Ace Tech Circuit, The Republic of Korea - Komachine Supplier Profile and Product List

- Ace Tech Circuit (ATC) is a specialized manufacturer of Printed Circuit Boards (PCBs), established in 1998 as Ace Tech and later incorporated as (주)에이티씨. The company is a recognized leader in semiconductor test boards and high-layer count PCBs, earning industry acclaim for its advanced technology and extensive development experience. ATC focuses on producing high-quality, cost-effective, and superior products, building strong customer trust. Its consistent growth in both domestic and export markets has solidified its position as a prominent mid-sized enterprise in the information and semiconductor PCB industries. The company's commitment to technological innovation and R&D investment, supported by skilled personnel, ensures global market competitiveness. ATC operates under corporate philosophies of open management, responsible management, and value-based management.Ace Tech Circuit (ATC) is a specialized manufacturer of Printed Circuit Boards (PCBs), established in 1998 as Ace Tech and later incorporated as (주)에이티씨. The company is a recognized leader in semiconductor test boards and high-layer count PCBs, earning industry acclaim for its advanced technology and extensive development experience. ATC focuses on producing high-quality, cost-effective, and superior products, building strong customer trust. Its consistent growth in both domestic and export markets has solidified its position as a prominent mid-sized enterprise in the information and semiconductor PCB industries. The company's commitment to technological innovation and R&D investment, supported by skilled personnel, ensures global market competitiveness. ATC operates under corporate philosophies of open management, responsible management, and value-based management.
- Hi-Fix Board: Essential component technology for providing precise testing environments.Hi-Fix Board: Essential component technology for providing precise testing environments.
- Load Board: Features 0.3Pitch fine pitch implementation, ultra-high layer count stacking technology of over 100 layers, Back Drill method for minimizing high-frequency signal loss, and high-temperature test stability through low Coefficient of Thermal Expansion (CTE) materials. This product is crucial for ensuring the yield and reliability of next-generation high-performance semiconductors, directly contributing to reduced development time and increased productivity for semiconductor manufacturers.Load Board: Features 0.3Pitch fine pitch implementation, ultra-high layer count stacking technology of over 100 layers, Back Drill method for minimizing high-frequency signal loss, and high-temperature test stability through low Coefficient of Thermal Expansion (CTE) materials. This product is crucial for ensuring the yield and reliability of next-generation high-performance semiconductors, directly contributing to reduced development time and increased productivity for semiconductor manufacturers.
- Probe Card: Maintains high flatness even in high-layer, large-area structures, incorporates precise hole processing technology for fine pitch probe arrays, and impedance control technology to prevent test signal distortion. It plays a critical role in early-stage defect chip screening during semiconductor production, leading to reduced post-processing costs and maximized overall production efficiency.Probe Card: Maintains high flatness even in high-layer, large-area structures, incorporates precise hole processing technology for fine pitch probe arrays, and impedance control technology to prevent test signal distortion. It plays a critical role in early-stage defect chip screening during semiconductor production, leading to reduced post-processing costs and maximized overall production efficiency.
- Burn In Board: Utilizes high-heat resistant materials capable of withstanding over 280℃, achieves a low CTE of less than 10ppm/℃, and ensures long-term reliability and durability in high-temperature environments. This board serves as a final gateway for guaranteeing the quality of semiconductors requiring extreme reliability in automotive, server, and aerospace applications.Burn In Board: Utilizes high-heat resistant materials capable of withstanding over 280℃, achieves a low CTE of less than 10ppm/℃, and ensures long-term reliability and durability in high-temperature environments. This board serves as a final gateway for guaranteeing the quality of semiconductors requiring extreme reliability in automotive, server, and aerospace applications.
- Build Up Board / Proto Type Board: Offers flexible technology for High Density Interconnect (HDI) PCBs and prototyping. ATC possesses commercial-scale HDI capabilities such as 2+2 and 3+n+3 stack-ups, with 4+n+4 stack-ups currently under development.Build Up Board / Proto Type Board: Offers flexible technology for High Density Interconnect (HDI) PCBs and prototyping. ATC possesses commercial-scale HDI capabilities such as 2+2 and 3+n+3 stack-ups, with 4+n+4 stack-ups currently under development.
- Ultra-High Layer and High-Density Circuit Technology: Capability for manufacturing PCBs with over 100 layers and implementing fine circuits below 30㎛.Ultra-High Layer and High-Density Circuit Technology: Capability for manufacturing PCBs with over 100 layers and implementing fine circuits below 30㎛.
