AP-Tech Co., Ltd. is a semiconductor equipment specialist established in 2005, a manufacturer of automated equipment for various IT industry sectors including WLP, CSP, COG, and camera modules. The company's main products include precise Pick & Place Systems, Fiber Laser Marking Systems, Flip Chip Bonding Systems, and Reel Packing Systems. AP-Tech aims to be a global leader through advanced technology and continuous R&D, providing essential automation solutions for advanced IT product manufacturing lines such as semiconductors, displays, and camera modules.AP-TechCo.,Ltd.isasemiconductorequipmentspecialistestablishedin2005,amanufacturerofautomatedequipmentforvariousITindustrysectorsincludingWLP,CSP,COG,andcameramodules.Thecompany'smainproductsincludeprecisePick&PlaceSystems,FiberLaserMarkingSystems,FlipChipBondingSystems,andReelPackingSystems.AP-TechaimstobeagloballeaderthroughadvancedtechnologyandcontinuousR&D,providingessentialautomationsolutionsforadvancedITproductmanufacturinglinessuchassemiconductors,displays,andcameramodules.
Key Products/TechnologiesKeyProducts/Technologies
Pick & Place System (APP-L10, PP-R20, PP-160) for precise transfer and placement of semiconductor and camera module components in automated processes.Pick&PlaceSystem(APP-L10,PP-R20,PP-160)forprecisetransferandplacementofsemiconductorandcameramodulecomponentsinautomatedprocesses.
Fiber Laser Marking System (LS-10A) utilizing laser technology for precise marking on various materials.FiberLaserMarkingSystem(LS-10A)utilizinglasertechnologyforprecisemarkingonvariousmaterials.
Flip Chip Bonding System (FCB-1000, FCB-120L, FCB-80) as core equipment for the semiconductor flip-chip bonding process.FlipChipBondingSystem(FCB-1000,FCB-120L,FCB-80)ascoreequipmentforthesemiconductorflip-chipbondingprocess.
Reel Packing System and Tape & Reel Packing System (PTR-R20, PTR-D20, PTR-2000, PTR-1000) for automated packaging solutions of semiconductor and electronic components.ReelPackingSystemandTape&ReelPackingSystem(PTR-R20,PTR-D20,PTR-2000,PTR-1000)forautomatedpackagingsolutionsofsemiconductorandelectroniccomponents.
Production capabilities for products related to cutting-edge camera module technologies, including OIS modules and TOF modules.Productioncapabilitiesforproductsrelatedtocutting-edgecameramoduletechnologies,includingOISmodulesandTOFmodules.
Provision of various customized solutions for building factory automation systems across the entire IT industry.ProvisionofvariouscustomizedsolutionsforbuildingfactoryautomationsystemsacrosstheentireITindustry.
Core AdvantagesCoreAdvantages
A management philosophy prioritizing the highest quality products and customer satisfaction.Amanagementphilosophyprioritizingthehighestqualityproductsandcustomersatisfaction.
Continuous research and development for advanced technological processing and securing high-source technology.Continuousresearchanddevelopmentforadvancedtechnologicalprocessingandsecuringhigh-sourcetechnology.
Capability to implement 'Any Possible Technology' across all industrial fields, reflecting its company motto.Capabilitytoimplement'AnyPossibleTechnology'acrossallindustrialfields,reflectingitscompanymotto.
A broad product portfolio covering diverse IT industry sectors such as semiconductors, LCD, OLED, LED, and camera modules.AbroadproductportfoliocoveringdiverseITindustrysectorssuchassemiconductors,LCD,OLED,LED,andcameramodules.
Ability to achieve a 0% product return rate through an international standard quality management system.Abilitytoachievea0%productreturnratethroughaninternationalstandardqualitymanagementsystem.
Over 20 years of accumulated expertise in manufacturing automation equipment since its establishment in 2005.Over20yearsofaccumulatedexpertiseinmanufacturingautomationequipmentsinceitsestablishmentin2005.
A proactive approach as a prepared company, anticipating customer needs and proposing necessary products.Aproactiveapproachasapreparedcompany,anticipatingcustomerneedsandproposingnecessaryproducts.
Target IndustrieTargetIndustrie
The semiconductor industry as a core application sector for AP-Tech.ThesemiconductorindustryasacoreapplicationsectorforAP-Tech.
Supply of essential automation equipment for highly precise semiconductor manufacturing lines, including WLP, CSP, and COG processes.Supplyofessentialautomationequipmentforhighlyprecisesemiconductormanufacturinglines,includingWLP,CSP,andCOGprocesses.
Contribution to efficiency improvement in panel production and module assembly processes within the LCD, OLED, and LED display industries.ContributiontoefficiencyimprovementinpanelproductionandmoduleassemblyprocesseswithintheLCD,OLED,andLEDdisplayindustries.
Provision of automation solutions for manufacturing processes of critical smartphone and electronic components like camera modules, OIS modules, and TOF modules.Provisionofautomationsolutionsformanufacturingprocessesofcriticalsmartphoneandelectroniccomponentslikecameramodules,OISmodules,andTOFmodules.
These equipment play a crucial role in enhancing productivity and reducing defect rates.Theseequipmentplayacrucialroleinenhancingproductivityandreducingdefectrates.
Capability to provide customized solutions necessary for establishing factory automation systems across various IT industries.CapabilitytoprovidecustomizedsolutionsnecessaryforestablishingfactoryautomationsystemsacrossvariousITindustries.
Major MarketsMajorMarkets
China, VietnamChina,Vietnam
Certifications/PatentsCertifications/Patents
ISO 9001 Quality Management System certification (October 2006).ISO9001QualityManagementSystemcertification(October2006).
Certification as an Innovative Small and Medium-sized Enterprise (October 2008).CertificationasanInnovativeSmallandMedium-sizedEnterprise(October2008).
Continuous research and development capabilities for advanced technological processing.Continuousresearchanddevelopmentcapabilitiesforadvancedtechnologicalprocessing.
Presence of a Patent section on its official website.PresenceofaPatentsectiononitsofficialwebsite.