CVD) equipment, Atomic Layer Deposition (ALD) equipment, and Atomic Layer Etching (ALE) equipment.
- Proprietary Plasma Source Technology: Self-developed Dual ACP plasma source technology, combining inductive and capacitive coupling, applied to 300mm wafer dry etch systems, ensuring competitive advantages in performance and cost over foreign systems.Proprietary Plasma Source Technology: Self-developed Dual ACP plasma source technology, combining inductive and capacitive coupling, applied to 300mm wafer dry etch systems, ensuring competitive advantages in performance and cost over foreign systems.
- Leading Domestic Market Position as the Sole Etch Equipment Listed Company: As the only domestic supplier of poly etching equipment in Korea, the company has accumulated technological innovation and mass production experience through a long-term partnership with SK Hynix.Leading Domestic Market Position as the Sole Etch Equipment Listed Company: As the only domestic supplier of poly etching equipment in Korea, the company has accumulated technological innovation and mass production experience through a long-term partnership with SK Hynix.
- Advanced Process Capability: Beyond mid-to-low-end 30nm DRAM production, the company possesses the capability to supply high-precision etch equipment essential for SK Hynix's 21nm DRAM production and High Bandwidth Memory (HBM) manufacturing processes.Advanced Process Capability: Beyond mid-to-low-end 30nm DRAM production, the company possesses the capability to supply high-precision etch equipment essential for SK Hynix's 21nm DRAM production and High Bandwidth Memory (HBM) manufacturing processes.
- Continuous R&D and Product Portfolio Expansion: Completion of 3rd generation etch equipment (Leo WS, WSE) development with mass production validation targets, and diversification of product lineup through Oxide Etcher (TIGRIS) development. Active investment in next-generation technologies like Atomic Layer Etching (ALE) equipment.Continuous R&D and Product Portfolio Expansion: Completion of 3rd generation etch equipment (Leo WS, WSE) development with mass production validation targets, and diversification of product lineup through Oxide Etcher (TIGRIS) development. Active investment in next-generation technologies like Atomic Layer Etching (ALE) equipment.
- Strong Partnership with Major Clients: Securing stable revenue streams and anticipating benefits from client's new investments through numerous large-scale equipment supply contracts with SK Hynix.Strong Partnership with Major Clients: Securing stable revenue streams and anticipating benefits from client's new investments through numerous large-scale equipment supply contracts with SK Hynix.
- Global Market Entry and Expansion Strategy: Establishment of overseas subsidiaries in the US and China, laying the foundation for strengthening its position in the global semiconductor equipment market and expanding its international client base.Global Market Entry and Expansion Strategy: Establishment of overseas subsidiaries in the US and China, laying the foundation for strengthening its position in the global semiconductor equipment market and expanding its international client base.
- Semiconductor Manufacturing Industry: Supplying core etch process equipment for memory semiconductors (DRAM, NAND Flash) and system semiconductor manufacturing processes.Semiconductor Manufacturing Industry: Supplying core etch process equipment for memory semiconductors (DRAM, NAND Flash) and system semiconductor manufacturing processes.
- High Bandwidth Memory (HBM) Manufacturing Industry: Providing etch equipment crucial for the multi-layer stacking structure required in HBM production.High Bandwidth Memory (HBM) Manufacturing Industry: Providing etch equipment crucial for the multi-layer stacking structure required in HBM production.
- LED Manufacturing Industry: Supplying LED etching equipment.LED Manufacturing Industry: Supplying LED etching equipment.
- South Korea, ChinaSouth Korea, China
- United States (subsidiary APTC AMERICA CORP. established)United States (subsidiary APTC AMERICA CORP. established)
- Recipient of the IR52 Jang Young-sil Award in 2006.Recipient of the IR52 Jang Young-sil Award in 2006.
- Selected as a Hynix (SK Hynix) Partner Company in 2008.Selected as a Hynix (SK Hynix) Partner Company in 2008.
- Designated as the first SK Hynix Technology Innovation Company.Designated as the first SK Hynix Technology Innovation Company.
- Holding numerous patents, including 56 domestic and 26 international patents. Key patents encompass plasma etching systems, particle trap devices for pressure measurement error prevention, electrostatic chucks with multiple heating zones, plasma source coils and control methods, and atomic layer etching equipment and methods.Holding numerous patents, including 56 domestic and 26 international patents. Key patents encompass plasma etching systems, particle trap devices for pressure measurement error prevention, electrostatic chucks with multiple heating zones, plasma source coils and control methods, and atomic layer etching equipment and methods.