- High-Speed Signal Transmission and Durability Technology: Expertise in minimizing signal loss during high-speed transmission and ensuring stable performance in extreme environments.High-Speed Signal Transmission and Durability Technology: Expertise in minimizing signal loss during high-speed transmission and ensuring stable performance in extreme environments.
- Securing differentiated competitive advantages based on unique core technologies. Continuous R&D investment and expansion of technology portfolios for market leadership.Securing differentiated competitive advantages based on unique core technologies. Continuous R&D investment and expansion of technology portfolios for market leadership.
- Strong technical completeness and commercialization capabilities compared to major competitors. Demonstrated expertise through patent portfolios and project execution history.Strong technical completeness and commercialization capabilities compared to major competitors. Demonstrated expertise through patent portfolios and project execution history.
- In-house execution of all manufacturing processes. This directly contributes to shorter lead times and reduced production costs.In-house execution of all manufacturing processes. This directly contributes to shorter lead times and reduced production costs.
- Thorough understanding and adherence to customer quality requirements. On-time delivery of error-free products and services, enhancing customer trust.Thorough understanding and adherence to customer quality requirements. On-time delivery of error-free products and services, enhancing customer trust.
- Continuous process improvement and new technology development through defect data analysis. This fosters a virtuous cycle leading to enhanced product quality and technological innovation.Continuous process improvement and new technology development through defect data analysis. This fosters a virtuous cycle leading to enhanced product quality and technological innovation.
- A leading player in the semiconductor test board market, holding an estimated 5-7% market share. Innovative technological capabilities in thermal management, high-density interconnects, and customized solutions.A leading player in the semiconductor test board market, holding an estimated 5-7% market share. Innovative technological capabilities in thermal management, high-density interconnects, and customized solutions.
- Semiconductor Industry: Testing processes for verifying the performance and reliability of next-generation high-performance semiconductor chips.Semiconductor Industry: Testing processes for verifying the performance and reliability of next-generation high-performance semiconductor chips.
- Automotive Industry: Semiconductor components for automotive electronics requiring extreme reliability.Automotive Industry: Semiconductor components for automotive electronics requiring extreme reliability.
- Server Industry: Supply of PCBs for network servers demanding high reliability.Server Industry: Supply of PCBs for network servers demanding high reliability.
- Telecommunications Industry: High-speed signal transmission and high-reliability applications such as 5G/6G communication equipment.Telecommunications Industry: High-speed signal transmission and high-reliability applications such as 5G/6G communication equipment.
- Aerospace and Defense Industry: High-durability PCBs ensuring stable performance even in extreme environments.Aerospace and Defense Industry: High-durability PCBs ensuring stable performance even in extreme environments.
- Industrial Automation: Various industrial applications requiring highly reliable electronic components.Industrial Automation: Various industrial applications requiring highly reliable electronic components.
- Malaysia, Philippines, Singapore, South Korea (main production and market hub), China, TaiwanMalaysia, Philippines, Singapore, South Korea (main production and market hub), China, Taiwan
- SpainSpain
- USA, CanadaUSA, Canada
- ISO 9001 Quality Management System CertificationISO 9001 Quality Management System Certification
- ISO 14001 Environmental Management System CertificationISO 14001 Environmental Management System Certification
- ISO 45001 Occupational Health and Safety Management System CertificationISO 45001 Occupational Health and Safety Management System Certification
- UL Certification (E225596)UL Certification (E225596)
- Accreditation of Corporate R&D InstituteAccreditation of Corporate R&D Institute
- Venture Company Registration and High-Tech Venture Company CertificationVenture Company Registration and High-Tech Venture Company Certification
- Selection as an Excellent Technology Company (Korea Technology Finance Corporation)Selection as an Excellent Technology Company (Korea Technology Finance Corporation)
- Selection as a Technology Innovative Small & Medium Enterprise (Inno-Biz)Selection as a Technology Innovative Small & Medium Enterprise (Inno-Biz)
- Awarded 'One Million Dollar Export Golden Tower'Awarded 'One Million Dollar Export Golden Tower'
- Awarded 'Best Venture Grand Gold Metal'Awarded 'Best Venture Grand Gold Metal'
- Selected as a Promising Small & Medium Enterprise by Gyeonggi ProvinceSelected as a Promising Small & Medium Enterprise by Gyeonggi Province
- Establishment of unique technological competitiveness in the global semiconductor equipment market through advanced technologies such as minimized high-frequency signal loss and application of high-heat resistant materials.Establishment of unique technological competitiveness in the global semiconductor equipment market through advanced technologies such as minimized high-frequency signal loss and application of high-heat resistant materials.