AM TECHNOLOGY, The Republic of Korea - Komachine Supplier Profile and Product List

- AM Technology Co., Ltd. is a global leader in the semiconductor and precision equipment sectors, founded in 1994 as Alpha Jeonggong. The company specializes in manufacturing fine grinding, dicing, lapping, polishing, slicing, and slot grinding machines. It has successfully localized ceramic and glass grinding and polishing equipment, supplying it to major domestic corporations and research institutions. The company possesses proprietary technologies, particularly in Grinding, Lapping, and Polishing equipment for semiconductor packaging processes and precision component machining.AM Technology Co., Ltd. is a global leader in the semiconductor and precision equipment sectors, founded in 1994 as Alpha Jeonggong. The company specializes in manufacturing fine grinding, dicing, lapping, polishing, slicing, and slot grinding machines. It has successfully localized ceramic and glass grinding and polishing equipment, supplying it to major domestic corporations and research institutions. The company possesses proprietary technologies, particularly in Grinding, Lapping, and Polishing equipment for semiconductor packaging processes and precision component machining.
- Lapping Machine (Double Side Process): Double-sided lapping equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.Lapping Machine (Double Side Process): Double-sided lapping equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.
- DMP Machine (Double Side Process): Double-sided DMP equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.DMP Machine (Double Side Process): Double-sided DMP equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.
- CMP Machine (Double Side Process): Double-sided CMP equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.CMP Machine (Double Side Process): Double-sided CMP equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.
- Single Side Process: Single-sided processing equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.Single Side Process: Single-sided processing equipment for precision machine components, smartphone cover glass, and semiconductor wafer processing.
- Fine Grinding Process: Fine grinding facilities for processing component materials in semiconductor packaging and LCD/LED industries.Fine Grinding Process: Fine grinding facilities for processing component materials in semiconductor packaging and LCD/LED industries.
- Dicing Machine: Dicing facilities for processing component materials in semiconductor packaging and LCD/LED industries, including models ADS-150/200, ADS-250.Dicing Machine: Dicing facilities for processing component materials in semiconductor packaging and LCD/LED industries, including models ADS-150/200, ADS-250.
- Back Grinding Machine: Back grinding facilities for processing component materials in semiconductor packaging and LCD/LED industries.Back Grinding Machine: Back grinding facilities for processing component materials in semiconductor packaging and LCD/LED industries.
- ETC: Various precision processing equipment such as slicing and slot grinding machines.ETC: Various precision processing equipment such as slicing and slot grinding machines.
- Proprietary Technology Acquisition: Securing unique technologies, including patent applications for electrolytic dressing devices and DICING SAWs, leading to increased import substitution effects and counter-offensive strategies in advanced markets.Proprietary Technology Acquisition: Securing unique technologies, including patent applications for electrolytic dressing devices and DICING SAWs, leading to increased import substitution effects and counter-offensive strategies in advanced markets.
- Localization Leadership: Expertise in localizing ceramic and glass processing equipment, supplying it to major domestic corporations and research institutions.Localization Leadership: Expertise in localizing ceramic and glass processing equipment, supplying it to major domestic corporations and research institutions.
- High-Performance, High-Precision Equipment Development: Continuous R&D leading to the release of high-performance, high-precision equipment with comparable accuracy and user convenience to advanced foreign products.High-Performance, High-Precision Equipment Development: Continuous R&D leading to the release of high-performance, high-precision equipment with comparable accuracy and user convenience to advanced foreign products.
- Customized Multi-functional Ultra-precision Automation Equipment Planning/Manufacturing: Capability to plan and produce customized equipment that meets specific customer needs.Customized Multi-functional Ultra-precision Automation Equipment Planning/Manufacturing: Capability to plan and produce customized equipment that meets specific customer needs.
- Core Technology in Optoelectronics and Semiconductor Industries: Since its establishment as Alpha Jeonggong in 1994, the company has maintained a competitive edge as a leading domestic enterprise in precision polishing and cutting, core technologies for the optoelectronics and semiconductor industries.Core Technology in Optoelectronics and Semiconductor Industries: Since its establishment as Alpha Jeonggong in 1994, the company has maintained a competitive edge as a leading domestic enterprise in precision polishing and cutting, core technologies for the optoelectronics and semiconductor industries.
- Operation of Corporate R&D Center: Continuous technological innovation and R&D capabilities through the establishment of a corporate research institute in 2000.Operation of Corporate R&D Center: Continuous technological innovation and R&D capabilities through the establishment of a corporate research institute in 2000.
- Semiconductor Industry: Semiconductor packaging processes, wafer processing, back grinding, dicing, etc..Semiconductor Industry: Semiconductor packaging processes, wafer processing, back grinding, dicing, etc..
- Precision Equipment Sector: Precision component machining, ultra-precision processing systems.Precision Equipment Sector: Precision component machining, ultra-precision processing systems.
- Display Industry: Processing of component materials for LCD/LED industries.Display Industry: Processing of component materials for LCD/LED industries.
- Optoelectronics Industry: Precision polishing and cutting in the optoelectronics industry.Optoelectronics Industry: Precision polishing and cutting in the optoelectronics industry.
- Ceramic and Glass Processing Industry: Supply of ceramic and glass grinding and polishing equipment.Ceramic and Glass Processing Industry: Supply of ceramic and glass grinding and polishing equipment.
- Japan, China (Beijing branch operation)Japan, China (Beijing branch operation)
- Multiple patent registrations.Multiple patent registrations.
- Quality Management System Certification (ISO 9001) acquisition.Quality Management System Certification (ISO 9001) acquisition.
- Environmental Management System Certification (ISO 14001) acquisition.Environmental Management System Certification (ISO 14001) acquisition.
- Corporate R&D Center accreditation.Corporate R&D Center accreditation.
- Innovation-Type Small and Medium Business (INNO-BIZ) certification.Innovation-Type Small and Medium Business (INNO-BIZ) certification.
- CE certification (Auto Dicing Saw, Double Side Lapping Machine).CE certification (Auto Dicing Saw, Double Side Lapping Machine).